Matsuzaki; Toshio
Patent Applications and Registrations
Patent applications and USPTO patent grants for Matsuzaki; Toshio.The latest application filed is for "resin mold package structure of integrated circuit".
- Matsuzaki; Toshio - Yokohama JP
| Patent | Date |
|---|---|
| Resin mold package structure of integrated circuit Grant 5,264,730 - Matsuzaki , et al. November 23, 1 | 1993-11-23 |
| Hybrid integrated circuit package structure Grant 4,994,895 - Matsuzaki , et al. February 19, 1 | 1991-02-19 |
| Thermal recording head and process for manufacturing wiring substrate therefor Grant 4,689,638 - Matsuzaki , et al. August 25, 1 | 1987-08-25 |
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