| Patent | Date |
|---|
Physical Quantity Sensor And Semiconductor Device
App 20220242723 - MAWATARI; Kazuaki ; et al. | 2022-08-04 |
Piezoelectric Element, Piezoelectric Device, And Manufacturing Method Of Piezoelectric Element
App 20220232328 - Mawatari; Kazuaki ; et al. | 2022-07-21 |
Semiconductor device and method for producing the semiconductor device
Grant 11,355,357 - Mawatari June 7, 2 | 2022-06-07 |
Sensing System And Storage Medium Storing Data Structure Used In Sensing System
App 20210364443 - MORI; Hodaka ; et al. | 2021-11-25 |
Semiconductor device
Grant 11,183,480 - Mawatari November 23, 2 | 2021-11-23 |
Semiconductor Device And Method For Manufacturing Same
App 20210335740 - FUJIEDA; Mariko ; et al. | 2021-10-28 |
Semiconductor device and method for manufacturing same
Grant 11,127,702 - Fujieda , et al. September 21, 2 | 2021-09-21 |
Bonded body and method for manufacturing the same
Grant 11,027,360 - Mawatari June 8, 2 | 2021-06-08 |
Pressure sensor
Grant 10,983,022 - Kawano , et al. April 20, 2 | 2021-04-20 |
Raindrop Recognition Device, Vehicular Control Apparatus, Method Of Training Model, And Trained Model
App 20210101564 - BANNO; Yoshihisa ; et al. | 2021-04-08 |
Physical Quantity Sensor And Semiconductor Device
App 20200407216 - MAWATARI; Kazuaki ; et al. | 2020-12-31 |
Semiconductor Device And Method For Producing The Semiconductor Device
App 20200152482 - MAWATARI; Kazuaki | 2020-05-14 |
Bonded Body And Method For Manufacturing The Same
App 20190375040 - MAWATARI; Kazuaki | 2019-12-12 |
Semiconductor Device
App 20190371762 - MAWATARI; Kazuaki | 2019-12-05 |
Physical Quantity Sensor And Semiconductor Device
App 20190256349 - KUROKAWA; Keisuke ; et al. | 2019-08-22 |
Semiconductor Device And Method For Manufacturing Same
App 20190252336 - FUJIEDA; Mariko ; et al. | 2019-08-15 |
Pressure Sensor
App 20190178738 - KAWANO; Shinji ; et al. | 2019-06-13 |
Bonding Structure Manufacturing Method, Heating And Melting Treatment Method, And System Therefor
App 20150314385 - ABE; Hideyuki ; et al. | 2015-11-05 |
Bonding structure manufacturing method, heating and melting treatment method, and system therefor
Grant 9,119,336 - Abe , et al. August 25, 2 | 2015-08-25 |
Bonding Structure Manufacturing Method, Heating And Melting Treatment Method, And System Therefor
App 20140246481 - ABE; Hideyuki ; et al. | 2014-09-04 |
Bonding structure manufacturing method, heating and melting treatment method, and system therefor
Grant 8,757,474 - Abe , et al. June 24, 2 | 2014-06-24 |
Semiconductor flip-chip system having three-dimensional solder joints
Grant 8,587,122 - Mawatari November 19, 2 | 2013-11-19 |
Two-solder Method For Self-aligning Solder Bumps In Semiconductor Assembly
App 20130228916 - Mawatari; Kazuaki | 2013-09-05 |
Bonding Structure Manufacturing Method, Heating And Melting Treatment Method, And System Therefor
App 20130105558 - Abe; Hideyuki ; et al. | 2013-05-02 |
Semiconductor Flip-chip System Having Three-dimensional Solder Joints
App 20130049189 - Mawatari; Kazuaki | 2013-02-28 |
Thermal Compression Bonding With Separate Bond Heads
App 20130032270 - MAWATARI; KAZUAKI | 2013-02-07 |
Protruding TSV tips for enhanced heat dissipation for IC devices
Grant 8,294,261 - Mawatari , et al. October 23, 2 | 2012-10-23 |
Integrated Circuit Having Protruding Bonding Features With Reinforcing Dielectric Supports
App 20120193778 - Mawatari; Kazuaki | 2012-08-02 |
Protruding Tsv Tips For Enhanced Heat Dissipation For Ic Devices
App 20110186990 - Mawatari; Kazuaki ; et al. | 2011-08-04 |
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