Matsuzawa; Tomoo

Patent Applications and Registrations

Patent applications and USPTO patent grants for Matsuzawa; Tomoo.The latest application filed is for "semiconductor device".

Company Profile

0.8.12

Matsuzawa; Tomoo - Tokyo JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device having improved adhesion between bonding and ball portions of electrical connectors Grant 7,449,786 - Kawanabe , et al. November 11, 2	2008-11-11
Semiconductor device App 20070187823 - Tanaka; Naotaka ; et al.	2007-08-16
Semiconductor device having stacked semiconductor chips sealed with a resin seal member Grant 7,199,469 - Ishida , et al. April 3, 2	2007-04-03
Semiconductor device having improved adhesion between bonding and ball portions of electrical connectors App 20060138679 - Kawanabe; Naoki ; et al.	2006-06-29
Method of manufacturing a semiconductor device to provide improved adhesion between bonding pads and ball portions of electrical connectors Grant 7,049,214 - Kawanabe , et al. May 23, 2	2006-05-23
Manufacturing method of solid-state image sensing device App 20060091487 - Hanada; Kenji ; et al.	2006-05-04
Semiconductor device and a method of manufacturing the same Grant 7,015,127 - Nakajima , et al. March 21, 2	2006-03-21
Manufacturing method of solid-state image sensing device Grant 7,005,310 - Hanada , et al. February 28, 2	2006-02-28
Semiconductor device and a method of manufacturing the same App 20050121805 - Matsuzawa, Tomoo ; et al.	2005-06-09
Semiconductor device with alternate bonding wire arrangement Grant 6,900,551 - Matsuzawa , et al. May 31, 2	2005-05-31
Semiconductor device and method of manufacturing same Grant 6,897,570 - Nakajima , et al. May 24, 2	2005-05-24
Method of manufacturing a semiconductor device to provide improved adhesion between bonding pads and ball portions of electrical connectors App 20050035449 - Kawanabe, Naoki ; et al.	2005-02-17
Semiconductor device App 20050001314 - Tanaka, Naotaka ; et al.	2005-01-06
Manufacturing method of solid-state image sensing device App 20040166763 - Hanada, Kenji ; et al.	2004-08-26
Semiconductor device and a method of manufacturing the same App 20040142551 - Nakajima, Yasuyuki ; et al.	2004-07-22
Semiconductor device and method of manufacturing same App 20030230809 - Nakajima, Takashi ; et al.	2003-12-18
Semiconductor device and a method of manufacturing the same App 20030218245 - Matsuzawa, Tomoo ; et al.	2003-11-27
Semiconductor device and a method of manufacturing the same App 20030168740 - Nakajima, Yasuyuki ; et al.	2003-09-11
Semiconductor device App 20020043717 - Ishida, Toru ; et al.	2002-04-18
Semiconductor device having stacked lead structure Grant 5,252,854 - Arita , et al. October 12, 1	1993-10-12

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.