May; Lilia

Patent Applications and Registrations

Patent applications and USPTO patent grants for May; Lilia.The latest application filed is for "apparatus with embedded fine line space in a cavity, and a method for forming the same".

Company Profile

8.9.12

May; Lilia - Chandler AZ

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Apparatus With Embedded Fine Line Space In A Cavity, And A Method For Forming The Same App 20220183157 - Darmawikarta; Kristof ; et al.	2022-06-09
Apparatus with embedded fine line space in a cavity, and a method for forming the same Grant 11,272,619 - Darmawikarta , et al. March 8, 2	2022-03-08
High Density Organic Interconnect Structures App 20220059367 - Chavali; Sri Chaitra Jyotsna ; et al.	2022-02-24
High density organic interconnect structures Grant 11,195,727 - Chavali , et al. December 7, 2	2021-12-07
An Apparatus With Embedded Fine Line Space In A Cavity, And A Method For Forming The Same App 20210307172 - Darmawikarta; Kristof ; et al.	2021-09-30
Pseudo-stripline using double solder-resist structure Grant 11,107,780 - May , et al. August 31, 2	2021-08-31
Package substrate having polymer-derived ceramic core Grant 11,075,130 - Chen , et al. July 27, 2	2021-07-27
Pseudo-stripline Using Double Solder-resist Structure App 20200388582 - May; Lilia ; et al.	2020-12-10
High Density Organic Interconnect Structures App 20200312675 - Chavali; Sri Chaitra Jyotsna ; et al.	2020-10-01
High density organic interconnect structures Grant 10,685,850 - Chavali , et al.	2020-06-16
Substrate Embedded Heat Pipe App 20200176355 - May; Robert A. ; et al.	2020-06-04
Methods of forming joint structures for surface mount packages Grant 10,573,622 - May , et al. Feb	2020-02-25
Package Substrate Having Polymer-derived Ceramic Core App 20190393109 - CHEN; Lisa Ying Ying ; et al.	2019-12-26
Methods Of Forming Joint Structures For Surface Mount Packages App 20190103377 - May; Lilia ; et al.	2019-04-04
Package structure to enhance yield of TMI interconnections Grant 10,049,971 - De Bonis , et al. August 14, 2	2018-08-14
Package Structure To Enhance Yield of TMI Interconnections App 20170207152 - De Bonis; Thomas J. ; et al.	2017-07-20
Package structure to enhance yield of TMI interconnections Grant 9,613,933 - De Bonis , et al. April 4, 2	2017-04-04
Package Structure To Enhance Yield of TMI Interconnections App 20150255415 - De Bonis; Thomas J. ; et al.	2015-09-10

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