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name:-0.038231134414673
name:-0.022928953170776
name:-0.0044410228729248
Matsuyama; Seiji Patent Filings

Matsuyama; Seiji

Patent Applications and Registrations

Patent applications and USPTO patent grants for Matsuyama; Seiji.The latest application filed is for "ultrathin atomic layer deposition film accuracy thickness control".

Company Profile
3.21.27
  • Matsuyama; Seiji - Toyama JP
  • Matsuyama; Seiji - Ibaraki JP
  • Matsuyama; Seiji - Kyoto JP
  • Matsuyama; Seiji - Amagasaki JP
  • MATSUYAMA; Seiji - Minami-ku JP
  • Matsuyama; Seiji - Hyogo JP
  • MATSUYAMA; Seiji - Amagasaki-shi JP
  • Matsuyama; Seiji - Nirasaki-shi JP
  • Matsuyama; Seiji - Nirasaki JP
  • Matsuyama, Seiji - Yamanashi JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Ultrathin Atomic Layer Deposition Film Accuracy Thickness Control
App 20210343520 - Qian; Jun ;   et al.
2021-11-04
Ultrathin atomic layer deposition film accuracy thickness control
Grant 11,101,129 - Qian , et al. August 24, 2
2021-08-24
Ultrathin Atomic Layer Deposition Film Accuracy Thickness Control
App 20200152446 - Qian; Jun ;   et al.
2020-05-14
Ultrathin atomic layer deposition film accuracy thickness control
Grant 10,566,187 - Qian , et al. Feb
2020-02-18
Ultrathin Atomic Layer Deposition Film Accuracy Thickness Control
App 20190378710 - Qian; Jun ;   et al.
2019-12-12
Ultrathin Atomic Layer Deposition Film Accuracy Thickness Control
App 20160276148 - Qian; Jun ;   et al.
2016-09-22
Semiconductor device and manufacturing method thereof
Grant 8,288,833 - Matsuyama October 16, 2
2012-10-16
Plasma processing method
Grant 8,183,165 - Matsuyama , et al. May 22, 2
2012-05-22
Method of modifying insulating film
Grant 8,021,987 - Sugawara , et al. September 20, 2
2011-09-20
Plasma Processing Method And Computer Storage Medium
App 20110124202 - MATSUYAMA; Seiji ;   et al.
2011-05-26
Semiconductor Device And Manufacturing Method Thereof
App 20110062530 - Matsuyama; Seiji
2011-03-17
Plasma processing method and computer storage medium
Grant 7,897,518 - Matsuyama , et al. March 1, 2
2011-03-01
Insulating film formation method which exhibits improved thickness uniformity and improved composition uniformity
Grant 7,883,746 - Suzuki , et al. February 8, 2
2011-02-08
Plasma Processing Method And Computer Storage Medium
App 20100196627 - MATSUYAMA; Seiji ;   et al.
2010-08-05
Substrate treating method and production method for semiconductor device
Grant 7,759,598 - Sugawara , et al. July 20, 2
2010-07-20
Plasma processing method and computer storage medium
Grant 7,723,241 - Matsuyama , et al. May 25, 2
2010-05-25
Method Of Modifying Insulating Film
App 20100105215 - SUGAWARA; Takuya ;   et al.
2010-04-29
Method for Forming Insulation Film
App 20100096707 - Sugawara; Takuya ;   et al.
2010-04-22
Method for forming insulation film
Grant 7,662,236 - Sugawara , et al. February 16, 2
2010-02-16
Method of modifying insulating film
Grant 7,655,574 - Sugawara , et al. February 2, 2
2010-02-02
Method for forming underlying insulation film
Grant 7,622,402 - Sugawara , et al. November 24, 2
2009-11-24
Substrate Treating Method
App 20090163036 - Sugawara; Takuya ;   et al.
2009-06-25
Substrate treating method
Grant 7,517,751 - Sugawara , et al. April 14, 2
2009-04-14
Method for Forming Insulation Film
App 20080274370 - Sugawara; Takuya ;   et al.
2008-11-06
Method for forming insulation film
Grant 7,446,052 - Sugawara , et al. November 4, 2
2008-11-04
Nitriding method of gate oxide film
Grant 7,429,539 - Matsuyama , et al. September 30, 2
2008-09-30
Insulating film formation method, semiconductor device, and substrate processing apparatus
App 20080026251 - Suzuki; Jun ;   et al.
2008-01-31
Semiconductor device and semiconductor device manufacturing method
App 20080017954 - Suzuki; Jun ;   et al.
2008-01-24
Substrate treating method and production method for semiconductor device
App 20070235421 - Sugawara; Takuya ;   et al.
2007-10-11
Method for producing material of electronic device
App 20070224837 - Sugawara; Takuya ;   et al.
2007-09-27
Process for producing materials for electronic device
App 20070218687 - Sugawara; Takuya ;   et al.
2007-09-20
Substrate Processing Method And Material For Electronic Device
App 20070204959 - NAKANISHI; Toshio ;   et al.
2007-09-06
Substrate processing method and material for electronic device
Grant 7,250,375 - Nakanishi , et al. July 31, 2
2007-07-31
Substrate processing method
Grant 7,232,772 - Matsuyama , et al. June 19, 2
2007-06-19
Substrate treating method and production method for semiconductor device
Grant 7,226,848 - Sugawara , et al. June 5, 2
2007-06-05
Substrate processing method
Grant 7,226,874 - Matsuyama , et al. June 5, 2
2007-06-05
Process for producing materials for electronic device
Grant 7,217,659 - Sugawara , et al. May 15, 2
2007-05-15
Plasma processing method and computer storage medium
App 20070059944 - Matsuyama; Seiji ;   et al.
2007-03-15
Method of modifying insulating film
App 20060199398 - Sugawara; Takuya ;   et al.
2006-09-07
Method for forming underlying insulation film
App 20050255711 - Sugawara, Takuya ;   et al.
2005-11-17
Method for producing material of electronic device
App 20050233599 - Sugawara, Takuya ;   et al.
2005-10-20
Process for producing materials for electronic device
App 20050176263 - Sugawara, Takuya ;   et al.
2005-08-11
Substrate treating method and production method for semiconductor device
App 20050170543 - Sugawara, Takuya ;   et al.
2005-08-04
Substrate treating method
App 20050164523 - Sugawara, Takuya ;   et al.
2005-07-28
Method for forming insulation film
App 20050161434 - Sugawara, Takuya ;   et al.
2005-07-28
Method of producing electronic device material
Grant 6,897,149 - Sugawara , et al. May 24, 2
2005-05-24
Method for producing material of electronic device
App 20040142577 - Sugawara, Takuya ;   et al.
2004-07-22
Method of producing electronic device material
App 20040048452 - Sugawara, Takuya ;   et al.
2004-03-11

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