Mazotti; William Paul

Patent Applications and Registrations

Patent applications and USPTO patent grants for Mazotti; William Paul.The latest application filed is for "optical sub-assembly packaging techniques that incorporate optical lenses".

Company Profile

0.23.17

Mazotti; William Paul - San Martin CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Optical sub-assembly packaging techniques that incorporate optical lenses Grant 7,431,516 - Mazotti , et al. October 7, 2	2008-10-07
Two-layer electrical substrate for optical devices Grant 7,432,575 - Pendse , et al. October 7, 2	2008-10-07
Ceramic optical sub-assembly for optoelectronic modules Grant 7,269,027 - Liu , et al. September 11, 2	2007-09-11
Techniques for joining an opto-electronic module to a semiconductor package Grant 7,247,942 - Nguyen , et al. July 24, 2	2007-07-24
Techniques for joining an opto-electronic module to a semiconductor package Grant 7,199,440 - Nguyen , et al. April 3, 2	2007-04-03
Optical sub-assembly packaging techniques that incorporate optical lenses App 20070071391 - Mazotti; William Paul ; et al.	2007-03-29
Technique for protecting photonic devices in optoelectronic packages with clear overmolding Grant 7,195,955 - Nguyen , et al. March 27, 2	2007-03-27
Opto-electronic module form factor having adjustable optical plane height Grant 7,156,562 - Mazotti , et al. January 2, 2	2007-01-02
Optical sub-assembly for opto-electronic modules Grant 7,086,788 - Mazotti , et al. August 8, 2	2006-08-08
Optical sub-assembly packaging techniques that incorporate optical lenses Grant 7,073,961 - Mazotti , et al. July 11, 2	2006-07-11
Ceramic optical sub-assembly for optoelectronic modules App 20060140534 - Liu; Jia ; et al.	2006-06-29
Ceramic optical sub-assembly for optoelectronic modules Grant 7,023,705 - Liu , et al. April 4, 2	2006-04-04
Semiconductor package having flash-free contacts and techniques for manufacturing the same App 20060055080 - Pham; Ken ; et al.	2006-03-16
Technique for protecting photonic devices in optoelectronic packages with clear overmolding Grant 7,001,083 - Nguyen , et al. February 21, 2	2006-02-21
Techniques for manufacturing flash-free contacts on a semiconductor package Grant 6,989,122 - Pham , et al. January 24, 2	2006-01-24
Multi-purpose optical light pipe Grant 6,985,668 - Mazotti , et al. January 10, 2	2006-01-10
Technique for protecting photonic devices in optoelectronic packages with clear overmolding App 20060001183 - Nguyen; Luu Thanh ; et al.	2006-01-05
Techniques for attaching rotated photonic devices to an optical sub-assembly in an optoelectronic package Grant 6,973,225 - Nguyen , et al. December 6, 2	2005-12-06
Optical sub-assembly for opto-electronic modules App 20050175297 - Mazotti, William Paul ; et al.	2005-08-11
Optical sub-assembly packaging techniques that incorporate optical lenses App 20050157990 - Mazotti, William Paul ; et al.	2005-07-21
Optical sub-assembly for optoelectronic modules Grant 6,916,121 - Mazotti , et al. July 12, 2	2005-07-12
Techniques for joining an opto-electronic module to a semiconductor package App 20050117835 - Nguyen, Luu Thanh ; et al.	2005-06-02
Techniques for joining an opto-electronic module to a semiconductor package App 20050100294 - Nguyen, Luu Thanh ; et al.	2005-05-12
Optical sub-assembly packaging techniques that incorporate optical lenses Grant 6,863,450 - Mazotti , et al. March 8, 2	2005-03-08
Techniques for joining an opto-electronic module to a semiconductor package Grant 6,858,468 - Nguyen , et al. February 22, 2	2005-02-22
Multi-purpose optical light pipe App 20050013581 - Mazotti, William Paul ; et al.	2005-01-20
Opto-electronic module form factor having adjustable optical plane height App 20050013560 - Mazotti, William Paul ; et al.	2005-01-20
Techniques for joining an opto-electronic module to a semiconductor package Grant 6,838,317 - Nguyen , et al. January 4, 2	2005-01-04
Two-layer electrical substrate for optical devices App 20040216918 - Pendse, Neeraj Anil ; et al.	2004-11-04
Two-layer electrical substrate for optical devices Grant 6,765,275 - Pendse , et al. July 20, 2	2004-07-20
Apparatus and method for electro-optical packages that facilitate the coupling of optical cables to printed circuit boards Grant 6,749,345 - Gee , et al. June 15, 2	2004-06-15
Optical sub-assembly packaging techniques that incorporate optical lenses App 20040109649 - Mazotti, William Paul ; et al.	2004-06-10
Techniques for joining an opto-electronic module to a semiconductor package App 20040048417 - Nguyen, Luu Thanh ; et al.	2004-03-11
Optoelectronic package with dam structure to provide fiber standoff Grant 6,655,854 - Nguyen , et al. December 2, 2	2003-12-02
Techniques for joining an opto-electronic module to a semiconductor package Grant 6,642,613 - Nguyen , et al. November 4, 2	2003-11-04
Techniques for joining an opto-electronic module to a semiconductor package App 20030189214 - Nguyen, Luu Thanh ; et al.	2003-10-09
Techniques for maintaining parallelism between optical and chip sub-assemblies Grant 6,628,000 - Pham , et al. September 30, 2	2003-09-30
Techniques for attaching rotated photonic devices to an optical sub-assembly in an optoelectronic package App 20030057535 - Nguyen, Luu Thanh ; et al.	2003-03-27
Ceramic optical sub-assembly for optoelectronic modules App 20030026081 - Liu, Jia ; et al.	2003-02-06
Optical sub-assembly for optoelectronic modules App 20030026556 - Mazotti, William Paul ; et al.	2003-02-06

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