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name:-0.015017032623291
name:-0.01346492767334
name:-0.0063080787658691
Mauer; Laura Patent Filings

Mauer; Laura

Patent Applications and Registrations

Patent applications and USPTO patent grants for Mauer; Laura.The latest application filed is for "apparatus and method for mixing fluids with degradational properties".

Company Profile
6.10.13
  • Mauer; Laura - South Kent CT
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Two etch method for achieving a wafer thickness profile
Grant 10,553,502 - Mauer , et al. Fe
2020-02-04
Apparatus and method for wafer thinning in advanced packaging applications
Grant 10,541,180 - Mauer , et al. Ja
2020-01-21
Apparatus and method to control properties of fluid discharge via refrigerative exhaust
Grant 10,443,943 - Taddei , et al. Oc
2019-10-15
Apparatus and method to control etch rate through adaptive spiking of chemistry
Grant 10,446,387 - Mauer , et al. Oc
2019-10-15
Apparatus and Method for Mixing Fluids with Degradational Properties
App 20190168178 - Taddei; John ;   et al.
2019-06-06
Apparatus and method for mixing fluids with degradational properties
Grant 10,239,031 - Taddei , et al.
2019-03-26
System And Method For Performing A Wet Etching Process
App 20180294196 - Mauer; Laura ;   et al.
2018-10-11
Apparatus And Method For Wafer Thinning In Advanced Packaging Applications
App 20180254221 - Mauer; Laura ;   et al.
2018-09-06
Method of etching the back of a wafer to expose TSVs
Grant 10,026,660 - Mauer , et al. July 17, 2
2018-07-17
Apparatus and Method to Control Properties of Fluid Discharge Via Refrigerative Exhaust
App 20170284752 - Taddei; John ;   et al.
2017-10-05
Apparatus and Method to Improve Plasma Dicing and Backmetal Cleaving Process
App 20170287768 - Mauer; Laura ;   et al.
2017-10-05
Apparatus And Method To Control Etch Rate Through Adaptive Spiking Of Chemistry
App 20170287793 - Mauer; Laura ;   et al.
2017-10-05
System and method for flux coat, reflow and clean
Grant 9,694,436 - Breingan , et al. July 4, 2
2017-07-04
System and method for performing a wet etching process
Grant 9,698,062 - Mauer , et al. July 4, 2
2017-07-04
Apparatus and method for removing challenging polymer films and structures from semiconductor wafers
Grant 9,541,837 - Taddei , et al. January 10, 2
2017-01-10
Apparatus and Method for Mixing Fluids with Degradational Properties
App 20160288070 - Taddei; John ;   et al.
2016-10-06
Apparatus and method to remove undissolved solids from post process dry film strip solvents
Grant 9,333,446 - Taddei , et al. May 10, 2
2016-05-10
System And Method For Performing A Wet Etching Process
App 20160126148 - Mauer; Laura ;   et al.
2016-05-05
System And Method For Flux Coat, Reflow And Clean
App 20150122876 - Breingan; William Gilbert ;   et al.
2015-05-07
Apparatus and Method for Removing Challenging Polymer Films and Structures from Semiconductor Wafers
App 20140377951 - Taddei; John ;   et al.
2014-12-25
Apparatus And Method To Remove Undissolved Solids From Post Process Dry Film Strip Solvents
App 20140305886 - Taddei; John ;   et al.
2014-10-16
System And Method For Performing A Wet Etching Process
App 20140242731 - Mauer; Laura ;   et al.
2014-08-28
Ic Waper Carrier Sealed From Ambient Atmosphere During Transportation From One Process To The Next
App 20100051501 - Corbin, JR.; William E. ;   et al.
2010-03-04

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