Patent | Date |
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Method of fabrication of on-chip heat pipes and ancillary heat transfer components Grant 7,781,884 - Ajmera , et al. August 24, 2 | 2010-08-24 |
Air gap in integrated circuit inductor fabrication Grant 7,642,619 - Matz , et al. January 5, 2 | 2010-01-05 |
Air Gap In Integrated Circuit Inductor Fabrication App 20090261453 - Matz; Phillip D. ;   et al. | 2009-10-22 |
Air gap in integrated circuit inductor fabrication Grant 7,566,627 - Matz , et al. July 28, 2 | 2009-07-28 |
Method of Fabrication of On-Chip Heat Pipes and Ancillary Heat Transfer Components App 20090085197 - Ajmera; Sameer Kumar ;   et al. | 2009-04-02 |
Use of supercritical fluid for low effective dielectric constant metallization Grant 7,485,963 - Papa Rao , et al. February 3, 2 | 2009-02-03 |
Air Gap In Integrated Circuit Inductor Fabrication App 20090001510 - Matz; Phillip D ;   et al. | 2009-01-01 |
Method for removing residue containing an embedded metal App 20070184666 - Smith; Patricia Beauregard ;   et al. | 2007-08-09 |
Use of Supercritical Fluid for Low Effective Dielectric Constant Metallization App 20070102821 - Papa Rao; Satyavolu S. ;   et al. | 2007-05-10 |
Single lithography-step planar metal-insulator-metal capacitor and resistor App 20070080426 - Matz; Phillip D. ;   et al. | 2007-04-12 |
Single mask MIM capacitor and resistor with in trench copper drift barrier Grant 7,189,615 - Rao , et al. March 13, 2 | 2007-03-13 |
Use of supercritical fluid for low effective dielectric constant metallization Grant 7,179,747 - Papa Rao , et al. February 20, 2 | 2007-02-20 |
Metal insulator metal (MIM) capacitor fabrication with sidewall barrier removal aspect Grant 7,115,467 - Ajmera , et al. October 3, 2 | 2006-10-03 |
Single mask MIM capacitor and resistor with in trench copper drift barrier App 20060160299 - Rao; Satyavolu Srinivas Papa ;   et al. | 2006-07-20 |
Damage-free resist removal process for ultra-low-k processing Grant 7,067,441 - Smith , et al. June 27, 2 | 2006-06-27 |
Method to reduce silanol and improve barrier properties in low k dielectric ic interconnects Grant 7,037,823 - Matz , et al. May 2, 2 | 2006-05-02 |
Metal insulator metal (MIM) capacitor fabrication with sidewall barrier removal aspect App 20060024902 - Ajmera; Sameer Kumar ;   et al. | 2006-02-02 |
Extraction of impurities in a semiconductor process with a supercritical fluid App 20050241672 - Matz, Phillip D. ;   et al. | 2005-11-03 |
Method to reduce silanol and improve barrier properties in low K dielectric IC interconnects App 20050233586 - Matz, Phillip D. ;   et al. | 2005-10-20 |
Use of supercritical fluid for low effective dielectric constant metallization App 20050167841 - Papa Rao, Satyavolu S. ;   et al. | 2005-08-04 |
Damage-free resist removal process for ultra-low-k processing App 20050101125 - Smith, Patricia B. ;   et al. | 2005-05-12 |
Chemical treatment of low-k dielectric films Grant 6,838,300 - Jin , et al. January 4, 2 | 2005-01-04 |
Chemical treatment of low-k dielectric films App 20040150012 - Jin, Changming ;   et al. | 2004-08-05 |
Hexamethyldisilazane treatment of low-k dielectric films App 20040152296 - Matz, Phillip D. ;   et al. | 2004-08-05 |