Maveety; James G.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Maveety; James G..The latest application filed is for "integrated circuit test temperature control mechanism".

Company Profile

0.41.39

Maveety; James G. - Campbell CA
Maveety; James G. - San Jose CA US

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Integrated circuit test temperature control mechanism Grant 9,869,714 - Johnson , et al. January 16, 2	2018-01-16
Integrated Circuit Test Temperature Control Mechanism App 20160291083 - Johnson; John C. ; et al.	2016-10-06
Direct liquid-contact micro-channel heat transfer devices, methods of temperature control for semiconductive devices, and processes of forming same Grant 9,448,278 - Schroeder , et al. September 20, 2	2016-09-20
Apparatus to minimize thermal impedance using copper on die backside Grant 9,406,582 - Hua , et al. August 2, 2	2016-08-02
Integrated circuit test temperature control mechanism Grant 9,400,291 - Johnson , et al. July 26, 2	2016-07-26
Direct liquid-contact micro-channel heat transfer devices, methods of temperature control for semiconductive devices, and processes of forming same Grant 9,347,987 - Schroeder , et al. May 24, 2	2016-05-24
Direct Liquid-contact Micro-channel Heat Transfer Devices, Methods Of Temperature Control For Semiconductive Devices, And Processes Of Forming Same App 20150285857 - SCHROEDER; Christopher R. ; et al.	2015-10-08
Seal method for direct liquid cooling of probes used at first level interconnect Grant 9,046,569 - Kirby , et al. June 2, 2	2015-06-02
Thermal interface for multi-chip packages Grant 8,891,235 - Walczyk , et al. November 18, 2	2014-11-18
Seal Method For Direct Liquid Cooling Of Probes Used At First Level Interconnect App 20140125367 - Kirby; Ronald ; et al.	2014-05-08
Integrated Circuit Test Temperature Control Mechanism App 20140062513 - Johnson; John C. ; et al.	2014-03-06
Nanotube based vapor chamber for die level cooling Grant 8,623,705 - Vadakkanmaruveedu , et al. January 7, 2	2014-01-07
Thermal Interface For Multi-chip Packages App 20140002994 - Walczyk; Joseph F. ; et al.	2014-01-02
Die having a via filled with a heat-dissipating material Grant 8,505,613 - Chrysler , et al. August 13, 2	2013-08-13
Process that includes assembling together first and second substrates the have respective first and second carbon nanotube arrays with geometrically complementary patterns Grant 8,404,519 - Chrysler , et al. March 26, 2	2013-03-26
Carbon nanotube micro-chimney and thermo siphon die-level cooling Grant 8,125,075 - Maveety , et al. February 28, 2	2012-02-28
Carbon Nanotube Micro-chimney And Thermo Siphon Die-level Cooling App 20120021566 - Maveety; James G. ; et al.	2012-01-26
Micro-chimney And Thermosiphon Die-level Cooling App 20110297362 - Chrysler; Gregory M. ; et al.	2011-12-08
Nanotube Based Vapor Chamber For Die Level Cooling App 20110269271 - VADAKKANMARUVEEDU; Unnikrishnan ; et al.	2011-11-03
Carbon Nanotube And Metal Thermal Interface Material, Process Of Making Same, Packages Containing Same, And Systems Containing Same App 20110214285 - Chrysler; Gregory M. ; et al.	2011-09-08
Micro-chimney and thermosiphon die-level cooling Grant 8,006,747 - Chrysler , et al. August 30, 2	2011-08-30
Process of making carbon nanotube array that includes impregnating the carbon nanotube array with metal Grant 7,964,447 - Chrysler , et al. June 21, 2	2011-06-21
Direct liquid-contact micro-channel heat transfer devices, methods of temperature control for semiconductive devices, and processes of forming same App 20110109335 - Schroeder; Christopher R. ; et al.	2011-05-12
Nanotube based vapor chamber for die level cooling Grant 7,911,052 - Vadakkanmaruveedu , et al. March 22, 2	2011-03-22
Thermal interface material with carbon nanotubes and particles Grant 7,886,813 - Hua , et al. February 15, 2	2011-02-15
Integrated re-combiner for electroosmotic pumps using porous frits Grant 7,723,208 - Kim , et al. May 25, 2	2010-05-25
Method of forming a stack of heat generating integrated circuit chips with intervening cooling integrated circuit chips Grant 7,696,015 - Kim , et al. April 13, 2	2010-04-13
Carbon nanotube and metal thermal interface material, process of making same, packages containing same, and systems containing same App 20090218681 - Chrysler; Gregory M. ; et al.	2009-09-03
Using external radiators with electroosmotic pumps for cooling integrated circuits Grant 7,576,432 - Kim , et al. August 18, 2	2009-08-18
Article having metal impregnated within carbon nanotube array Grant 7,545,030 - Chrysler , et al. June 9, 2	2009-06-09
Micro-chimney and thermosiphon die-level cooling App 20090129022 - Chrysler; Gregory M. ; et al.	2009-05-21
Nanotube Based Vapor Chamber For Die Level Cooling App 20090085198 - Vadakkanmaruveedu; Unnikrishnan ; et al.	2009-04-02
Diamond-silicon hybrid integrated heat spreader Grant 7,492,041 - Ravi , et al. February 17, 2	2009-02-17
Micro-chimney and thermosiphon die-level cooling Grant 7,487,822 - Chrysler , et al. February 10, 2	2009-02-10
Forming carbon nanotube capacitors App 20080305603 - Mosley; Larry E. ; et al.	2008-12-11
Apparatus To Minimize Thermal Impedance Using Copper On Die Backside App 20080296754 - Hua; Fay ; et al.	2008-12-04
Apparatus to minimize thermal impedance using copper on die backside Grant 7,449,780 - Hua , et al. November 11, 2	2008-11-11
Forming carbon nanotube capacitors Grant 7,428,138 - Mosley , et al. September 23, 2	2008-09-23
Carbon nanotube micro-chimney and thermo siphon die-level cooling Grant 7,335,983 - Maveety , et al. February 26, 2	2008-02-26
Compliant conductive interconnects App 20070297151 - Mosley; Larry E. ; et al.	2007-12-27
Packaged electroosmotic pumps using porous frits for cooling integrated circuits App 20070278668 - Kim; Sarah E. ; et al.	2007-12-06
Forming carbon nanotube capacitors App 20070242417 - Mosley; Larry E. ; et al.	2007-10-18
Packaged electroosmotic pumps using porous frits for cooling integrated circuits Grant 7,274,106 - Kim , et al. September 25, 2	2007-09-25
Carbon nanotube and metal thermal interface material, process of making same, packages containing same, and systems containing same App 20070155136 - Chrysler; Gregory M. ; et al.	2007-07-05
Carbon nanotube micro-chimney and thermo siphon die-level cooling App 20070138623 - Maveety; James G. ; et al.	2007-06-21
Thermal interface material and method App 20070001310 - Hua; Fay ; et al.	2007-01-04
Electroosmotic pumps using porous frits for cooling integrated circuit stacks App 20060226541 - Kim; Sarah E. ; et al.	2006-10-12
Electroosmotic pumps using porous frits for cooling integrated circuit stacks Grant 7,084,495 - Kim , et al. August 1, 2	2006-08-01
Micro-impeller miniature centrifugal compressor Grant 7,021,891 - Sanchez , et al. April 4, 2	2006-04-04
Using external radiators with electroosmotic pumps for cooling integrated circuits App 20060055030 - Kim; Sarah E. ; et al.	2006-03-16
Micro-chimney and thermosiphon die-level cooling App 20060032608 - Chrysler; Gregory M. ; et al.	2006-02-16
Using external radiators with electroosmotic pumps for cooling integrated circuits Grant 6,992,381 - Kim , et al. January 31, 2	2006-01-31
Micro-chimney and thermosiphon die-level cooling Grant 6,988,531 - Chrysler , et al. January 24, 2	2006-01-24
Diamond-silicon hybrid integrated heat spreader App 20050179126 - Ravi, Kramadhati V. ; et al.	2005-08-18
Diamond-silicon hybrid integrated heat spreader Grant 6,924,170 - Ravi , et al. August 2, 2	2005-08-02
Two-phase pumped liquid loop for mobile computer cooling Grant 6,906,919 - Pokharna , et al. June 14, 2	2005-06-14
Using external radiators with electroosmotic pumps for cooling integrated circuits App 20050093138 - Kim, Sarah E. ; et al.	2005-05-05
Electroosmotic pumps using porous frits for cooling integrated circuit stacks App 20050085018 - Kim, Sarah E. ; et al.	2005-04-21
Integrated re-combiner for electroosmotic pumps using porous frits App 20050074953 - Kim, Sarah E. ; et al.	2005-04-07
Two-phase pumped liquid loop for mobile computer cooling App 20050068724 - Pokharna, Himanshu ; et al.	2005-03-31
Packaged electroosmotic pumps using porous frits for cooling integrated circuits App 20050062150 - Kim, Sarah E. ; et al.	2005-03-24
Diamond-silicon hybrid integrated heat spreader App 20040266056 - Ravi, Kramadhati V. ; et al.	2004-12-30
Apparatus and method to minimize thermal impedance using copper on die backside App 20040188817 - Hua, Fay ; et al.	2004-09-30
Embedded liquid pump and microchannel cooling system Grant 6,785,134 - Maveety , et al. August 31, 2	2004-08-31
Embedded Liquid Pump And Microchannel Cooling System App 20040130874 - Maveety, James G. ; et al.	2004-07-08
Micro-impeller miniature centrifugal compressor App 20040120802 - Sanchez, Eduardo A. ; et al.	2004-06-24
Piezoelectric actuated jet impingement cooling Grant 6,650,542 - Chrysler , et al. November 18, 2	2003-11-18
Micro-chimney and thermosiphon die-level cooling App 20030131968 - Chrysler, Gregory M. ; et al.	2003-07-17
Heatpipesink Having Integrated Heat Pipe And Heat Sink App 20020056908 - BROWNELL, MICHAEL PHILIP ; et al.	2002-05-16

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