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Patent applications and USPTO patent grants for Mau; Hendrik T..The latest application filed is for "electromigration risk analysis in integrated circuit power interconnect systems using pseudo dynamic simulation".
Patent | Date |
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Electromigration risk analysis in integrated circuit power interconnect systems using pseudo dynamic simulation Grant 6,880,139 - Mau , et al. April 12, 2 | 2005-04-12 |
Electromigration risk analysis in integrated circuit power interconnect systems using pseudo dynamic simulation App 20040168136 - Mau, Hendrik T. ;   et al. | 2004-08-26 |
Pseudo dynamic current estimating for circuits App 20030229480 - Mau, Hendrik T. | 2003-12-11 |
Designing integrated circuits to reduce electromigration effects App 20030066036 - Mau, Hendrik T. | 2003-04-03 |
Designing integrated circuits to reduce temperature induced electromigration effects Grant 6,532,570 - Mau March 11, 2 | 2003-03-11 |
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