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Chemical mechanical planarization (CMP) composition and methods therefore for copper and through silica via (TSV) applications
Grant 11,401,441 - Shi , et al. August 2, 2 | 2022-08-02 |
Chemical Mechanical Planarization (CMP) Composition and Methods Therefore for Copper and Through Silica Via (TSV) Applications
App 20190055430 - Shi; Xiaobo ; et al. | 2019-02-21 |
Photoresist cleaning composition used in photolithography and a method for treating substrate therewith
Grant 10,072,237 - Chang , et al. September 11, 2 | 2018-09-11 |
Photoresist Cleaning Composition Used in Photolithography and a Method for Treating Substrate Therewith
App 20170037344 - Chang; Randy Li-Kai ; et al. | 2017-02-09 |
Low K precursors providing superior integration attributes
Grant 9,018,107 - Haas , et al. April 28, 2 | 2015-04-28 |
Dielectric barrier deposition using nitrogen containing precursor
Grant 8,889,235 - Mallikarjunan , et al. November 18, 2 | 2014-11-18 |
Low K Precursors Providing Superior Integration Attributes
App 20140242813 - Haas; Mary Kathryn ; et al. | 2014-08-28 |
Low k precursors providing superior integration attributes
Grant 8,753,986 - Haas , et al. June 17, 2 | 2014-06-17 |
Dielectric barrier deposition using oxygen containing precursor
Grant 8,637,396 - Matz , et al. January 28, 2 | 2014-01-28 |
Methods of forming strontium titanate films
Grant 8,592,058 - Matz , et al. November 26, 2 | 2013-11-26 |
Liquid composition containing aminoether for deposition of metal-containing films
Grant 8,507,704 - Ivanov , et al. August 13, 2 | 2013-08-13 |
Precursors for depositing group 4 metal-containing films
Grant 8,471,049 - Lei , et al. June 25, 2 | 2013-06-25 |
Process for restoring dielectric properties
Grant 8,283,260 - Weigel , et al. October 9, 2 | 2012-10-09 |
Methods of forming strontium titanate films
Grant 8,202,808 - Matz , et al. June 19, 2 | 2012-06-19 |
Low K Precursors Providing Superior Integration Attributes
App 20110308937 - Haas; Mary Kathryn ; et al. | 2011-12-22 |
Adhesion to copper and copper electromigration resistance
Grant 8,043,976 - Vrtis , et al. October 25, 2 | 2011-10-25 |
Liquid Composition Containing Aminoether For Deposition Of Metal-containing Films
App 20110212629 - Ivanov; Sergei Vladimirovich ; et al. | 2011-09-01 |
Silicon Carbide Film For Integrated Circuit Fabrication
App 20110034023 - Matz; Laura M. ; et al. | 2011-02-10 |
Methods of Forming Strontium Titanate Films
App 20110027617 - Matz; Laura M. ; et al. | 2011-02-03 |
Methods of Forming Strontium Titanate Films
App 20110027960 - Matz; Laura M. ; et al. | 2011-02-03 |
Dielectric Barrier Deposition Using Nitrogen Containing Precursor
App 20100291321 - Mallikarjunan; Anupama ; et al. | 2010-11-18 |
Plasma treatment and repair processes for reducing sidewall damage in low-k dielectrics
Grant 7,741,224 - Jiang , et al. June 22, 2 | 2010-06-22 |
Precursors for Depositing Group 4 Metal-Containing Films
App 20100143607 - Lei; Xinjian ; et al. | 2010-06-10 |
Dielectric Barrier Deposition Using Oxygen Containing Precursor
App 20100136789 - Matz; Laura M. ; et al. | 2010-06-03 |
Formation of a silicon oxide interface layer during silicon carbide etch stop deposition to promote better dielectric stack adhesion
Grant 7,682,989 - Matz , et al. March 23, 2 | 2010-03-23 |
Process For Restoring Dielectric Properties
App 20100041234 - Weigel; Scott Jeffrey ; et al. | 2010-02-18 |
Adhesion to Copper and Copper Electromigration Resistance
App 20090236745 - Vrtis; Raymond Nicholas ; et al. | 2009-09-24 |
SiC Film for Semiconductor Processing
App 20090081864 - Matz; Laura M. ; et al. | 2009-03-26 |
Silicon Carbide Doped Oxide Hardmask For Single and Dual Damascene Integration
App 20090075480 - Matz; Laura M. ; et al. | 2009-03-19 |
Plasma Treatment And Repair Processes For Reducing Sidewall Damage In Low-k Dielectrics
App 20090017563 - Jiang; Ping ; et al. | 2009-01-15 |
Formation Of A Silicon Oxide Interface Layer During Silicon Carbide Etch Stop Deposition To Promote Better Dielectric Stack Adhesion
App 20080283975 - Matz; Laura M. ; et al. | 2008-11-20 |
Hydrogen and oxygen based photoresist removal process
Grant 7,413,994 - Smith , et al. August 19, 2 | 2008-08-19 |
Method For Prevention Of Resist Poisoning In Integrated Circuit Fabrication
App 20080057701 - Engbrecht; Edward Raymond ; et al. | 2008-03-06 |
Silicon nitride/oxygen doped silicon carbide etch stop bi-layer for improved interconnect reliability
App 20080014739 - Matz; Laura M. ; et al. | 2008-01-17 |
Semiconductive Device Having Resist Poison Aluminum Oxide Barrier And Method Of Manufacture
App 20070290347 - Dostalik; William W. ; et al. | 2007-12-20 |
Hydrogen and oxygen based photoresist removal process
App 20060281312 - Smith; Patricia Beauregard ; et al. | 2006-12-14 |
Energy beam treatment to improve the hermeticity of a hermetic layer
App 20060264028 - Matz; Laura M. ; et al. | 2006-11-23 |
Interconnect structure including a silicon oxycarbonitride layer
App 20060264042 - Matz; Laura M. ; et al. | 2006-11-23 |
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