McConnelee; Paul Alan

Patent Applications and Registrations

Patent applications and USPTO patent grants for McConnelee; Paul Alan.The latest application filed is for "ultra-thin embedded semiconductor device package and method of manufacturing thereof".

Company Profile

7.70.61

McConnelee; Paul Alan - Albany NY
McConnelee; Paul Alan - Schenectady NY US
McConnelee; Paul Alan - Schenecdady NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Power electronics package and method of manufacturing thereof Grant 11,177,204 - Gowda , et al. November 16, 2	2021-11-16
Ultra-thin Embedded Semiconductor Device Package And Method Of Manufacturing Thereof App 20200185349 - Gowda; Arun Virupaksha ; et al.	2020-06-11
Ultra-thin embedded semiconductor device package and method of manufacturing thereof Grant 10,607,957 - Gowda , et al.	2020-03-31
Power electronics package and method of manufacturing thereof Grant 10,453,786 - Gowda , et al. Oc	2019-10-22
Power Electronics Package And Method Of Manufacturing Thereof App 20190311981 - Gowda; Arun Virupaksha ; et al.	2019-10-10
Stress resistant micro-via structure for flexible circuits Grant 10,276,486 - Gorczyca , et al.	2019-04-30
Power overlay structure and method of making same Grant 10,269,688 - Gowda , et al.	2019-04-23
Power overlay structure and reconstituted semiconductor wafer having wirebonds Grant 10,204,881 - Gowda , et al. Feb	2019-02-12
Power overlay structure and method of making same Grant 10,186,477 - Gowda , et al. Ja	2019-01-22
Electronic packages with pre-defined via patterns and methods of making and using the same Grant 10,141,251 - Gowda , et al. Nov	2018-11-27
Electrical interconnect structure for an embedded electronics package Grant 10,141,203 - McConnelee , et al. Nov	2018-11-27
Electrical interconnect for an integrated circuit package and method of making same Grant 10,068,840 - McConnelee , et al. September 4, 2	2018-09-04
Electronics package with embedded through-connect and resistor structure and method of manufacturing thereof Grant 9,953,917 - Gowda , et al. April 24, 2	2018-04-24
Electronics package with embedded through-connect structure and method of manufacturing thereof Grant 9,953,913 - Gowda , et al. April 24, 2	2018-04-24
Electrical Interconnect Structure For An Embedded Electronics Package App 20180082857 - McConnelee; Paul Alan ; et al.	2018-03-22
Ultra-thin Embedded Semiconductor Device Package And Method Of Manufacturing Thereof App 20180033762 - Gowda; Arun Virupaksha ; et al.	2018-02-01
Electrical interconnect structure for an embedded electronics package Grant 9,847,236 - McConnelee , et al. December 19, 2	2017-12-19
Ultra-thin embedded semiconductor device package and method of manufacturing thereof Grant 9,806,051 - Gowda , et al. October 31, 2	2017-10-31
Electrical Interconnect For An Integrated Circuit Package And Method Of Making Same App 20170278782 - McConnelee; Paul Alan ; et al.	2017-09-28
Power Overlay Structure And Method Of Making Same App 20170263539 - Gowda; Arun Virupaksha ; et al.	2017-09-14
Electrical Interconnect Structure For An Embedded Electronics Package App 20170250093 - McConnelee; Paul Alan ; et al.	2017-08-31
Power Electronics Package And Method Of Manufacturing Thereof App 20170207160 - Gowda; Arun Virupaksha ; et al.	2017-07-20
Power Overlay Structure Having Wirebonds And Method Of Manufacturing Same App 20170200692 - Gowda; Arun Virupaksha ; et al.	2017-07-13
Power overlay structure and method of making same Grant 9,704,788 - Gowda , et al. July 11, 2	2017-07-11
Electrical interconnect for an integrated circuit package and method of making same Grant 9,679,837 - McConnelee , et al. June 13, 2	2017-06-13
Electrical interconnect structure for an embedded semiconductor device package and method of manufacturing thereof Grant 9,653,438 - McConnelee , et al. May 16, 2	2017-05-16
Power overlay structure having wirebonds and method of manufacturing same Grant 9,613,843 - Gowda , et al. April 4, 2	2017-04-04
Integrated circuit package and method of making same Grant 9,613,932 - McConnelee , et al. April 4, 2	2017-04-04
Power Overlay Structure And Method Of Making Same App 20170077014 - Gowda; Arun Virupaksha ; et al.	2017-03-16
Electrical interconnect for an integrated circuit package and method of making same Grant 9,570,376 - Gowda , et al. February 14, 2	2017-02-14
Electrical Interconnect For An Integrated Circuit Package And Method Of Making Same App 20160211208 - McConnelee; Paul Alan ; et al.	2016-07-21
Embedded semiconductor device package and method of manufacturing thereof Grant 9,391,027 - Chauhan , et al. July 12, 2	2016-07-12
Electronic Packages With Pre-defined Via Patterns And Methods Of Making And Using The Same App 20160183376 - Gowda; Arun Virupaksha ; et al.	2016-06-23
Power Overlay Structure Having Wirebonds And Method Of Manufacturing Same App 20160104666 - Gowda; Arun Virupaksha ; et al.	2016-04-14
Electrical interconnect for an integrated circuit package and method of making same Grant 9,299,647 - McConnelee , et al. March 29, 2	2016-03-29
Diffusion barrier for surface mount modules Grant 9,299,630 - Gowda , et al. March 29, 2	2016-03-29
Electrical Interconnect Structure For An Embedded Semiconductor Device Package And Method Of Manufacturing Thereof App 20160056136 - McConnelee; Paul Alan ; et al.	2016-02-25
Ultrathin buried die module and method of manufacturing thereof Grant 9,236,348 - McConnelee , et al. January 12, 2	2016-01-12
Embedded Semiconductor Device Package And Method Of Manufacturing Thereof App 20150380356 - Chauhan; Shakti Singh ; et al.	2015-12-31
Embedded semiconductor device package and method of manufacturing thereof Grant 9,209,151 - Chauhan , et al. December 8, 2	2015-12-08
Reliable surface mount integrated power module Grant 9,184,124 - Chauhan , et al. November 10, 2	2015-11-10
Power overlay structure with leadframe connections Grant 9,171,785 - Gowda , et al. October 27, 2	2015-10-27
Power overlay structure with leadframe connections Grant 9,165,864 - Gowda , et al. October 20, 2	2015-10-20
Integrated Circuit Package And Method Of Making Same App 20150287699 - McConnelee; Paul Alan ; et al.	2015-10-08
Ultra-thin Embedded Semiconductor Device Package And Method Of Manufacturing Thereof App 20150255418 - Gowda; Arun Virupaksha ; et al.	2015-09-10
Integrated circuit package and method of making same Grant 9,117,813 - McConnelee , et al. August 25, 2	2015-08-25
Power Overlay Structure And Method Of Making Same App 20150194375 - Gowda; Arun Virupaksha ; et al.	2015-07-09
Electrical Interconnect For An Integrated Circuit Package And Method Of Making Same App 20150171036 - Gowda; Arun Virupaksha ; et al.	2015-06-18
Embedded Semiconductor Device Package And Method Of Manufacturing Thereof App 20150084207 - Chauhan; Shakti Singh ; et al.	2015-03-26
Power overlay structure and method of making same Grant 8,987,876 - Gowda , et al. March 24, 2	2015-03-24
Reliable Surface Mount Integrated Power Module App 20150069612 - Chauhan; Shakti Singh ; et al.	2015-03-12
Reliable surface mount integrated power module Grant 8,941,208 - Chauhan , et al. January 27, 2	2015-01-27
Power Overlay Structure And Method Of Making Same App 20140264799 - Gowda; Arun Virupaksha ; et al.	2014-09-18
Power Overlay Structure And Method Of Making Same App 20140264800 - Gowda; Arun Virupaksha ; et al.	2014-09-18
System of chip package build-up Grant 8,829,690 - McConnelee , et al. September 9, 2	2014-09-09
Ultrathin Buried Die Module And Method Of Manufacturing Thereof App 20140183750 - McConnelee; Paul Alan ; et al.	2014-07-03
Electrical Interconnect For An Integrated Circuit Package And Method Of Making Same App 20140159213 - McConnelee; Paul Alan ; et al.	2014-06-12
Component protection for advanced packaging applications Grant 8,742,558 - McConnelee , et al. June 3, 2	2014-06-03
Power Overlay Structure With Leadframe Connections App 20140138806 - Gowda; Arun Virupaksha ; et al.	2014-05-22
Power Overlay Structure With Leadframe Connections App 20140138807 - Gowda; Arun Virupaksha ; et al.	2014-05-22
System And Method Of Chip Package Build-up App 20140110866 - McConnelee; Paul Alan ; et al.	2014-04-24
High integrity protective coatings Grant 8,704,211 - Kim , et al. April 22, 2	2014-04-22
Barrier coating and method Grant 8,691,371 - Kim , et al. April 8, 2	2014-04-08
Ultrathin buried die module and method of manufacturing thereof Grant 8,658,473 - McConnelee , et al. February 25, 2	2014-02-25
Power overlay structure with leadframe connections Grant 8,653,635 - Gowda , et al. February 18, 2	2014-02-18
Electrical interconnect for an integrated circuit package and method of making same Grant 8,653,670 - McConnelee , et al. February 18, 2	2014-02-18
Diffusion Barrier For Surface Mount Modules App 20140029210 - Gowda; Arun Virupaksha ; et al.	2014-01-30
Reliable Surface Mount Integrated Power Module App 20140029234 - Chauhan; Shakti Singh ; et al.	2014-01-30
Epoxy encapsulating and lamination adhesive and method of making same Grant 8,629,003 - Gorczyca , et al. January 14, 2	2014-01-14
Method of chip package build-up Grant 8,623,699 - McConnelee , et al. January 7, 2	2014-01-07
Integrated Circuit Package And Method Of Making Same App 20130334706 - McConnelee; Paul Alan ; et al.	2013-12-19
Method of forming semiconductor device package having high breakdown voltage and low parasitic inductance Grant 8,586,421 - Beaupre , et al. November 19, 2	2013-11-19
Ultrathin Buried Die Module And Method Of Manufacturing Thereof App 20130256900 - McConnelee; Paul Alan ; et al.	2013-10-03
Epoxy Encapsulating And Lamination Adhesive And Method Of Making Same App 20130214435 - Gorczyca; Thomas Bert ; et al.	2013-08-22
Power semiconductor module and fabrication method Grant 8,466,007 - Delgado , et al. June 18, 2	2013-06-18
Epoxy encapsulating and lamination adhesive and method of making same Grant 8,431,444 - Gorczyca , et al. April 30, 2	2013-04-30
Anode-illuminated Radiation Detector App 20130049151 - Lobastov; Vladimir A. ; et al.	2013-02-28
Power Overlay Structure With Leadframe Connections App 20130043571 - Gowda; Arun Virupaksha ; et al.	2013-02-21
Epoxy Encapsulating And Lamination Adhesive And Method Of Making Same App 20130045575 - Gorczyca; Thomas Bert ; et al.	2013-02-21
Semiconductor Device Package And Method Of Manufacturing Thereof App 20120329207 - Beaupre; Richard Alfred ; et al.	2012-12-27
Semiconductor device package Grant 8,334,593 - McConnelee , et al. December 18, 2	2012-12-18
Semiconductor device package having high breakdown voltage and low parasitic inductance and method of manufacturing thereof Grant 8,310,040 - Beaupre , et al. November 13, 2	2012-11-13
Semiconductor Device Package App 20120161325 - McConnelee; Paul Alan ; et al.	2012-06-28
Semiconductor Device Package And Method Of Manufacturing Thereof App 20120146234 - Beaupre; Richard Alfred ; et al.	2012-06-14
Method for fabricating a semiconductor device package Grant 8,114,712 - McConnelee , et al. February 14, 2	2012-02-14
System And Method Of Chip Package Build-up App 20120018857 - McConnelee; Paul Alan ; et al.	2012-01-26
Power Semiconductor Module And Fabrication Method App 20120009733 - Delgado; Eladio Clemente ; et al.	2012-01-12
Electrical Interconnect For An Integrated Circuit Package And Method Of Making Same App 20110316167 - McConnelee; Paul Alan ; et al.	2011-12-29
Power semiconductor module and fabrication method Grant 8,049,338 - Delgado , et al. November 1, 2	2011-11-01
Stress Resistant Micro-via Structure For Flexible Circuits App 20110215480 - Gorczyca; Thomas Bert ; et al.	2011-09-08
Apparatus and method for reducing pitch in an integrated circuit Grant 8,008,781 - Fillion , et al. August 30, 2	2011-08-30
System and method for stacked die embedded chip build-up Grant 8,008,125 - McConnelee , et al. August 30, 2	2011-08-30
Methods for selective deposition of graded materials on continuously fed objects Grant 7,976,899 - Yan , et al. July 12, 2	2011-07-12
Electronic chip package with reduced contact pad pitch Grant 7,964,974 - Fillion , et al. June 21, 2	2011-06-21
System And Method For Stacked Die Embedded Chip Build-up App 20100224992 - McConnelee; Paul Alan ; et al.	2010-09-09
Apparatus And Method For Reducing Pitch In An Integrated Circuit App 20100133705 - Fillion; Raymond Albert ; et al.	2010-06-03
Component protection for advanced packaging applications App 20090291296 - McConnelee; Paul Alan ; et al.	2009-11-26
Barrier Coating And Method App 20080299384 - Kim; Tae Won ; et al.	2008-12-04
Methods And Devices For Coating An Interior Surface Of A Plastic Container App 20080202414 - Yan; Min ; et al.	2008-08-28
Composite articles having diffusion barriers and devices incorporating the same App 20080105370 - Schaepkens; Marc ; et al.	2008-05-08
Systems and methods for selective deposition of graded materials on continuously fed objects App 20080092814 - Yan; Min ; et al.	2008-04-24
Power Semiconductor Module And Fabrication Method App 20070235810 - Delgado; Eladio Clemente ; et al.	2007-10-11
Systems and methods for deposition of graded materials on continuously fed objects App 20070148346 - Kim; Tae Won ; et al.	2007-06-28
Composite articles having diffusion barriers and devices incorporating the same App 20050181212 - Schaepkens, Marc ; et al.	2005-08-18
Methods and fixtures for facilitating handling of thin films App 20050016464 - Duggal, Anil Raj ; et al.	2005-01-27
Fabrication of plastic module with exposed backside contact Grant 6,737,002 - Rose , et al. May 18, 2	2004-05-18
Power electronic module packaging Grant 6,377,461 - Ozmat , et al. April 23, 2	2002-04-23
Power electronic module packaging Grant 6,232,151 - Ozmat , et al. May 15, 2	2001-05-15
Structure and method for molding optical disks Grant 6,146,558 - Feist , et al. November 14, 2	2000-11-14
Multilayer capacitors using amorphous hydrogenated carbon Grant 5,774,326 - McConnelee , et al. June 30, 1	1998-06-30