McCormick; John P.
Patent Applications and Registrations
Patent applications and USPTO patent grants for McCormick; John P..The latest application filed is for "systems and methods for reducing dead volume in compressed-gas energy storage systems".
- McCormick; John P. - Norwich VT
- McCormick; John P. - Palo Alto CA
- McCormick; John P. - Santa Clara CA
Trademarks
| Patent | Date |
|---|---|
| Systems And Methods For Reducing Dead Volume In Compressed-gas Energy Storage Systems App 20140060027 - McBride; Troy O. ; et al. | 2014-03-06 |
| Multi chip module assembly Grant 7,041,516 - Rajagopalan , et al. May 9, 2 | 2006-05-09 |
| Via construction for structural support Grant 6,943,446 - McCormick , et al. September 13, 2 | 2005-09-13 |
| Method of forming electrolytic contact pads including layers of copper, nickel, and gold Grant 6,777,314 - Desai , et al. August 17, 2 | 2004-08-17 |
| Via construction App 20040089953 - McCormick, John P. ; et al. | 2004-05-13 |
| Multi chip module assembly App 20040072377 - Rajagopalan, Sarathy ; et al. | 2004-04-15 |
| Bonding pad interface Grant 6,706,622 - McCormick March 16, 2 | 2004-03-16 |
| Electrolytic contact pads App 20040023481 - Desai, Kishor ; et al. | 2004-02-05 |
| Chip-over-chip integrated circuit package Grant 6,558,978 - McCormick May 6, 2 | 2003-05-06 |
| Vertically integrated flip chip semiconductor package Grant 6,369,448 - McCormick April 9, 2 | 2002-04-09 |
| Dual-thickness solder mask in integrated circuit package Grant 6,294,840 - McCormick September 25, 2 | 2001-09-25 |
| Die clip assembly for semiconductor package Grant 6,166,434 - Desai , et al. December 26, 2 | 2000-12-26 |
| Integrated heat spreader/stiffener assembly and method of assembly for semiconductor package Grant 6,002,171 - Desai , et al. December 14, 1 | 1999-12-14 |
| Integrated heat spreader/stiffener with apertures for semiconductor package Grant 5,909,057 - McCormick , et al. June 1, 1 | 1999-06-01 |
| Electric Switch For A Radial Readout Gauge Grant 3,806,851 - McCormick April 23, 1 | 1974-04-23 |
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