McAllister; Michael Ford
Patent Applications and Registrations
Patent applications and USPTO patent grants for McAllister; Michael Ford.The latest application filed is for "method of forming solid vias in a printed circuit board".
- McAllister; Michael Ford - New Milford CT
- McAllister; Michael Ford - Clintondale NY
| Patent | Date |
|---|---|
| Method of forming solid vias in a printed circuit board Grant 7,987,587 - Becker , et al. August 2, 2 | 2011-08-02 |
| Method of Forming Solid Vias in a Printed Circuit Board App 20090223710 - Becker; Wiren Dale ; et al. | 2009-09-10 |
| Electronic package structures using land grid array interposers for module-to-board interconnection Grant 7,284,992 - Becker , et al. October 23, 2 | 2007-10-23 |
| Electronic Package Structures Using Land Grid Array Interposers For Module-to-board Interconnection App 20070224845 - Becker; Wiren Dale ; et al. | 2007-09-27 |
| Thin film wiring scheme utilizing inter-chip site surface wiring Grant 6,444,919 - Economikos , et al. September 3, 2 | 2002-09-03 |
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