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name:-0.025185823440552
name:-0.027354001998901
name:-0.0069389343261719
Matsuzawa; Jun Patent Filings

Matsuzawa; Jun

Patent Applications and Registrations

Patent applications and USPTO patent grants for Matsuzawa; Jun.The latest application filed is for "mobile electronic device".

Company Profile
7.24.21
  • Matsuzawa; Jun - Kawasaki JP
  • Matsuzawa; Jun - Kawasaki-shi JP
  • Matsuzawa; Jun - Ibaraki-ken N/A JP
  • - Ibaraki-ken JP
  • Matsuzawa; Jun - Hitachi JP
  • Matsuzawa; Jun - Tsukuba JP
  • Matsuzawa; Jun - Ibraki-ken JP
  • Matsuzawa, Jun - Tsukuba-shi JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Head mounted display
Grant 10,345,854 - Degawa , et al. July 9, 2
2019-07-09
Head mounted display
Grant 10,338,640 - Matsuzawa , et al.
2019-07-02
Head-mounted display
Grant 10,288,883 - Ozawa , et al.
2019-05-14
Head-mounted display
Grant 10,289,161 - Matsuzawa , et al.
2019-05-14
Head-mounted display
Grant 10,209,521 - Okada , et al. Feb
2019-02-19
Mobile Electronic Device
App 20180225955 - Degawa; Tomohiro ;   et al.
2018-08-09
Head-mounted Display
App 20170276950 - OZAWA; Susumu ;   et al.
2017-09-28
Head Mounted Display
App 20170277223 - MATSUZAWA; Jun ;   et al.
2017-09-28
Head-mounted Display
App 20170277222 - MATSUZAWA; Jun ;   et al.
2017-09-28
Head Mounted Display
App 20170276941 - FUJIHARA; Kouichirou ;   et al.
2017-09-28
Head Mounted Display
App 20170277221 - DEGAWA; Tomohiro ;   et al.
2017-09-28
Head-mounted Display
App 20170276949 - OKADA; Keisuke ;   et al.
2017-09-28
Head Mount Display
App 20170278453 - KUROSAKI; Yoshiteru ;   et al.
2017-09-28
Abrasive, method of polishing target member and process for producing semiconductor device
Grant 8,616,936 - Yoshida , et al. December 31, 2
2013-12-31
Abrasive, method of polishing target member and process for producing semiconductor device
Grant 08616936 -
2013-12-31
Abrasive liquid for metal and method for polishing
Grant 8,491,807 - Uchida , et al. July 23, 2
2013-07-23
Abrasive, Method Of Polishing Target Member And Process For Producing Semiconductor Device
App 20120227331 - YOSHIDA; Masato ;   et al.
2012-09-13
Abrasive, method of polishing target member and process for producing semiconductor device
Grant 8,162,725 - Yoshida , et al. April 24, 2
2012-04-24
Abrasive, method of polishing target member and process for producing semiconductor device
Grant 8,137,159 - Yoshida , et al. March 20, 2
2012-03-20
Abrasive Liquid For Metal and Method for Polishing
App 20120048830 - Uchida; Takeshi ;   et al.
2012-03-01
Abrasive, Method of Polishing Target Member and Process for Producing Semiconductor Device
App 20110312251 - Yoshida; Masato ;   et al.
2011-12-22
Abrasive liquid for metal and method for polishing
Grant 8,038,898 - Uchida , et al. October 18, 2
2011-10-18
Abrasive, method of polishing target member and process for producing semiconductor device
Grant 7,963,825 - Yoshida , et al. June 21, 2
2011-06-21
Abrasive, method of polishing target member and process for producing semiconductor device
Grant 7,871,308 - Yoshida , et al. January 18, 2
2011-01-18
Cerium oxide abrasive and method of polishing substrates
Grant 7,867,303 - Yoshida , et al. January 11, 2
2011-01-11
Cerium oxide abrasive and method of polishing substrates
Grant 7,708,788 - Yoshida , et al. May 4, 2
2010-05-04
Abrasive, Method Of Polishing Target Member And Process For Producing Semiconductor Device
App 20080271383 - Yoshida; Masato ;   et al.
2008-11-06
Abrasive, method of polishing target member and process for producing semiconductor device
App 20070266642 - Yoshida; Masato ;   et al.
2007-11-22
Abrasive, method of polishing target member and process for producing semiconductor device
Grant 7,115,021 - Yoshida , et al. October 3, 2
2006-10-03
Cerium Oxide Abrasive And Method Of Polishing Substrates
App 20060180787 - Yoshida; Masato ;   et al.
2006-08-17
Cerium Oxide Abrasive And Method Of Polishing Substrates
App 20060118524 - Yoshida; Masato ;   et al.
2006-06-08
Abrasive liquid for metal and method for polishing
Grant 6,899,821 - Uchida , et al. May 31, 2
2005-05-31
Abrasive liquid for metal and method for polishing
App 20050095860 - Uchida, Takeshi ;   et al.
2005-05-05
Cerium oxide abrasive and method of polishing substrates
App 20050085168 - Yoshida, Masato ;   et al.
2005-04-21
Cerium oxide abrasive and method of polishing substrates
Grant 6,863,700 - Yoshida , et al. March 8, 2
2005-03-08
Method for producing cerium oxide, cerium oxide abrasive, method for polishing substrate using the same and method for manufacturing semiconductor device
Grant 6,615,499 - Matsuzawa , et al. September 9, 2
2003-09-09
Cerium oxide abrasive for polishing insulating films formed on substrate and methods for using the same
Grant 6,420,269 - Matsuzawa , et al. July 16, 2
2002-07-16
Abrasive, method of polishing target member and process for producing semiconductor device
App 20020090895 - Yoshida, Masato ;   et al.
2002-07-11
Cerium Oxide abrasive and method of polishing substrates
App 20020069593 - Yoshida, Masato ;   et al.
2002-06-13
Abrasive liquid for metal and method for polishing
App 20020017630 - Uchida, Takeshi ;   et al.
2002-02-14
Cerium Oxide Abrasive For Polishing Insulating Films Formed On Substrate And Methods For Using The Same
App 20020016060 - MATSUZAWA, JUN ;   et al.
2002-02-07
Abrasive, method of polishing wafer, and method of producing semiconductor device
Grant 6,343,976 - Yoshida , et al. February 5, 2
2002-02-05
Cerium oxide abrasive and method of polishing substrates
Grant 6,221,118 - Yoshida , et al. April 24, 2
2001-04-24
Material for forming silica-base coated insulation film, process for producing the material, silica-base insulation film, semiconductor device, and process for producing the device
Grant 6,000,339 - Matsuzawa December 14, 1
1999-12-14

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