MAYS; Ebony L.

Patent Applications and Registrations

Patent applications and USPTO patent grants for MAYS; Ebony L..The latest application filed is for "fin end plug structures for advanced integrated circuit structure fabrication".

Company Profile

9.5.9

MAYS; Ebony L. - Hillsboro OR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Fin End Plug Structures For Advanced Integrated Circuit Structure Fabrication App 20220262795 - HO; Byron ; et al.	2022-08-18
Fin end plug structures for advanced integrated circuit structure fabrication Grant 11,380,683 - Ho , et al. July 5, 2	2022-07-05
Semiconductor device having fin-end stress-inducing features Grant 10,964,800 - Ho , et al. March 30, 2	2021-03-30
Fin End Plug Structures For Advanced Integrated Circuit Structure Fabrication App 20210035972 - HO; Byron ; et al.	2021-02-04
Fin end plug structures for advanced integrated circuit structure fabrication Grant 10,861,850 - Ho , et al. December 8, 2	2020-12-08
Filling Openings By Combining Non-flowable And Flowable Processes App 20200365447 - Mays; Ebony L. ; et al.	2020-11-19
Dielectric gap-fill material deposition Grant 10,811,251 - Luce , et al. October 20, 2	2020-10-20
Fin End Plug Structures For Advanced Integrated Circuit Structure Fabrication App 20200321333 - HO; Byron ; et al.	2020-10-08
Fin end plug structures for advanced integrated circuit structure fabrication Grant 10,734,379 - Ho , et al.	2020-08-04
Semiconductor Device Having Fin-end Stress-inducing Features App 20200058761 - HO; Byron ; et al.	2020-02-20
Dielectric Gap-fill Material Deposition App 20190181003 - LUCE; Jeanne L. ; et al.	2019-06-13
Fin End Plug Structures For Advanced Integrated Circuit Structure Fabrication App 20190164961 - HO; Byron ; et al.	2019-05-30
Flowable Dielectrics From Vapor Phase Precursors App 20190035673 - Mays; Ebony L. ; et al.	2019-01-31

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