MATSUZAWA; Hajime

Patent Applications and Registrations

Patent applications and USPTO patent grants for MATSUZAWA; Hajime.The latest application filed is for "cooling structure for a test device, and a method for testing a device".

Company Profile

0.5.6

MATSUZAWA; Hajime - Tokyo JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Cooling Structure For A Test Device, And A Method For Testing A Device App 20110095773 - MATSUZAWA; Hajime	2011-04-28
Semiconductor device test method using an evaluation LSI Grant 7,386,407 - Tanikawa , et al. June 10, 2	2008-06-10
Semiconductor device socket and semiconductor device connecting method using anisotropic conductive sheet Grant 7,295,027 - Matsuzawa November 13, 2	2007-11-13
Semiconductor device test method using an evaluation LSI App 20060224347 - Tanikawa; Yukihiko ; et al.	2006-10-05
Semiconductor device socket and semiconductor device connecting method using anisotropic conductive sheet App 20050161800 - Matsuzawa, Hajime	2005-07-28
Semiconductor device socket and semiconductor device connecting method using anisotropic conductive sheet Grant 6,891,386 - Matsuzawa May 10, 2	2005-05-10
Electronic devices mounted on electronic equipment board test system and test method App 20050017749 - Matsuzawa, Hajime	2005-01-27
Semiconductor device socket and semiconductor device connecting method using anisotropic conductive sheet App 20030231027 - Matsuzawa, Hajime	2003-12-18
Electronic devices mounted on electronic equipment board test system and test method App 20030094939 - Matsuzawa, Hajime	2003-05-22
Electronic device structure capable of preventing malfunction caused by electromagnetic wave coming from outside Grant 6,472,724 - Matsuzawa , et al. October 29, 2	2002-10-29
Large-scale integrated circuit and method for testing a board of same Grant 6,343,365 - Matsuzawa , et al. January 29, 2	2002-01-29

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