Patent | Date |
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Gel package structural enhancement of compression system board connections Grant 8,929,086 - McAllister , et al. January 6, 2 | 2015-01-06 |
Integrated decoupling capacitor employing conductive through-substrate vias Grant 8,785,289 - Kim , et al. July 22, 2 | 2014-07-22 |
Integrated Decoupling Capacitor Employing Conductive Through-substrate Vias App 20130344675 - Kim; Tae Hong ;   et al. | 2013-12-26 |
Integrated decoupling capacitor employing conductive through-substrate vias Grant 8,558,345 - Kim , et al. October 15, 2 | 2013-10-15 |
Integrated Decoupling Capacitor Employing Conductive Through-substrate Vias App 20110108948 - Kim; Tae Hong ;   et al. | 2011-05-12 |
Method for structural enhancement of compression system board connections Grant 7,930,820 - McAllister , et al. April 26, 2 | 2011-04-26 |
Gel package structural enhancement of compression system board connections Grant 7,543,373 - McAllister , et al. June 9, 2 | 2009-06-09 |
Land grid array structures and methods for engineering change Grant 7,363,688 - McAllister , et al. April 29, 2 | 2008-04-29 |
Multi-Chip Module (MCM) of a Computer System App 20080089024 - McAllister; Michael F. ;   et al. | 2008-04-17 |
Method for using gel package structure enhancing thermal dissipation between compressed printed circuit board and heat sink mechanical stiffener Grant 7,344,919 - McAllister , et al. March 18, 2 | 2008-03-18 |
Gel package structural enhancement of compression system board connections App 20070069753 - McAllister; Michael F. ;   et al. | 2007-03-29 |
Gel package structural enhancement of compression system board connections App 20070069754 - McAllister; Michael F. ;   et al. | 2007-03-29 |
Gel package structural enhancement of compression system board connections App 20070072344 - McAllister; Michael F. ;   et al. | 2007-03-29 |
Gel package structural enhancement of compression system board connections App 20070069358 - McAllister; Michael F. ;   et al. | 2007-03-29 |
Gel package structural enhancement of compression system board connections App 20070072450 - McAllister; Michael F. ;   et al. | 2007-03-29 |
Land grid array structures and methods for engineering change App 20060260123 - McAllister; Michael F. ;   et al. | 2006-11-23 |
Land grid array structures and methods for engineering change Grant 7,077,660 - McAllister , et al. July 18, 2 | 2006-07-18 |
Land grid array structure Grant 6,954,984 - McAllister , et al. October 18, 2 | 2005-10-18 |
Land grid array structures and methods for engineering change App 20040159915 - McAllister, Michael F. ;   et al. | 2004-08-19 |
Land grid array structures and methods for engineering change App 20040016114 - McAllister, Michael F. ;   et al. | 2004-01-29 |
Method and apparatus of interconnecting with a system board Grant 6,605,953 - McAllister , et al. August 12, 2 | 2003-08-12 |
Application and test methodology for use with compression land grid array connectors Grant 6,529,023 - Becker , et al. March 4, 2 | 2003-03-04 |
Method and apparatus of interconnecting with a system board App 20020186002 - McAllister, Michael F. ;   et al. | 2002-12-12 |
Method and apparatus of interconnecting with a system board App 20020180422 - McAllister, Michael F. ;   et al. | 2002-12-05 |
Application And Test Methodology For Use With Compression Land Grid Array Connectors App 20020171442 - Becker, Wiren D. ;   et al. | 2002-11-21 |
High frequency probe Grant 6,252,391 - McAllister , et al. June 26, 2 | 2001-06-26 |
High density memory structure Grant 5,523,619 - McAllister , et al. June 4, 1 | 1996-06-04 |
Direct jump engineering change system Grant 5,354,955 - Gregor , et al. October 11, 1 | 1994-10-11 |
Programmable chip to circuit board connection Grant 5,264,664 - McAllister , et al. November 23, 1 | 1993-11-23 |
Coaxial converter with resilient terminal Grant 4,734,046 - McAllister , et al. March 29, 1 | 1988-03-29 |
Method of making a hybrid dielectric probe interposer Grant 4,603,023 - Mack , et al. July 29, 1 | 1986-07-29 |