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name:-0.0072488784790039
name:-0.0074920654296875
name:-0.0090291500091553
McCallum-Cook; Ian Patent Filings

McCallum-Cook; Ian

Patent Applications and Registrations

Patent applications and USPTO patent grants for McCallum-Cook; Ian.The latest application filed is for "multi-depth regions of high resistivity in a semiconductor substrate".

Company Profile
9.6.6
  • McCallum-Cook; Ian - Burlington VT
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Multi-depth regions of high resistivity in a semiconductor substrate
Grant 11,158,535 - Shank , et al. October 26, 2
2021-10-26
Multi-depth Regions Of High Resistivity In A Semiconductor Substrate
App 20210111063 - Shank; Steven M. ;   et al.
2021-04-15
Bulk Substrates With A Self-aligned Buried Polycrystalline Layer
App 20210074577 - Shank; Steven M. ;   et al.
2021-03-11
Bulk substrates with a self-aligned buried polycrystalline layer
Grant 10,832,940 - Shank , et al. November 10, 2
2020-11-10
Substrates With Self-aligned Buried Dielectric And Polycrystalline Layers
App 20200176589 - Adusumilli; Siva P. ;   et al.
2020-06-04
Ring Isolated Through-substrate Vias For High Resistivity Substrates
App 20200161218 - SHANK; Steven ;   et al.
2020-05-21
Substrates with self-aligned buried dielectric and polycrystalline layers
Grant 10,651,281 - Adusumilli , et al.
2020-05-12
Ring isolated through-substrate vias for high resistivity substrates
Grant 10,643,927 - Shank , et al.
2020-05-05
Bulk Substrates With A Self-aligned Buried Polycrystalline Layer
App 20190295881 - Shank; Steven M. ;   et al.
2019-09-26
Bulk substrates with a self-aligned buried polycrystalline layer
Grant 10,192,779 - Shank , et al. Ja
2019-01-29
Integrated circuit structure with continuous metal crack stop
Grant 10,109,599 - Christiansen , et al. October 23, 2
2018-10-23
Integrated Circuit Structure With Continuous Metal Crack Stop
App 20180174982 - Christiansen; Cathryn J. ;   et al.
2018-06-21

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