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Patent applications and USPTO patent grants for Mayer; Linda J..The latest application filed is for "high speed copper electroplating process and bath therefor".
Patent | Date |
---|---|
High speed copper electroplating process and bath therefor Grant 4,555,315 - Barbieri , et al. November 26, 1 | 1985-11-26 |
Process and composition for the electrodeposition of tin and tin alloys Grant 4,381,228 - Teichmann , et al. April 26, 1 | 1983-04-26 |
Electroplating tin and tin alloys and baths therefor Grant 4,347,107 - Teichmann , et al. August 31, 1 | 1982-08-31 |
Electrodeposition of bright copper Grant 4,336,114 - Mayer , et al. June 22, 1 | 1982-06-22 |
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