McCalpin; William
Patent Applications and Registrations
Patent applications and USPTO patent grants for McCalpin; William.The latest application filed is for "package including proximately-positioned lead frame".
- McCalpin; William - Boulder CO US
| Patent | Date |
|---|---|
| Package including wires contacting lead frame edge Grant 8,384,228 - Bartlow , et al. February 26, 2 | 2013-02-26 |
| Package including proximately-positioned lead frame Grant 8,288,845 - Bartlow , et al. October 16, 2 | 2012-10-16 |
| Package Including Proximately-positioned Lead Frame App 20100123228 - Bartlow; Howard ; et al. | 2010-05-20 |
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