loadpatents
Patent applications and USPTO patent grants for Matsuzawa; Minoru.The latest application filed is for "wafer processing method".
Patent | Date |
---|---|
Wafer processing method Grant 11,393,721 - Harada , et al. July 19, 2 | 2022-07-19 |
Wafer processing method including uniting a wafer, a ring frame and a polyester sheet without using an adhesive layer Grant 11,380,587 - Harada , et al. July 5, 2 | 2022-07-05 |
Wafer processing method including uniting a wafer, a ring frame and a polyester sheet without using an adhesive layer Grant 11,380,588 - Harada , et al. July 5, 2 | 2022-07-05 |
Wafer processing method including uniting a wafer, ring frame and a polyolefin sheet without using an adhesive layer Grant 11,361,997 - Harada , et al. June 14, 2 | 2022-06-14 |
Wafer processing method including applying a polyester sheet to a wafer Grant 11,322,407 - Harada , et al. May 3, 2 | 2022-05-03 |
Wafer processing method Grant 11,322,406 - Harada , et al. May 3, 2 | 2022-05-03 |
Wafer processing method Grant 11,302,578 - Harada , et al. April 12, 2 | 2022-04-12 |
Wafer processing method Grant 11,289,379 - Harada , et al. March 29, 2 | 2022-03-29 |
Wafer processing method Grant 11,270,916 - Harada , et al. March 8, 2 | 2022-03-08 |
Wafer processing method Grant 11,251,082 - Harada , et al. February 15, 2 | 2022-02-15 |
Wafer processing method including a thermocompression bonding step of bonding a wafer to a ring frame via a polyolefin sheet Grant 11,127,633 - Harada , et al. September 21, 2 | 2021-09-21 |
Wafer processing method including applying a polyester sheet to a wafer Grant 11,069,574 - Harada , et al. July 20, 2 | 2021-07-20 |
Wafer processing method Grant 11,062,948 - Harada , et al. July 13, 2 | 2021-07-13 |
Wafer processing method using a ring frame and a polyester sheet Grant 11,056,334 - Harada , et al. July 6, 2 | 2021-07-06 |
Wafer processing method including applying a polyester sheet to a wafer Grant 11,049,772 - Harada , et al. June 29, 2 | 2021-06-29 |
Wafer processing method including applying a polyester sheet to a wafer Grant 11,049,757 - Harada , et al. June 29, 2 | 2021-06-29 |
Wafer processing method Grant 11,043,421 - Harada , et al. June 22, 2 | 2021-06-22 |
Wafer processing method Grant 11,037,813 - Harada , et al. June 15, 2 | 2021-06-15 |
Wafer processing method using a ring frame with a polyester sheet with no adhesive layer Grant 11,037,814 - Harada , et al. June 15, 2 | 2021-06-15 |
Wafer processing method including applying a polyolefin sheet to a wafer Grant 11,031,234 - Harada , et al. June 8, 2 | 2021-06-08 |
Wafer processing method including applying a polyester sheet to a wafer Grant 11,024,543 - Harada , et al. June 1, 2 | 2021-06-01 |
Wafer processing method for dividing a wafer along predefined division lines using polyester sheet Grant 11,018,058 - Harada , et al. May 25, 2 | 2021-05-25 |
Wafer processing method using a ring frame and a polyester sheet Grant 11,018,043 - Harada , et al. May 25, 2 | 2021-05-25 |
Wafer processing method using a ring frame and a polyolefin sheet Grant 11,011,407 - Harada , et al. May 18, 2 | 2021-05-18 |
Wafer Processing Method App 20210143063 - HARADA; Shigenori ;   et al. | 2021-05-13 |
Wafer Processing Method App 20210143064 - HARADA; Shigenori ;   et al. | 2021-05-13 |
Wafer processing method for dividing a wafer along predefined division lines Grant 11,004,744 - Harada , et al. May 11, 2 | 2021-05-11 |
Wafer processing method of uniting a wafer and a ring frame using a polyolefin sheet Grant 10,998,232 - Harada , et al. May 4, 2 | 2021-05-04 |
Wafer processing method including applying a polyolefin sheet to a wafer Grant 10,991,624 - Harada , et al. April 27, 2 | 2021-04-27 |
Wafer processing method including applying a polyester sheet to a wafer Grant 10,991,587 - Harada , et al. April 27, 2 | 2021-04-27 |
Wafer Processing Method App 20210118736 - HARADA; Shigenori ;   et al. | 2021-04-22 |
Wafer Processing Method App 20210118737 - HARADA; Shigenori ;   et al. | 2021-04-22 |
Wafer processing method for dividing a wafer along division lines Grant 10,985,066 - Harada , et al. April 20, 2 | 2021-04-20 |
Wafer processing method using a laser beam dividing step Grant 10,985,067 - Harada , et al. April 20, 2 | 2021-04-20 |
Wafer Processing Method App 20210111073 - HARADA; Shigenori ;   et al. | 2021-04-15 |
Wafer Processing Method App 20210111074 - HARADA; Shigenori ;   et al. | 2021-04-15 |
Wafer Processing Method App 20210074588 - HARADA; Shigenori ;   et al. | 2021-03-11 |
Wafer Processing Method App 20210074589 - HARADA; Shigenori ;   et al. | 2021-03-11 |
Processing Method For Wafer App 20210057260 - MATSUZAWA; Minoru ;   et al. | 2021-02-25 |
Wafer Processing Method App 20210043513 - HARADA; Shigenori ;   et al. | 2021-02-11 |
Wafer Processing Method App 20210043514 - HARADA; Shigenori ;   et al. | 2021-02-11 |
Wafer processing method Grant 10,910,269 - Harada , et al. February 2, 2 | 2021-02-02 |
Wafer processing method Grant 10,896,850 - Harada , et al. January 19, 2 | 2021-01-19 |
Wafer Processing Method App 20210013101 - HARADA; Shigenori ;   et al. | 2021-01-14 |
Wafer Processing Method App 20210013100 - HARADA; Shigenori ;   et al. | 2021-01-14 |
Wafer Processing Method App 20200388536 - HARADA; Shigenori ;   et al. | 2020-12-10 |
Wafer Processing Method App 20200388537 - HARADA; Shigenori ;   et al. | 2020-12-10 |
Wafer processing method Grant 10,847,420 - Harada , et al. November 24, 2 | 2020-11-24 |
Wafer Processing Method App 20200357696 - HARADA; Shigenori ;   et al. | 2020-11-12 |
Wafer Processing Method App 20200357695 - HARADA; Shigenori ;   et al. | 2020-11-12 |
Wafer Processing Method App 20200328118 - HARADA; Shigenori ;   et al. | 2020-10-15 |
Wafer Processing Method App 20200328117 - HARADA; Shigenori ;   et al. | 2020-10-15 |
Wafer Processing Method App 20200286785 - HARADA; Shigenori ;   et al. | 2020-09-10 |
Wafer Processing Method App 20200286784 - HARADA; Shigenori ;   et al. | 2020-09-10 |
Wafer Processing Method App 20200266090 - HARADA; Shigenori ;   et al. | 2020-08-20 |
Wafer Processing Method App 20200266102 - HARADA; Shigenori ;   et al. | 2020-08-20 |
Wafer Processing Method App 20200235011 - HARADA; Shigenori ;   et al. | 2020-07-23 |
Wafer Processing Method App 20200235010 - HARADA; Shigenori ;   et al. | 2020-07-23 |
Wafer processing method Grant 10,720,355 - Harada , et al. | 2020-07-21 |
Processing Method For Wafer App 20200185252 - HARADA; Shigenori ;   et al. | 2020-06-11 |
Wafer Processing Method App 20200185253 - HARADA; Shigenori ;   et al. | 2020-06-11 |
Wafer Processing Method App 20200144049 - HARADA; Shigenori ;   et al. | 2020-05-07 |
Wafer Processing Method App 20200144048 - HARADA; Shigenori ;   et al. | 2020-05-07 |
Wafer Processing Method App 20200126859 - HARADA; Shigenori ;   et al. | 2020-04-23 |
Wafer Processing Method App 20200126799 - HARADA; Shigenori ;   et al. | 2020-04-23 |
Wafer Processing Method App 20200083104 - HARADA; Shigenori ;   et al. | 2020-03-12 |
Wafer Processing Method App 20200083103 - HARADA; Shigenori ;   et al. | 2020-03-12 |
Wafer Processing Method App 20200043789 - HARADA; Shigenori ;   et al. | 2020-02-06 |
Wafer Processing Method App 20200043772 - HARADA; Shigenori ;   et al. | 2020-02-06 |
Wafer Processing Method App 20200013675 - HARADA; Shigenori ;   et al. | 2020-01-09 |
Wafer Processing Method App 20200013676 - HARADA; Shigenori ;   et al. | 2020-01-09 |
Wafer Processing Method App 20190378745 - HARADA; Shigenori ;   et al. | 2019-12-12 |
Wafer Processing Method App 20190378758 - HARADA; Shigenori ;   et al. | 2019-12-12 |
Wafer Processing Method App 20190348327 - HARADA; Shigenori ;   et al. | 2019-11-14 |
Wafer Processing Method App 20190348326 - HARADA; Shigenori ;   et al. | 2019-11-14 |
Wafer and method of processing wafer Grant 10,115,578 - Nishihara , et al. October 30, 2 | 2018-10-30 |
Wafer And Method Of Processing Wafer App 20180076016 - Nishihara; Ryosuke ;   et al. | 2018-03-15 |
Wafer processing method Grant 9,786,509 - Nishihara , et al. October 10, 2 | 2017-10-10 |
Wafer Processing Method App 20160064230 - Nishihara; Ryosuke ;   et al. | 2016-03-03 |
Substrate processing apparatus and substrate processing method Grant 8,375,963 - Matsuzawa February 19, 2 | 2013-02-19 |
Substrate Processing Apparatus And Substrate Processing Method App 20120171941 - Matsuzawa; Minoru | 2012-07-05 |
Substrate Processing Apparatus And Substrate Processing Method App 20120090642 - Matsuzawa; Minoru | 2012-04-19 |
Substrate supporting apparatus Grant 7,275,749 - Matsuzawa , et al. October 2, 2 | 2007-10-02 |
Substrate processing device and substrate processing method App 20050244579 - Matsuzawa, Minoru ;   et al. | 2005-11-03 |
Substrate supporting apparatus App 20050023773 - Matsuzawa, Minoru ;   et al. | 2005-02-03 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.