| Patent | Date |
|---|
Microelectronic device with embedded die substrate on interposer
Grant 11,430,740 - May , et al. August 30, 2 | 2022-08-30 |
Microelectronic Device With Embedded Die Substrate On Interposer
App 20220230965 - MAY; Robert Alan ; et al. | 2022-07-21 |
Electromigration Resistant And Profile Consistent Contact Arrays
App 20220199515 - PIETAMBARAM; Srinivas V. ; et al. | 2022-06-23 |
Faraday Rotator Optical Interconnects For Optical Insulator In Semiconductor Substrate Packaging
App 20220187549 - TANAKA; Hiroki ; et al. | 2022-06-16 |
Faraday Rotator Interconnect As A Through-via Configuration In A Patch Architecture
App 20220187548 - MARIN; Brandon C. ; et al. | 2022-06-16 |
Microelectronic Component Having Molded Regions With Through-mold Vias
App 20220181262 - Ganesan; Sanka ; et al. | 2022-06-09 |
Electromigration resistant and profile consistent contact arrays
Grant 11,309,239 - Pietambaram , et al. April 19, 2 | 2022-04-19 |
Microelectronic component having molded regions with through-mold vias
Grant 11,302,643 - Ganesan , et al. April 12, 2 | 2022-04-12 |
Microelectronic Device With Embedded Die Substrate On Interposer
App 20220108957 - MAY; Robert Alan ; et al. | 2022-04-07 |
Embedded Multi-die Interconnect Bridge Having A Molded Region With Through-mold Vias
App 20220093515 - Akkinepally; Praneeth Kumar ; et al. | 2022-03-24 |
Semiconductor package having a coaxial first layer interconnect
Grant 11,244,912 - Vadlamani , et al. February 8, 2 | 2022-02-08 |
Embedded multi-die interconnect bridge having a molded region with through-mold vias
Grant 11,233,009 - Akkinepally , et al. January 25, 2 | 2022-01-25 |
Microelectronic Structures Including Bridges
App 20210391263 - Nie; Bai ; et al. | 2021-12-16 |
Rfic Having Coaxial Interconnect And Molded Layer
App 20210358872 - PIETAMBARAM; Srinivas V. ; et al. | 2021-11-18 |
Die Interconnect Substrate, an Electrical Device and a Method for Forming a Die Interconnect Substrate
App 20210320066 - MAY; Robert Alan ; et al. | 2021-10-14 |
Embedded Multi-die Interconnect Bridge Having A Molded Region With Through-mold Vias
App 20210305163 - Akkinepally; Praneeth Kumar ; et al. | 2021-09-30 |
Microelectronic Component Having Molded Regions With Through-mold Vias
App 20210305162 - Ganesan; Sanka ; et al. | 2021-09-30 |
Embedded Die Architecture And Method Of Making
App 20210305108 - Sankman; Robert L. ; et al. | 2021-09-30 |
Device And Method Of Very High Density Routing Used With Embedded Multi-die Interconnect Bridge
App 20210280517 - May; Robert Alan ; et al. | 2021-09-09 |
Pseudo-stripline using double solder-resist structure
Grant 11,107,780 - May , et al. August 31, 2 | 2021-08-31 |
RFIC having coaxial interconnect and molded layer
Grant 11,107,781 - Pietambaram , et al. August 31, 2 | 2021-08-31 |
Embedded Multi-die Interconnect Bridge Packages With Lithotgraphically Formed Bumps And Methods Of Assembling Same
App 20210257303 - ALUR; Amruthavalli Pallavi ; et al. | 2021-08-19 |
Package substrate having polymer-derived ceramic core
Grant 11,075,130 - Chen , et al. July 27, 2 | 2021-07-27 |
Die interconnect substrate, an electrical device and a method for forming a die interconnect substrate
Grant 11,069,620 - May , et al. July 20, 2 | 2021-07-20 |
Embedded multi-die interconnect bridge packages with lithotgraphically formed bumps and methods of assembling same
Grant 11,043,457 - Alur , et al. June 22, 2 | 2021-06-22 |
Package substrate having copper alloy sputter seed layer and high density interconnects
Grant 11,037,802 - May , et al. June 15, 2 | 2021-06-15 |
A Die Interconnect Substrate, an Electrical Device and a Method for Forming a Die Interconnect Substrate
App 20210134723 - MAY; Robert Alan ; et al. | 2021-05-06 |
Die interconnect substrate, an electrical device, and a method for forming a die interconnect substrate
Grant 10,978,399 - Darmawikarta , et al. April 13, 2 | 2021-04-13 |
Package Substrate With High-density Interconnect Layer Having Pillar And Via Connections For Fan Out Scaling
App 20210066232 - May; Robert Alan ; et al. | 2021-03-04 |
Semiconductor device including silane based adhesion promoter and method of making
Grant 10,916,486 - Brown , et al. February 9, 2 | 2021-02-09 |
Electromigration Resistant And Profile Consistent Contact Arrays
App 20210035901 - PIETAMBARAM; Srinivas V. ; et al. | 2021-02-04 |
Package substrate with high-density interconnect layer having pillar and via connections for fan out scaling
Grant 10,872,872 - May , et al. December 22, 2 | 2020-12-22 |
Pseudo-stripline Using Double Solder-resist Structure
App 20200388582 - May; Lilia ; et al. | 2020-12-10 |
Electromigration resistant and profile consistent contact arrays
Grant 10,854,541 - Pietambaram , et al. December 1, 2 | 2020-12-01 |
Package substrates with integral devices
Grant 10,790,233 - May , et al. September 29, 2 | 2020-09-29 |
Embedded Multi-die Interconnect Bridge Packages With Lithotgraphically Formed Bumps And Methods Of Assembling Same
App 20200303310 - ALUR; Amruthavalli Pallavi ; et al. | 2020-09-24 |
Patch Accomodating Embedded Dies Having Different Thicknesses
App 20200266184 - PIETAMBARAM; Srinivas ; et al. | 2020-08-20 |
Multi-die microelectronic device with integral heat spreader
Grant 10,741,534 - Aleksov , et al. A | 2020-08-11 |
Substrate integrated waveguide
Grant 10,705,293 - May , et al. | 2020-07-07 |
Embedded multi-die interconnect bridge packages with lithographically formed bumps and methods of assembling same
Grant 10,707,168 - Alur , et al. | 2020-07-07 |
Semiconductor Package Having A Coaxial First Layer Interconnect
App 20200168569 - VADLAMANI; Sai ; et al. | 2020-05-28 |
Multi-die Microelectronic Device With Integral Heat Spreader
App 20200105731 - Aleksov; Aleksandar ; et al. | 2020-04-02 |
Die Interconnect Substrate, an Electrical Device, and a Method for Forming a Die Interconnect Substrate
App 20200051915 - Darmawikarta; Kristof ; et al. | 2020-02-13 |
Package Substrate Having Polymer-derived Ceramic Core
App 20190393109 - CHEN; Lisa Ying Ying ; et al. | 2019-12-26 |
Electromigration Resistant And Profile Consistent Contact Arrays
App 20190393145 - Pietambaram; Srinivas V. ; et al. | 2019-12-26 |
Rfic Having Coaxial Interconnect And Molded Layer
App 20190393172 - PIETAMBARAM; Srinivas V. ; et al. | 2019-12-26 |
Package Substrate With High-density Interconnect Layer Having Pillar And Via Connections For Fan Out Scaling
App 20190363063 - MAY; Robert Alan ; et al. | 2019-11-28 |
Semiconductor Device And Method Of Making
App 20190355642 - Brown; Andrew J. ; et al. | 2019-11-21 |
Microelectronic Device With Embedded Die Substrate On Interposer
App 20190341351 - May; Robert Alan ; et al. | 2019-11-07 |
Electromigration resistant and profile consistent contact arrays
Grant 10,431,537 - Pietambaram , et al. O | 2019-10-01 |
Package Substrate Having Copper Alloy Sputter Seed Layer And High Density Interconnects
App 20190259631 - MAY; Robert Alan ; et al. | 2019-08-22 |
Substrate Integrated Waveguide
App 20190250326 - May; Robert Alan ; et al. | 2019-08-15 |
Embedded Multi-die Interconnect Bridge Packages With Lithotgraphically Formed Bumps And Methods Of Assembling Same
App 20190198445 - Alur; Amruthavalli Pallavi ; et al. | 2019-06-27 |
Package Substrates With Integral Devices
App 20190157210 - May; Robert Alan ; et al. | 2019-05-23 |
Package Integrated Passives
App 20190006457 - Aleksov; Aleksandar ; et al. | 2019-01-03 |
Embedded multi-die interconnect bridge packages with lithotgraphically formed bumps and methods of assembling same
Grant 10,163,798 - Alur , et al. Dec | 2018-12-25 |
Package with passivated interconnects
Grant 10,043,740 - Boyapati , et al. August 7, 2 | 2018-08-07 |
Metal protected fan-out cavity
Grant 9,953,959 - Darmawikarta , et al. April 24, 2 | 2018-04-24 |
Package With Passivated Interconnects
App 20180019197 - BOYAPATI; SRI RANGA SAI ; et al. | 2018-01-18 |
Plasma etching of solder resist openings
Grant 9,820,386 - Darmawikarta , et al. November 14, 2 | 2017-11-14 |
Plasma Etching Of Solder Resist Openings
App 20170273187 - Darmawikarta; Kristof ; et al. | 2017-09-21 |
Nondestructive Optical Detection Of Trace Undercut, Width And Thickness
App 20170059303 - May; Robert Alan ; et al. | 2017-03-02 |
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