McDonald; William G.
Patent Applications and Registrations
Patent applications and USPTO patent grants for McDonald; William G..The latest application filed is for "capacitive pressure sensor in an overmolded package".
Company Profile
0.27.24
- McDonald; William G. - Payson AZ
- McDonald; William G. - Marietta GA
- McDonald; William G. - Scottsdale AZ
- McDonald, William G. - St. Louis MO
- McDonald; William G. - Bronx NY
Patent Activity
| Patent | Date |
|---|---|
| Capacitive pressure sensor in an overmolded package Grant 9,146,170 - Wen , et al. September 29, 2 | 2015-09-29 |
| Method of making a dual port pressure sensor Grant 9,021,689 - Hooper , et al. May 5, 2 | 2015-05-05 |
| Lead frame having a flag with in-plane and out-of-plane mold locking features Grant 8,742,555 - Wen , et al. June 3, 2 | 2014-06-03 |
| Method and apparatus for high pressure sensor device Grant 8,686,550 - McDonald , et al. April 1, 2 | 2014-04-01 |
| Capacitive Pressure Sensor In An Overmolded Package App 20140033814 - Wen; Jian ; et al. | 2014-02-06 |
| Method And Apparatus For High Pressure Sensor Device App 20130207207 - McDonald; William G. ; et al. | 2013-08-15 |
| Methods for fabricating sensor device package using a sealing structure Grant 8,476,087 - Hooper , et al. July 2, 2 | 2013-07-02 |
| Lead Frame Having A Flag With In-plane And Out-of-plane Mold Locking Features App 20130049181 - Wen; Jian ; et al. | 2013-02-28 |
| Sensor device with sealing structure Grant 8,384,168 - Hooper , et al. February 26, 2 | 2013-02-26 |
| Molded differential PRT pressure sensor Grant 8,359,927 - Hooper , et al. January 29, 2 | 2013-01-29 |
| Method Of Making A Dual Port Pressure Sensor App 20120304452 - HOOPER; STEPHEN R. ; et al. | 2012-12-06 |
| Dual Port Pressure Sensor App 20120304777 - HOOPER; STEPHEN R. ; et al. | 2012-12-06 |
| Dual port pressure sensor Grant 8,307,714 - Hooper , et al. November 13, 2 | 2012-11-13 |
| Methods For Fabricating Sensor Device Package Using A Sealing Structure App 20120270354 - Hooper; Stephen R. ; et al. | 2012-10-25 |
| Sensor Device With Sealing Structure App 20120266684 - Hooper; Stephen R. ; et al. | 2012-10-25 |
| Composite Roofing Boards And Methods For Installing A Composite Roofing Board App 20110173910 - Franklin; Kenneth ; et al. | 2011-07-21 |
| Exposed pad backside pressure sensor package Grant 7,900,521 - Hooper , et al. March 8, 2 | 2011-03-08 |
| Molded Differential PRT Pressure Sensor App 20110036174 - Hooper; Stephen R. ; et al. | 2011-02-17 |
| Exposed Pad Backside Pressure Sensor Package App 20100199777 - Hooper; Stephen R. ; et al. | 2010-08-12 |
| Methods for forming quad flat no-lead (QFN) packages Grant 7,713,781 - Wang , et al. May 11, 2 | 2010-05-11 |
| Quad flat no-lead (QFN) packages Grant 7,652,357 - Wang , et al. January 26, 2 | 2010-01-26 |
| Quad Flat No-lead (qfn) Packages App 20090152710 - Wang; James J. ; et al. | 2009-06-18 |
| Methods and apparatus for a Quad Flat No-Lead (QFN) package Grant 7,489,026 - Wang , et al. February 10, 2 | 2009-02-10 |
| Methods For Forming Quad Flat No-lead (qfn) Packages App 20090004775 - Wang; James J. ; et al. | 2009-01-01 |
| Method of using a differential pressure type flowmeter Grant 7,437,951 - McDonald , et al. October 21, 2 | 2008-10-21 |
| Methods and apparatus for a Quad Flat No-Lead (QFN) package App 20080099899 - Wang; James J. ; et al. | 2008-05-01 |
| Substrate contact for a capped MEMS and method of making the substrate contact at the wafer level Grant 7,316,965 - Hooper , et al. January 8, 2 | 2008-01-08 |
| Flowmeter And Method For The Making Thereof App 20070277623 - McDonald; William G. ; et al. | 2007-12-06 |
| Flowmeter and method for the making thereof Grant 7,261,003 - McDonald , et al. August 28, 2 | 2007-08-28 |
| Flowmeter And Method For The Making Thereof App 20070151366 - McDonald; William G. ; et al. | 2007-07-05 |
| Method of making a substrate contact for a capped MEMS at the package level App 20060286706 - Salian; Arvind S. ; et al. | 2006-12-21 |
| Substrate contact for a capped MEMS and method of making the substrate contact at the wafer level App 20060286707 - Hooper; Stephen R. ; et al. | 2006-12-21 |
| Methods and apparatus having wafer level chip scale package for sensing elements Grant 7,109,055 - McDonald , et al. September 19, 2 | 2006-09-19 |
| Methods And Apparatus Having Wafer Level Chip Scale Package For Sensing Elements App 20060160264 - McDonald; William G. ; et al. | 2006-07-20 |
| Method and structure for fabricating sensors with a sacrificial gel dome Grant 7,014,888 - McDonald , et al. March 21, 2 | 2006-03-21 |
| MitoNEET polypeptide from mitochondrial membranes, modulators thereof, and methods of using the same App 20050043361 - Colca, Jerry R. ; et al. | 2005-02-24 |
| Component having a filter Grant 6,769,319 - McDonald , et al. August 3, 2 | 2004-08-03 |
| Method and structure for fabricating sensors with a sacrificial gel dome App 20040118214 - McDonald, William G. ; et al. | 2004-06-24 |
| Semiconductor component and method of manufacturing same Grant 6,683,370 - McDonald , et al. January 27, 2 | 2004-01-27 |
| Component having a filter and method of manufacturing App 20030005782 - McDonald, William G. ; et al. | 2003-01-09 |
| Collapsible suitcase Grant 4,126,213 - McDonald November 21, 1 | 1978-11-21 |
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