| Patent | Date |
|---|
Byproduct Removal From Electroplating Solutions
App 20220307152 - Richardson; Joseph ; et al. | 2022-09-29 |
Differential Contrast Plating For Advanced Packaging Applications
App 20220275531 - Banik; Stephen J. ; et al. | 2022-09-01 |
Gold Through Silicon Mask Plating
App 20220216104 - Chua; Lee Peng ; et al. | 2022-07-07 |
Dynamic modulation of cross flow manifold during elecroplating
Grant 11,047,059 - Thorkelsson , et al. June 29, 2 | 2021-06-29 |
Electroplating Apparatus For Tailored Uniformity Profile
App 20210148001 - Mayer; Steven T. ; et al. | 2021-05-20 |
Methods and apparatus for flow isolation and focusing during electroplating
Grant 11,001,934 - Banik, II , et al. May 11, 2 | 2021-05-11 |
Apparatus for measuring condition of electroplating cell components and associated methods
Grant 10,989,747 - Emerson , et al. April 27, 2 | 2021-04-27 |
Integrated elastomeric lipseal and cup bottom for reducing wafer sticking
Grant 10,982,346 - Berke , et al. April 20, 2 | 2021-04-20 |
Protecting anodes from passivation in alloy plating systems
Grant 10,954,605 - Chua , et al. March 23, 2 | 2021-03-23 |
Electroplating apparatus for tailored uniformity profile
Grant 10,920,335 - Mayer , et al. February 16, 2 | 2021-02-16 |
Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity
Grant 10,923,340 - Kagajwala , et al. February 16, 2 | 2021-02-16 |
Wetting pretreatment for enhanced damascene metal filling
Grant 10,840,101 - Mayer , et al. November 17, 2 | 2020-11-17 |
Monitoring electrolytes during electroplating
Grant 10,774,438 - Thorum , et al. September 15, 2 | 2020-09-15 |
Electro-oxidative Metal Removal In Through Mask Interconnect Fabrication
App 20200279754 - Thorkelsson; Kari ; et al. | 2020-09-03 |
Systems and methods for achieving uniformity across a redistribution layer
Grant 10,714,436 - Buckalew , et al. | 2020-07-14 |
Electro-oxidative metal removal in through mask interconnect fabrication
Grant 10,692,735 - Thorkelsson , et al. | 2020-06-23 |
Methods and apparatuses for electroplating and seed layer detection
Grant 10,669,644 - Dinneen , et al. | 2020-06-02 |
Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating
Grant 10,662,545 - Mayer , et al. | 2020-05-26 |
Cleaning Electroplating Substrate Holders Using Reverse Current Deplating
App 20200115816 - Chua; Lee Peng ; et al. | 2020-04-16 |
Cleaning electroplating substrate holders using reverse current deplating
Grant 10,538,855 - Chua , et al. Ja | 2020-01-21 |
Apparatus for Measuring Condition of Electroplating Cell Components and Associated Methods
App 20200011914 - Emerson; Mark E. ; et al. | 2020-01-09 |
TSV bath evaluation using field versus feature contrast
Grant 10,508,359 - Brogan , et al. Dec | 2019-12-17 |
Methods And Apparatuses For Electroplating And Seed Layer Detection
App 20190352792 - Dinneen; Daniel Mark ; et al. | 2019-11-21 |
Electrolyte concentration control system for high rate electroplating
Grant 10,472,730 - Mayer , et al. Nov | 2019-11-12 |
Apparatus for measuring condition of electroplating cell components and associated methods
Grant 10,436,829 - Emerson , et al. O | 2019-10-08 |
Dynamic Modulation Of Cross Flow Manifold During Elecroplating
App 20190301042 - Thorkelsson; Kari ; et al. | 2019-10-03 |
Remote detection of plating on wafer holding apparatus
Grant 10,416,092 - Arora , et al. Sept | 2019-09-17 |
Methods and apparatuses for electroplating and seed layer detection
Grant 10,407,794 - Dinneen , et al. Sept | 2019-09-10 |
Dynamic modulation of cross flow manifold during elecroplating
Grant 10,364,505 - Thorkelsson , et al. | 2019-07-30 |
Electroplating apparatus and process for wafer level packaging
Grant 10,309,024 - Mayer , et al. | 2019-06-04 |
Methods and apparatus for wetting pretreatment for through resist metal plating
Grant 10,301,738 - Buckalew , et al. | 2019-05-28 |
Methods And Apparatuses For Electroplating And Seed Layer Detection
App 20190127873 - Dinneen; Daniel Mark ; et al. | 2019-05-02 |
Multibath Plating Of A Single Metal
App 20190122890 - Thorkelsson; Kari ; et al. | 2019-04-25 |
Methods And Apparatus For Flow Isolation And Focusing During Electroplating
App 20190055665 - Banik, II; Stephen J. ; et al. | 2019-02-21 |
Bubble and foam solutions using a completely immersed air-free feedback flow control valve
Grant 10,208,395 - Abraham , et al. Feb | 2019-02-19 |
Integrated Elastomeric Lipseal And Cup Bottom For Reducing Wafer Sticking
App 20190040544 - Berke; Aaron ; et al. | 2019-02-07 |
Methods and apparatuses for electroplating and seed layer detection
Grant 10,196,753 - Dinneen , et al. Fe | 2019-02-05 |
Electro-oxidative Metal Removal In Through Mask Interconnect Fabrication
App 20190035640 - Thorkelsson; Kari ; et al. | 2019-01-31 |
Cross flow manifold for electroplating apparatus
Grant 10,190,230 - Abraham , et al. Ja | 2019-01-29 |
Apparatuses and methods for maintaining pH in nickel electroplating baths
Grant 10,190,232 - Buckalew , et al. Ja | 2019-01-29 |
Monitoring Electrolytes During Electroplating
App 20190010626 - Thorum; Matthew Sherman ; et al. | 2019-01-10 |
Protecting Anodes From Passivation In Alloy Plating Systems
App 20180371637 - Chua; Lee Peng ; et al. | 2018-12-27 |
Methods and apparatus for wetting pretreatment for through resist metal plating
Grant 10,128,102 - Chua , et al. November 13, 2 | 2018-11-13 |
Apparatus And Method For Modulating Azimuthal Uniformity In Electroplating
App 20180312991 - Graham; Gabriel Hay ; et al. | 2018-11-01 |
Protecting anodes from passivation in alloy plating systems
Grant 10,106,907 - Chua , et al. October 23, 2 | 2018-10-23 |
Electroplating Apparatus For Tailored Uniformity Profile
App 20180291517 - Mayer; Steven T. ; et al. | 2018-10-11 |
Monitoring electrolytes during electroplating
Grant 10,094,038 - Thorum , et al. October 9, 2 | 2018-10-09 |
Edge flow element for electroplating apparatus
Grant 10,094,034 - Graham , et al. October 9, 2 | 2018-10-09 |
Methods and apparatuses for cleaning electroplating substrate holders
Grant 10,092,933 - Kumar , et al. October 9, 2 | 2018-10-09 |
Apparatus And Method For Electrodeposition Of Metals With The Use Of An Ionically Resistive Ionically Permeable Element Having Spatially Tailored Resistivity
App 20180286660 - Kagajwala; Burhanuddin ; et al. | 2018-10-04 |
Automated cleaning of wafer plating assembly
Grant 10,087,545 - Mayer , et al. October 2, 2 | 2018-10-02 |
Electrolyte Delivery And Generation Equipment
App 20180274123 - Mayer; Steven T. ; et al. | 2018-09-27 |
Electroplating Apparatus And Process For Wafer Level Packaging
App 20180237933 - Mayer; Steven T. ; et al. | 2018-08-23 |
Integrated elastomeric lipseal and cup bottom for reducing wafer sticking
Grant 10,053,793 - Berke , et al. August 21, 2 | 2018-08-21 |
Electrolyte delivery and generation equipment
Grant 10,011,919 - Mayer , et al. July 3, 2 | 2018-07-03 |
Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity
Grant 10,014,170 - Kagajwala , et al. July 3, 2 | 2018-07-03 |
Apparatus and method for modulating azimuthal uniformity in electroplating
Grant 9,988,733 - Graham , et al. June 5, 2 | 2018-06-05 |
Electroplating apparatus and process for wafer level packaging
Grant 9,982,357 - Mayer , et al. May 29, 2 | 2018-05-29 |
Wetting Pretreatment For Enhanced Damascene Metal Filling
App 20180138044 - Mayer; Steven T. ; et al. | 2018-05-17 |
Enhancement Of Electrolyte Hydrodynamics For Efficient Mass Transfer During Electroplating
App 20180105949 - Mayer; Steven T. ; et al. | 2018-04-19 |
Apparatus for advanced packaging applications
Grant 9,899,230 - Buckalew , et al. February 20, 2 | 2018-02-20 |
Methods And Apparatuses For Electroplating And Seed Layer Detection
App 20180038009 - Dinneen; Daniel Mark ; et al. | 2018-02-08 |
Method And Apparatus For Electroplating Semiconductor Wafer When Controlling Cations In Electrolyte
App 20180030611 - Spurlin; Tighe A. ; et al. | 2018-02-01 |
Methods And Apparatus For Wetting Pretreatment For Through Resist Metal Plating
App 20180023209 - Buckalew; Bryan L. ; et al. | 2018-01-25 |
Monitoring leveler concentrations in electroplating solutions
Grant 9,856,574 - Mayer January 2, 2 | 2018-01-02 |
Wetting pretreatment for enhanced damascene metal filling
Grant 9,852,913 - Mayer , et al. December 26, 2 | 2017-12-26 |
Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating
Grant 9,834,852 - Mayer , et al. December 5, 2 | 2017-12-05 |
Dynamic Modulation Of Cross Flow Manifold During Elecroplating
App 20170342583 - Thorkelsson; Kari ; et al. | 2017-11-30 |
Methods and apparatus for wetting pretreatment for through resist metal plating
Grant 9,828,688 - Buckalew , et al. November 28, 2 | 2017-11-28 |
Methods and apparatuses for electroplating and seed layer detection
Grant 9,822,460 - Dinneen , et al. November 21, 2 | 2017-11-21 |
Method and apparatus for electroplating semiconductor wafer when controlling cations in electrolyte
Grant 9,816,196 - Spurlin , et al. November 14, 2 | 2017-11-14 |
Apparatus for Measuring Condition of Electroplating Cell Components and Associated Methods
App 20170307554 - Emerson; Mark E. ; et al. | 2017-10-26 |
Remote Detection Of Plating On Wafer Holding Apparatus
App 20170299524 - Arora; Rajan ; et al. | 2017-10-19 |
Detection of plating on wafer holding apparatus
Grant 9,746,427 - Mayer , et al. August 29, 2 | 2017-08-29 |
Systems And Methods For Achieving Uniformity Across A Redistribution Layer
App 20170243839 - Buckalew; Bryan L. ; et al. | 2017-08-24 |
Tsv Bath Evaluation Using Field Versus Feature Contrast
App 20170241041 - Brogan; Lee ; et al. | 2017-08-24 |
Apparatus for wetting pretreatment for enhanced damascene metal filling
Grant 9,721,800 - Mayer , et al. August 1, 2 | 2017-08-01 |
TSV bath evaluation using field versus feature contrast
Grant 9,689,083 - Brogan , et al. June 27, 2 | 2017-06-27 |
Cross Flow Manifold For Electroplating Apparatus
App 20170175286 - Abraham; Richard ; et al. | 2017-06-22 |
Apparatus and method for edge bevel removal of copper from silicon wafers
Grant 9,685,353 - Ganesan , et al. June 20, 2 | 2017-06-20 |
Bubble And Foam Solutions Using A Completely Immersed Air-free Feedback Flow Control Valve
App 20170167045 - Abraham; Richard ; et al. | 2017-06-15 |
Methods And Apparatus For Wetting Pretreatment For Through Resist Metal Plating
App 20170148627 - Chua; Lee Peng ; et al. | 2017-05-25 |
Protecting Anodes From Passivation In Alloy Plating Systems
App 20170137960 - Chua; Lee Peng ; et al. | 2017-05-18 |
Cross flow manifold for electroplating apparatus
Grant 9,624,592 - Abraham , et al. April 18, 2 | 2017-04-18 |
Bubble and foam solutions using a completely immersed air-free feedback flow control valve
Grant 9,617,652 - Abraham , et al. April 11, 2 | 2017-04-11 |
Pretreatment of nickel and cobalt liners for electrodeposition of copper into through silicon vias
Grant 9,617,648 - Thorum , et al. April 11, 2 | 2017-04-11 |
Methods and apparatus for wetting pretreatment for through resist metal plating
Grant 9,613,833 - Chua , et al. April 4, 2 | 2017-04-04 |
Through silicon via filling using an electrolyte with a dual state inhibitor
Grant 9,593,426 - Willey , et al. March 14, 2 | 2017-03-14 |
Edge Flow Element For Electroplating Apparatus
App 20170058417 - Graham; Gabriel Hay ; et al. | 2017-03-02 |
Apparatus and method for dynamic control of plated uniformity with the use of remote electric current
Grant 9,567,685 - Kagajwala , et al. February 14, 2 | 2017-02-14 |
Enhancement Of Electrolyte Hydrodynamics For Efficient Mass Transfer During Electroplating
App 20170029973 - Mayer; Steven T. ; et al. | 2017-02-02 |
Cleaning Electroplating Substrate Holders Using Reverse Current Deplating
App 20170009370 - Chua; Lee Peng ; et al. | 2017-01-12 |
Integrated Elastomeric Lipseal And Cup Bottom For Reducing Wafer Sticking
App 20170009369 - Berke; Aaron ; et al. | 2017-01-12 |
Protecting anodes from passivation in alloy plating systems
Grant 9,534,308 - Chua , et al. January 3, 2 | 2017-01-03 |
Control Of Electrolyte Hydrodynamics For Efficient Mass Transfer During Electroplating
App 20160376722 - Mayer; Steven T. ; et al. | 2016-12-29 |
Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating
Grant 9,523,155 - Mayer , et al. December 20, 2 | 2016-12-20 |
Apparatus And Method For Modulating Azimuthal Uniformity In Electroplating
App 20160362809 - Graham; Gabriel Hay ; et al. | 2016-12-15 |
Electrolyte Delivery And Generation Equipment
App 20160348265 - Mayer; Steven T. ; et al. | 2016-12-01 |
Apparatus For Advanced Packaging Applications
App 20160343582 - Buckalew; Bryan L. ; et al. | 2016-11-24 |
Apparatus And Method For Electodeposition Of Metals With The Use Of An Ionically Resistive Ionically Permeable Element Having Spatially Tailored Resistivity
App 20160333495 - Kagajwala; Burhanuddin ; et al. | 2016-11-17 |
Electroplating Apparatus And Process For Wafer Level Packaging
App 20160312373 - Mayer; Steven T. ; et al. | 2016-10-27 |
Cleaning electroplating substrate holders using reverse current deplating
Grant 9,476,139 - Chua , et al. October 25, 2 | 2016-10-25 |
Monitoring Electrolytes During Electroplating
App 20160298256 - Thorum; Matthew Sherman ; et al. | 2016-10-13 |
Control of electrolyte hydrodynamics for efficient mass transfer during electroplating
Grant 9,464,361 - Mayer , et al. October 11, 2 | 2016-10-11 |
Methods And Apparatus For Wetting Pretreatment For Through Resist Metal Plating
App 20160281255 - Buckalew; Bryan L. ; et al. | 2016-09-29 |
Methods and apparatus for wetting pretreatment for through resist metal plating
Grant 9,455,139 - Buckalew , et al. September 27, 2 | 2016-09-27 |
Wet etching methods for copper removal and planarization in semiconductor processing
Grant 9,447,505 - Mayer , et al. September 20, 2 | 2016-09-20 |
Apparatus for advanced packaging applications
Grant 9,449,808 - Buckalew , et al. September 20, 2 | 2016-09-20 |
Pretreatment Of Nickel And Cobalt Liners For Electrodeposition Of Copper Into Through Silicon Vias
App 20160258078 - Thorum; Matthew S. ; et al. | 2016-09-08 |
Treatment method of electrodeposited copper for wafer-level-packaging process flow
Grant 9,412,713 - Buckalew , et al. August 9, 2 | 2016-08-09 |
Electroplating apparatus and process for wafer level packaging
Grant 9,404,194 - Mayer , et al. August 2, 2 | 2016-08-02 |
Apparatus And Method For Dynamic Control Of Plated Uniformity With The Use Of Remote Electric Current
App 20160215408 - Kagajwala; Burhanuddin ; et al. | 2016-07-28 |
Control of electrolyte hydrodynamics for efficient mass transfer during electroplating
Grant 9,394,620 - Mayer , et al. July 19, 2 | 2016-07-19 |
Current ramping and current pulsing entry of substrates for electroplating
Grant 9,385,035 - Spurlin , et al. July 5, 2 | 2016-07-05 |
Monitoring Leveler Concentrations In Electroplating Solutions
App 20160186356 - Mayer; Steven T. | 2016-06-30 |
Apparatuses and methods for controlling PH in electroplating baths
Grant 9,359,688 - Chua , et al. June 7, 2 | 2016-06-07 |
Automated Cleaning Of Wafer Plating Assembly
App 20160145761 - Mayer; Steven T. ; et al. | 2016-05-26 |
Electroplating Apparatus For Tailored Uniformity Profile
App 20160115611 - Mayer; Steven T. ; et al. | 2016-04-28 |
Monitoring leveler concentrations in electroplating solutions
Grant 9,309,605 - Mayer April 12, 2 | 2016-04-12 |
Electroplating apparatus for tailored uniformity profile
Grant 9,260,793 - Mayer , et al. February 16, 2 | 2016-02-16 |
Automated cleaning of wafer plating assembly
Grant 9,221,081 - Mayer , et al. December 29, 2 | 2015-12-29 |
Electrolyte Concentration Control System For High Rate Electroplating
App 20150315720 - Mayer; Steven T. ; et al. | 2015-11-05 |
Wet Etching Methods For Copper Removal And Planarization In Semiconductor Processing
App 20150267306 - Mayer; Steven T. ; et al. | 2015-09-24 |
Electrolyte loop with pressure regulation for separated anode chamber of electroplating system
Grant 9,139,927 - Rash , et al. September 22, 2 | 2015-09-22 |
Electrolyte concentration control system for high rate electroplating
Grant 9,109,295 - Reid , et al. August 18, 2 | 2015-08-18 |
Methods and Apparatuses for Electroplating and Seed Layer Detection
App 20150206770 - Dinneen; Daniel Mark ; et al. | 2015-07-23 |
Reduced isotropic etchant material consumption and waste generation
Grant 9,074,287 - Mayer , et al. July 7, 2 | 2015-07-07 |
Wet etching methods for copper removal and planarization in semiconductor processing
Grant 9,074,286 - Mayer , et al. July 7, 2 | 2015-07-07 |
Wetting Pretreatment For Enhanced Damascene Metal Filling
App 20150179458 - Mayer; Steven T. ; et al. | 2015-06-25 |
Through Silicon Via Filling Using An Electrolyte With A Dual State Inhibitor
App 20150159289 - Willey; Mark J. ; et al. | 2015-06-11 |
Control of electrolyte composition in a copper electroplating apparatus
Grant 9,045,841 - Buckalew , et al. June 2, 2 | 2015-06-02 |
Apparatus For Wetting Pretreatment For Enhanced Damascene Metal Filling
App 20150096883 - Mayer; Steven T. ; et al. | 2015-04-09 |
Through silicon via filling using an electrolyte with a dual state inhibitor
Grant 8,992,757 - Willey , et al. March 31, 2 | 2015-03-31 |
Electroplating Apparatus For Tailored Uniformity Profile
App 20150060291 - Mayer; Steven T. ; et al. | 2015-03-05 |
Wetting pretreatment for enhanced damascene metal filling
Grant 8,962,085 - Mayer , et al. February 24, 2 | 2015-02-24 |
Apparatuses And Methods For Maintaining Ph In Nickel Electroplating Baths
App 20150041327 - Buckalew; Bryan L. ; et al. | 2015-02-12 |
Tsv Bath Evaluation Using Field Versus Feature Contrast
App 20140367279 - Brogan; Lee ; et al. | 2014-12-18 |
Apparatus For Advanced Packaging Applications
App 20140357089 - BUCKALEW; Bryan L. ; et al. | 2014-12-04 |
Sequential station tool for wet processing of semiconductor wafers
Grant 8,883,640 - Patton , et al. November 11, 2 | 2014-11-11 |
Electroplating apparatus for tailored uniformity profile
Grant 8,858,774 - Mayer , et al. October 14, 2 | 2014-10-14 |
Control Of Electrolyte Hydrodynamics For Efficient Mass Transfer During Electroplating
App 20140299477 - Mayer; Steven T. ; et al. | 2014-10-09 |
Control Of Electrolyte Hydrodynamics For Efficient Mass Transfer During Electroplating
App 20140299478 - Mayer; Steven T. ; et al. | 2014-10-09 |
Detection Of Plating On Wafer Holding Apparatus
App 20140230855 - Mayer; Steven T. ; et al. | 2014-08-21 |
Methods And Apparatus For Wetting Pretreatment For Through Resist Metal Plating
App 20140230860 - Chua; Lee Peng ; et al. | 2014-08-21 |
Current Ramping And Current Pulsing Entry Of Substrates For Electroplating
App 20140224661 - Spurlin; Tighe A. ; et al. | 2014-08-14 |
Control of electrolyte hydrodynamics for efficient mass transfer during electroplating
Grant 8,795,480 - Mayer , et al. August 5, 2 | 2014-08-05 |
Selective electrochemical accelerator removal
Grant 8,795,482 - Mayer , et al. August 5, 2 | 2014-08-05 |
Methods For Reducing Metal Oxide Surfaces To Modified Metal Surfaces
App 20140199497 - Spurlin; Tighe A. ; et al. | 2014-07-17 |
Treatment Method Of Electrodeposited Copper For Wafer-level-packaging Process Flow
App 20140197037 - Buckalew; Bryan L. ; et al. | 2014-07-17 |
Apparatus And Method For Edge Bevel Removal Of Copper From Silicon Wafers
App 20140190529 - Ganesan; Kousik ; et al. | 2014-07-10 |
Enhancement Of Electrolyte Hydrodynamics For Efficient Mass Transfer During Electroplating
App 20140183049 - Mayer; Steven T. ; et al. | 2014-07-03 |
Bubble And Foam Solutions Using A Completely Immersed Air-free Feedback Flow Control Valve
App 20140166476 - Abraham; Richard ; et al. | 2014-06-19 |
Electrolyte Loop With Pressure Regulation For Separated Anode Chamber Of Electroplating System
App 20140131211 - Rash; Robert ; et al. | 2014-05-15 |
Copper electroplating process for uniform across wafer deposition and void free filling on ruthenium coated wafers
Grant 8,703,615 - Ponnuswamy , et al. April 22, 2 | 2014-04-22 |
Reduced Isotropic Etchant Material Consumption And Waste Generation
App 20140061158 - Mayer; Steven T. ; et al. | 2014-03-06 |
Photoresist-free Metal Deposition
App 20140014522 - Mayer; Steven T. ; et al. | 2014-01-16 |
Method of electroplating using a high resistance ionic current source
Grant 8,623,193 - Mayer , et al. January 7, 2 | 2014-01-07 |
Protecting Anodes From Passivation In Alloy Plating Systems
App 20130334052 - Chua; Lee Peng ; et al. | 2013-12-19 |
Electrolyte loop with pressure regulation for separated anode chamber of electroplating system
Grant 8,603,305 - Rash , et al. December 10, 2 | 2013-12-10 |
Reduced isotropic etchant material consumption and waste generation
Grant 8,597,461 - Mayer , et al. December 3, 2 | 2013-12-03 |
Cross Flow Manifold For Electroplating Apparatus
App 20130313123 - ABRAHAM; Richard ; et al. | 2013-11-28 |
Methods And Apparatuses For Cleaning Electroplating Substrate Holders
App 20130292254 - Kumar; Santosh ; et al. | 2013-11-07 |
Method And Apparatus For Electroplating Semiconductor Wafer When Controlling Cations In Electrolyte
App 20130284604 - Spurlin; Tighe A. ; et al. | 2013-10-31 |
Cleaning Electroplating Substrate Holders Using Reverse Current Deplating
App 20130256146 - Chua; Lee Peng ; et al. | 2013-10-03 |
Modulated metal removal using localized wet etching
Grant 8,530,359 - Mayer , et al. September 10, 2 | 2013-09-10 |
Copper electroplating process for uniform across wafer deposition and void free filling on semi-noble metal coated wafers
Grant 8,513,124 - Ponnuswamy , et al. August 20, 2 | 2013-08-20 |
Wet Etching Methods For Copper Removal And Planarization In Semiconductor Processing
App 20130207030 - MAYER; Steven T. ; et al. | 2013-08-15 |
Photoresist-free metal deposition
Grant 8,500,985 - Mayer , et al. August 6, 2 | 2013-08-06 |
Pulse sequence for plating on thin seed layers
Grant 8,500,983 - Ponnuswamy , et al. August 6, 2 | 2013-08-06 |
Fabrication of semiconductor interconnect structure
Grant 8,481,432 - Mayer , et al. July 9, 2 | 2013-07-09 |
Methods And Apparatus For Wetting Pretreatment For Through Resist Metal Plating
App 20130171833 - BUCKALEW; Bryan L. ; et al. | 2013-07-04 |
Electroplating apparatus with vented electrolyte manifold
Grant 8,475,637 - Feng , et al. July 2, 2 | 2013-07-02 |
Monitoring Leveler Concentrations In Electroplating Solutions
App 20130161203 - MAYER; Steven T. | 2013-06-27 |
Topography reduction and control by selective accelerator removal
Grant 8,470,191 - Mayer , et al. June 25, 2 | 2013-06-25 |
Sequential station tool for wet processing of semiconductor wafers
Grant 8,450,210 - Patton , et al. May 28, 2 | 2013-05-28 |
Apparatus and method for edge bevel removal of copper from silicon wafers
Grant 8,419,964 - Ganesan , et al. April 16, 2 | 2013-04-16 |
Capping before barrier-removal IC fabrication method
Grant 8,415,261 - Reid , et al. April 9, 2 | 2013-04-09 |
Wet etching methods for copper removal and planarization in semiconductor processing
Grant 8,372,757 - Mayer , et al. February 12, 2 | 2013-02-12 |
Monitoring of electroplating additives
Grant 8,372,258 - Willey , et al. February 12, 2 | 2013-02-12 |
Process For Electroplating Metals Into Microscopic Recessed Features
App 20120279864 - Mayer; Steven T. ; et al. | 2012-11-08 |
Electroplating Apparatus For Tailored Uniformity Profile
App 20120258408 - MAYER; Steven T. ; et al. | 2012-10-11 |
Selective electrochemical accelerator removal
Grant 8,268,154 - Mayer , et al. September 18, 2 | 2012-09-18 |
Plating method and apparatus with multiple internally irrigated chambers
Grant 8,262,871 - Mayer , et al. September 11, 2 | 2012-09-11 |
Electroless plating-liquid system
Grant 8,257,781 - Webb , et al. September 4, 2 | 2012-09-04 |
Wafer Electroplating Apparatus For Reducing Edge Defects
App 20120181170 - Prabhakar; Vinay ; et al. | 2012-07-19 |
Electroplating Apparatus And Process For Wafer Level Packaging
App 20120138471 - MAYER; Steven T. ; et al. | 2012-06-07 |
Wafer electroplating apparatus for reducing edge defects
Grant 8,172,992 - Prabhakar , et al. May 8, 2 | 2012-05-08 |
Topography reduction and control by selective accelerator removal
Grant 8,158,532 - Mayer , et al. April 17, 2 | 2012-04-17 |
Semiconductive counter electrode for electrolytic current distribution control
Grant 8,147,660 - Mayer , et al. April 3, 2 | 2012-04-03 |
Control of electrolyte composition in a copper electroplating apparatus
Grant 8,128,791 - Buckalew , et al. March 6, 2 | 2012-03-06 |
Control Of Electrolyte Hydrodynamics For Efficient Mass Transfer During Electroplating
App 20120000786 - Mayer; Steven T. ; et al. | 2012-01-05 |
Through Silicon Via Filling Using An Electrolyte With A Dual State Inhibitor
App 20110284386 - Willey; Mark J. ; et al. | 2011-11-24 |
Electroplating flow shaping plate having offset spiral hole pattern
Grant D648,289 - Mayer , et al. November 8, 2 | 2011-11-08 |
Diffusion barrier layers
Grant 8,053,861 - Mountsier , et al. November 8, 2 | 2011-11-08 |
Process for electroplating metals into microscopic recessed features
Grant 8,048,280 - Mayer , et al. November 1, 2 | 2011-11-01 |
Capping before barrier-removal IC fabrication method
Grant 8,043,958 - Reid , et al. October 25, 2 | 2011-10-25 |
Sequential station tool for wet processing of semiconductor wafers
Grant 8,026,174 - Patton , et al. September 27, 2 | 2011-09-27 |
Electrolyte Loop With Pressure Regulation For Separated Anode Chamber Of Electroplating System
App 20110226613 - Rash; Robert ; et al. | 2011-09-22 |
Electrolyte Loop With Pressure Regulation For Separated Anode Chamber Of Electroplating System
App 20110226614 - Rash; Robert ; et al. | 2011-09-22 |
Fabrication Of Semiconductor Interconnect Structure
App 20110223772 - Mayer; Steven T. ; et al. | 2011-09-15 |
Fabrication of semiconductor interconnect structure
Grant 7,972,970 - Mayer , et al. July 5, 2 | 2011-07-05 |
Method of electroplating using a high resistance ionic current source
Grant 7,967,969 - Mayer , et al. June 28, 2 | 2011-06-28 |
Photoresist-free metal deposition
Grant 7,947,163 - Mayer , et al. May 24, 2 | 2011-05-24 |
Electrolyte Concentration Control System for High Rate Electroplating
App 20110083965 - Reid; Jonathan D. ; et al. | 2011-04-14 |
Reduced Isotropic Etchant Material Consumption And Waste Generation
App 20110056913 - Mayer; Steven T. ; et al. | 2011-03-10 |
Monitoring of electroplating additives
App 20110025338 - Willey; Mark J. ; et al. | 2011-02-03 |
Apparatus For Wetting Pretreatment For Enhanced Damascene Metal Filling
App 20100320081 - Mayer; Steven T. ; et al. | 2010-12-23 |
Wetting Pretreatment For Enhanced Damascene Metal Filling
App 20100320609 - Mayer; Steven T. ; et al. | 2010-12-23 |
Pulse Sequence For Plating On Thin Seed Layers
App 20100300888 - Ponnuswamy; Thomas A. ; et al. | 2010-12-02 |
Capping before barrier-removal IC fabrication method
Grant 7,811,925 - Reid , et al. October 12, 2 | 2010-10-12 |
Selective electrochemical accelerator removal
Grant 7,799,200 - Mayer , et al. September 21, 2 | 2010-09-21 |
Edge bevel removal of copper from silicon wafers
Grant 7,780,867 - Mayer , et al. August 24, 2 | 2010-08-24 |
Diffusion Barrier Layers
App 20100187693 - Mountsier; Thomas W. ; et al. | 2010-07-29 |
Wafer Electroplating Apparatus For Reducing Edge Defects
App 20100155254 - Prabhakar; Vinay ; et al. | 2010-06-24 |
Electroplating Apparatus with Vented Electrolyte Manifold
App 20100147679 - Feng; Jingbin ; et al. | 2010-06-17 |
Small-volume electroless plating cell
Grant 7,690,324 - Feng , et al. April 6, 2 | 2010-04-06 |
Methods and apparatus for controlled-angle wafer positioning
Grant 7,686,927 - Reid , et al. March 30, 2 | 2010-03-30 |
Pad-assisted electropolishing
Grant 7,686,935 - Mayer , et al. March 30, 2 | 2010-03-30 |
Rotationally asymmetric variable electrode correction
Grant 7,682,498 - Mayer , et al. March 23, 2 | 2010-03-23 |
Apparatus And Method For Edge Bevel Removal Of Copper From Silicon Wafers
App 20100055924 - Ganesan; Kousik ; et al. | 2010-03-04 |
High Resistance Ionic Current Source
App 20100032304 - Mayer; Steven T. ; et al. | 2010-02-11 |
Modulated metal removal using localized wet etching
App 20100029088 - Mayer; Steven T. ; et al. | 2010-02-04 |
Wet Etching Methods for Copper Removal and Planarization in Semiconductor Processing
App 20100015805 - Mayer; Steven T. ; et al. | 2010-01-21 |
High resistance ionic current source
Grant 7,622,024 - Mayer , et al. November 24, 2 | 2009-11-24 |
Fabrication of semiconductor interconnect structure
App 20090283499 - Mayer; Steven T. ; et al. | 2009-11-19 |
Photoresist-free metal deposition
App 20090277801 - Mayer; Steven T. ; et al. | 2009-11-12 |
Pad-assisted electropolishing
App 20090277802 - Mayer; Steven T. ; et al. | 2009-11-12 |
Topography reduction and control by selective accelerator removal
App 20090280649 - Mayer; Steven T. ; et al. | 2009-11-12 |
Topography reduction and control by selective accelerator removal
App 20090277867 - Mayer; Steven T. ; et al. | 2009-11-12 |
Photoresist-free metal deposition
App 20090280243 - Mayer; Steven T. ; et al. | 2009-11-12 |
Pad-assisted electropolishing
App 20090266707 - Mayer; Steven T. ; et al. | 2009-10-29 |
Capping before barrier-removal IC fabrication method
Grant 7,605,082 - Reid , et al. October 20, 2 | 2009-10-20 |
Selectively accelerated plating of metal features
Grant 7,560,016 - Mayer , et al. July 14, 2 | 2009-07-14 |
Fabrication of semiconductor interconnect structure
Grant 7,531,463 - Koos , et al. May 12, 2 | 2009-05-12 |
Method and apparatus for uniform electropolishing of damascene IC structures by selective agitation
Grant 7,531,079 - Mayer , et al. May 12, 2 | 2009-05-12 |
Method for planar electroplating
Grant 7,449,098 - Mayer , et al. November 11, 2 | 2008-11-11 |
Selectively accelerated plating of metal features
Grant 7,449,099 - Mayer , et al. November 11, 2 | 2008-11-11 |
Selectively accelerated plating of metal features
Grant 7,405,163 - Drewery , et al. July 29, 2 | 2008-07-29 |
Method for fabrication of semiconductor interconnect structure with reduced capacitance, leakage current, and improved breakdown voltage
Grant 7,338,908 - Koos , et al. March 4, 2 | 2008-03-04 |
Fabrication of semiconductor interconnect structure
App 20070105377 - Koos; Daniel A. ; et al. | 2007-05-10 |
Method and apparatus for potential controlled electroplating of fine patterns on semiconductor wafers
Grant 7,211,175 - Mayer , et al. May 1, 2 | 2007-05-01 |
Sequential station tool for wet processing of semiconductor wafers
Grant 7,189,647 - Patton , et al. March 13, 2 | 2007-03-13 |
Methods and apparatus for controlled-angle wafer positioning
Grant 7,097,410 - Reid , et al. August 29, 2 | 2006-08-29 |
Dynamically variable field shaping element
Grant 7,070,686 - Contolini , et al. July 4, 2 | 2006-07-04 |
Process for electroplating metals into microscopic recessed features
App 20060011483 - Mayer; Steven T. ; et al. | 2006-01-19 |
Sequential station tool for wet processing of semiconductor wafers
App 20050282371 - Patton, Evan E. ; et al. | 2005-12-22 |
Wafer chuck for use in edge bevel removal of copper from silicon wafers
Grant 6,967,174 - Mayer , et al. November 22, 2 | 2005-11-22 |
Methods and apparatus for controlling electrolyte flow for uniform plating
Grant 6,964,792 - Mayer , et al. November 15, 2 | 2005-11-15 |
Process for electroplating metal into microscopic recessed features
Grant 6,946,065 - Mayer , et al. September 20, 2 | 2005-09-20 |
Uniform electroplating of thin metal seeded wafers using rotationally asymmetric variable anode correction
Grant 6,919,010 - Mayer July 19, 2 | 2005-07-19 |
Copper electroplating method and apparatus
Grant 6,890,416 - Mayer , et al. May 10, 2 | 2005-05-10 |
Anode and anode chamber for copper electroplating
Grant 6,821,407 - Reid , et al. November 23, 2 | 2004-11-23 |
Clamshell apparatus for electrochemically treating wafers
Grant 6,800,187 - Reid , et al. October 5, 2 | 2004-10-05 |
Electroplating process for avoiding defects in metal features of integrated circuit devices
Grant 6,793,796 - Reid , et al. September 21, 2 | 2004-09-21 |
Method and apparatus for uniform electroplating of thin metal seeded wafers using multiple segmented virtual anode sources
Grant 6,773,571 - Mayer , et al. August 10, 2 | 2004-08-10 |
Clamshell apparatus with dynamic uniformity control
Grant 6,755,946 - Patton , et al. June 29, 2 | 2004-06-29 |
Electrochemical treatment of integrated circuit substrates using concentric anodes and variable field shaping elements
Grant 6,755,954 - Mayer , et al. June 29, 2 | 2004-06-29 |
Liquid treatment using thin liquid layer
App 20040065540 - Mayer, Steven T. ; et al. | 2004-04-08 |
Methods and apparatus for airflow and heat management in electroless plating
Grant 6,713,122 - Mayer , et al. March 30, 2 | 2004-03-30 |
Method and apparatus for uniform electropolishing of damascene ic structures by selective agitation
Grant 6,709,565 - Mayer , et al. March 23, 2 | 2004-03-23 |
Electroless copper deposition method for preparing copper seed layers
Grant 6,664,122 - Andryuschenko , et al. December 16, 2 | 2003-12-16 |
Edge bevel removal of copper from silicon wafers
Grant 6,586,342 - Mayer , et al. July 1, 2 | 2003-07-01 |
Apparatus for potential controlled electroplating of fine patterns on semiconductor wafers
Grant 6,562,204 - Mayer , et al. May 13, 2 | 2003-05-13 |
Dynamically variable field shaping element
App 20030079995 - Contolini, Robert J. ; et al. | 2003-05-01 |
Method for potential controlled electroplating of fine patterns on semiconductor wafers
Grant 6,551,483 - Mayer , et al. April 22, 2 | 2003-04-22 |
Methods and apparatus for controlled-angle wafer immersion
Grant 6,551,487 - Reid , et al. April 22, 2 | 2003-04-22 |
Wafer chuck for use in edge bevel removal of copper from silicon wafers
Grant 6,537,416 - Mayer , et al. March 25, 2 | 2003-03-25 |
Copper electroplating apparatus
Grant 6,527,920 - Mayer , et al. March 4, 2 | 2003-03-04 |
Electrochemical treatment of integrated circuit substrates using concentric anodes and variable field shaping elements
App 20020195352 - Mayer, Steven T. ; et al. | 2002-12-26 |
Method and apparatus for uniform electropolishing of damascene ic structures by selective agitation
App 20020074238 - Mayer, Steven T. ; et al. | 2002-06-20 |
Method and apparatus for uniform electroplating of integrated circuits using a variable field shaping element
Grant 6,402,923 - Mayer , et al. June 11, 2 | 2002-06-11 |
Mixed lithium manganese oxide and lithium nickel cobalt oxide positive electrodes
Grant 6,379,842 - Mayer April 30, 2 | 2002-04-30 |
Etchant mixing system for edge bevel removal of copper from silicon wafers
Grant 6,333,275 - Mayer , et al. December 25, 2 | 2001-12-25 |
Method for fabricating composite carbon foam
Grant 6,332,990 - Mayer , et al. December 25, 2 | 2001-12-25 |
Electroplanarization of large and small damascene features using diffusion barriers and electropolishing
Grant 6,315,883 - Mayer , et al. November 13, 2 | 2001-11-13 |
Edge bevel removal of copper from silicon wafers
Grant 6,309,981 - Mayer , et al. October 30, 2 | 2001-10-30 |
Electroplating process for avoiding defects in metal features of integrated circuit devices
App 20010015321 - Reid, Jonathan D. ; et al. | 2001-08-23 |
Disk-assisted editing for recorded video material
Grant 6,201,924 - Crane , et al. March 13, 2 | 2001-03-13 |
Mixed lithium manganese oxide and lithium nickel cobalt oxide positive electrodes
Grant 6,007,947 - Mayer December 28, 1 | 1999-12-28 |
Method for making thin carbon foam electrodes
Grant 5,932,185 - Pekala , et al. August 3, 1 | 1999-08-03 |
Organic aerogel microspheres
Grant 5,908,896 - Mayer , et al. June 1, 1 | 1999-06-01 |
Capacitor with a composite carbon foam electrode
Grant 5,898,564 - Mayer , et al. April 27, 1 | 1999-04-27 |
Process for producing carbon foams for energy storage devices
Grant 5,789,338 - Kaschmitter , et al. August 4, 1 | 1998-08-04 |
Lithium nickel cobalt oxides for positive electrodes
Grant 5,783,333 - Mayer July 21, 1 | 1998-07-21 |
Overcharge protection battery vent
Grant 5,741,606 - Mayer , et al. April 21, 1 | 1998-04-21 |
Fabricating solid carbon porous electrodes from powders
Grant 5,636,437 - Kaschmitter , et al. June 10, 1 | 1997-06-10 |
Composite carbon foam electrode
Grant 5,626,977 - Mayer , et al. May 6, 1 | 1997-05-06 |
Cell cap assembly having frangible tab disconnect mechanism
Grant 5,609,972 - Kaschmitter , et al. March 11, 1 | 1997-03-11 |
Carbon aerogel electrodes for direct energy conversion
Grant 5,601,938 - Mayer , et al. February 11, 1 | 1997-02-11 |
Carbon foams for energy storage devices
Grant 5,529,971 - Kaschmitter , et al. June 25, 1 | 1996-06-25 |
Organic aerogel microspheres and fabrication method therefor
Grant 5,508,341 - Mayer , et al. April 16, 1 | 1996-04-16 |
Removal of field and embedded metal by spin spray etching
Grant 5,486,234 - Contolini , et al. January 23, 1 | 1996-01-23 |
Method of low pressure and/or evaporative drying of aerogel
Grant 5,420,168 - Mayer , et al. May 30, 1 | 1995-05-30 |
Aquagel electrode separator for use in batteries and supercapacitors
Grant 5,402,306 - Mayer , et al. March 28, 1 | 1995-03-28 |
Cell separator for use in bipolar-stack energy storage devices
Grant 5,393,619 - Mayer , et al. February 28, 1 | 1995-02-28 |
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