McAllister; Michael F.

Patent Applications and Registrations

Patent applications and USPTO patent grants for McAllister; Michael F..The latest application filed is for "integrated decoupling capacitor employing conductive through-substrate vias".

Company Profile

0.19.14

McAllister; Michael F. - New Milford CT US
McAllister; Michael F. - Hopewell Junction NY US
McAllister; Michael F. - Clintondale NY
McAllister; Michael F. - Milford CT
McAllister, Michael F. - US

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Gel package structural enhancement of compression system board connections Grant 8,929,086 - McAllister , et al. January 6, 2	2015-01-06
Integrated decoupling capacitor employing conductive through-substrate vias Grant 8,785,289 - Kim , et al. July 22, 2	2014-07-22
Integrated Decoupling Capacitor Employing Conductive Through-substrate Vias App 20130344675 - Kim; Tae Hong ; et al.	2013-12-26
Integrated decoupling capacitor employing conductive through-substrate vias Grant 8,558,345 - Kim , et al. October 15, 2	2013-10-15
Integrated Decoupling Capacitor Employing Conductive Through-substrate Vias App 20110108948 - Kim; Tae Hong ; et al.	2011-05-12
Method for structural enhancement of compression system board connections Grant 7,930,820 - McAllister , et al. April 26, 2	2011-04-26
Gel package structural enhancement of compression system board connections Grant 7,543,373 - McAllister , et al. June 9, 2	2009-06-09
Land grid array structures and methods for engineering change Grant 7,363,688 - McAllister , et al. April 29, 2	2008-04-29
Multi-Chip Module (MCM) of a Computer System App 20080089024 - McAllister; Michael F. ; et al.	2008-04-17
Method for using gel package structure enhancing thermal dissipation between compressed printed circuit board and heat sink mechanical stiffener Grant 7,344,919 - McAllister , et al. March 18, 2	2008-03-18
Gel package structural enhancement of compression system board connections App 20070069753 - McAllister; Michael F. ; et al.	2007-03-29
Gel package structural enhancement of compression system board connections App 20070069754 - McAllister; Michael F. ; et al.	2007-03-29
Gel package structural enhancement of compression system board connections App 20070072344 - McAllister; Michael F. ; et al.	2007-03-29
Gel package structural enhancement of compression system board connections App 20070069358 - McAllister; Michael F. ; et al.	2007-03-29
Gel package structural enhancement of compression system board connections App 20070072450 - McAllister; Michael F. ; et al.	2007-03-29
Land grid array structures and methods for engineering change App 20060260123 - McAllister; Michael F. ; et al.	2006-11-23
Land grid array structures and methods for engineering change Grant 7,077,660 - McAllister , et al. July 18, 2	2006-07-18
Land grid array structure Grant 6,954,984 - McAllister , et al. October 18, 2	2005-10-18
Land grid array structures and methods for engineering change App 20040159915 - McAllister, Michael F. ; et al.	2004-08-19
Land grid array structures and methods for engineering change App 20040016114 - McAllister, Michael F. ; et al.	2004-01-29
Method and apparatus of interconnecting with a system board Grant 6,605,953 - McAllister , et al. August 12, 2	2003-08-12
Application and test methodology for use with compression land grid array connectors Grant 6,529,023 - Becker , et al. March 4, 2	2003-03-04
Method and apparatus of interconnecting with a system board App 20020186002 - McAllister, Michael F. ; et al.	2002-12-12
Method and apparatus of interconnecting with a system board App 20020180422 - McAllister, Michael F. ; et al.	2002-12-05
Application And Test Methodology For Use With Compression Land Grid Array Connectors App 20020171442 - Becker, Wiren D. ; et al.	2002-11-21
High frequency probe Grant 6,252,391 - McAllister , et al. June 26, 2	2001-06-26
High density memory structure Grant 5,523,619 - McAllister , et al. June 4, 1	1996-06-04
Direct jump engineering change system Grant 5,354,955 - Gregor , et al. October 11, 1	1994-10-11
Programmable chip to circuit board connection Grant 5,264,664 - McAllister , et al. November 23, 1	1993-11-23
Coaxial converter with resilient terminal Grant 4,734,046 - McAllister , et al. March 29, 1	1988-03-29
Method of making a hybrid dielectric probe interposer Grant 4,603,023 - Mack , et al. July 29, 1	1986-07-29

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