loadpatents
name:-0.020969152450562
name:-0.016216993331909
name:-0.0056781768798828
Matsuzaki; Sakae Patent Filings

Matsuzaki; Sakae

Patent Applications and Registrations

Patent applications and USPTO patent grants for Matsuzaki; Sakae.The latest application filed is for "method of forming insulating layer".

Company Profile
5.16.16
  • Matsuzaki; Sakae - Tokyo JP
  • Matsuzaki; Sakae - Sendai N/A JP
  • Matsuzaki; Sakae - Miyagi N/A JP
  • Matsuzaki; Sakae - Sendai-shi JP
  • Matsuzaki; Sakae - Gunma JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Support base
Grant 11,241,770 - Matsuzaki February 8, 2
2022-02-08
Method Of Forming Insulating Layer
App 20210011387 - MATSUZAKI; Sakae
2021-01-14
Method of manufacturing device chips and pick up apparatus
Grant 10,847,403 - Matsuzaki November 24, 2
2020-11-24
Electrostatic chuck table
Grant 10,490,450 - Matsuzaki , et al. Nov
2019-11-26
Electrostatic chuck table using method
Grant 10,410,901 - Furuta , et al. Sept
2019-09-10
Support Base
App 20190217440 - MATSUZAKI; Sakae
2019-07-18
Method Of Manufacturing Device Chips And Pick Up Apparatus
App 20190181029 - MATSUZAKI; Sakae
2019-06-13
Method Of Manufacturing Small-diameter Wafer
App 20190148132 - HORITA; Hideji ;   et al.
2019-05-16
Electrostatic Chuck Table Using Method
App 20180247853 - Furuta; Kenji ;   et al.
2018-08-30
Electrostatic Chuck Table
App 20180019168 - Matsuzaki; Sakae ;   et al.
2018-01-18
Wafer processing method
Grant 9,379,015 - Matsuzaki , et al. June 28, 2
2016-06-28
Wafer processing method
Grant 9,236,264 - Matsuzaki , et al. January 12, 2
2016-01-12
Touch sensor system
Grant 9,215,089 - Muroyama , et al. December 15, 2
2015-12-15
Dividing method for wafer
Grant 9,159,622 - Matsuzaki , et al. October 13, 2
2015-10-13
Wafer Processing Method
App 20150132925 - Matsuzaki; Sakae ;   et al.
2015-05-14
Dividing Method For Wafer
App 20150044857 - Matsuzaki; Sakae ;   et al.
2015-02-12
Sensor device having electrode draw-out portions through side of substrate
Grant 8,823,114 - Tanaka , et al. September 2, 2
2014-09-02
Wiring connection method and functional device
Grant 8,796,850 - Tanaka , et al. August 5, 2
2014-08-05
Vacuum Processing Apparatus
App 20140209240 - Matsuzaki; Sakae ;   et al.
2014-07-31
Wafer Processing Method
App 20140141596 - Matsuzaki; Sakae ;   et al.
2014-05-22
Sheet-like tactile sensor system
Grant 8,613,231 - Muroyama , et al. December 24, 2
2013-12-24
Sensor system
Grant 8,336,399 - Muroyama , et al. December 25, 2
2012-12-25
Sheet-like Tactile Sensor System
App 20120247226 - Muroyama; Masanori ;   et al.
2012-10-04
Touch Sensor System
App 20120254490 - Muroyama; Masanori ;   et al.
2012-10-04
Wiring Connection Method And Functional Device
App 20120217638 - Tanaka; Shuji ;   et al.
2012-08-30
Sensor Device And Method For Producing Sensor Device
App 20120199921 - Tanaka; Shuji ;   et al.
2012-08-09
Sensor System
App 20110083517 - MUROYAMA; Masanori ;   et al.
2011-04-14
Piezoelectric thin film device and method of producing the same
App 20060202769 - Nagao; Keigo ;   et al.
2006-09-14

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