loadpatents
name:-0.030449151992798
name:-0.034772157669067
name:-0.00053501129150391
Matsuura; Masazumi Patent Filings

Matsuura; Masazumi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Matsuura; Masazumi.The latest application filed is for "semiconductor device and manufacturing method thereof".

Company Profile
0.30.24
  • Matsuura; Masazumi - Kanagawa JP
  • Matsuura; Masazumi - Tokyo JP
  • Matsuura; Masazumi - Chiyoda-ku N/A JP
  • Matsuura; Masazumi - Hyogo JP
  • Matsuura; Masazumi - Hyogo-ken JP
  • Matsuura; Masazumi - Itami JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Semiconductor device and manufacturing method thereof
Grant 9,991,162 - Matsuura June 5, 2
2018-06-05
Semiconductor Device And Manufacturing Method Thereof
App 20170294352 - MATSUURA; Masazumi
2017-10-12
Semiconductor device and manufacturing method thereof
Grant 9,721,873 - Matsuura August 1, 2
2017-08-01
Semiconductor chip with seal ring and sacrificial corner pattern
Grant 9,368,459 - Furusawa , et al. June 14, 2
2016-06-14
Method of manufacturing a semiconductor device
Grant 9,245,800 - Matsuura January 26, 2
2016-01-26
Method Of Manufacturing A Semiconductor Device
App 20150311116 - MATSUURA; Masazumi
2015-10-29
Semiconductor device and method of manufacturing the same
Grant 9,035,460 - Matsuura May 19, 2
2015-05-19
Semiconductor Chip With Seal Ring And Sacrificial Corner Pattern
App 20150108613 - FURUSAWA; Takeshi ;   et al.
2015-04-23
Semiconductor chip with seal ring and sacrificial corner pattern
Grant 8,963,291 - Furusawa , et al. February 24, 2
2015-02-24
Semiconductor Device And Manufacturing Method Thereof
App 20140138848 - MATSUURA; Masazumi
2014-05-22
Semiconductor Device And Method Of Manufacturing The Same
App 20130140709 - MATSUURA; Masazumi
2013-06-06
Semiconductor chip with seal ring and sacrificial corner pattern
Grant 8,018,030 - Furusawa , et al. September 13, 2
2011-09-13
Semiconductor Chip With Seal Ring And Sacrificial Corner Pattern
App 20110215447 - Furusawa; Takeshi ;   et al.
2011-09-08
Semiconductor device and method of fabricating the same
Grant 7,981,790 - Kumada , et al. July 19, 2
2011-07-19
Semiconductor device and manufacturing method therefor
Grant 7,960,279 - Furusawa , et al. June 14, 2
2011-06-14
Semiconductor Device And Method Of Fabricating The Same
App 20100112805 - Kumada; Teruhiko ;   et al.
2010-05-06
Semiconductor device and method of fabricating the same
Grant 7,671,473 - Kumada , et al. March 2, 2
2010-03-02
Semiconductor Device And Manufacturing Method Therefor
App 20090263963 - FURUSAWA; Takeshi ;   et al.
2009-10-22
Semiconductor device with seal ring
Grant 7,605,448 - Furusawa , et al. October 20, 2
2009-10-20
Semiconductor device and manufacturing method therefor
Grant 7,602,063 - Furusawa , et al. October 13, 2
2009-10-13
Semiconductor Device With Seal Ring
App 20090189245 - FURUSAWA; Takeshi ;   et al.
2009-07-30
Manufacturing method of semiconductor device and semiconductor device
App 20080093709 - Matsuura; Masazumi ;   et al.
2008-04-24
Semiconductor device and method of manufacturing the same
App 20070145583 - Matsuura; Masazumi ;   et al.
2007-06-28
Semiconductor Device
App 20070114668 - Goto; Kinya ;   et al.
2007-05-24
Method for fabricating a dual damascene contact in an insulating film having density gradually varying in the thickness direction
Grant 7,208,408 - Yuasa , et al. April 24, 2
2007-04-24
Semiconductor device which employs an interlayer insulating film of a low mechanical strength and a highly reliable metal pad, and a method of manufacturing the same
Grant 7,202,565 - Matsuura , et al. April 10, 2
2007-04-10
Semiconductor device including sealing ring
App 20060103025 - Furusawa; Takeshi ;   et al.
2006-05-18
Semiconductor device
App 20060055005 - Furusawa; Takeshi ;   et al.
2006-03-16
Semiconductor device and manufacturing method therefor
App 20060006530 - Furusawa; Takeshi ;   et al.
2006-01-12
Electronic device and method for fabricating the same
App 20050263857 - Yuasa, Hiroshi ;   et al.
2005-12-01
Electronic device includes an insulating film having density or carbon concentration varying gradually in the direction of the thickness and a conductive film formed therein
Grant 6,930,394 - Yuasa , et al. August 16, 2
2005-08-16
Method of forming dielectric film and dielectric film
Grant 6,903,027 - Matsuura June 7, 2
2005-06-07
Semiconductor device and method of manufacturing the same
App 20050054188 - Matsuura, Masazumi ;   et al.
2005-03-10
Method of manufacturing semiconductor device and semiconductor device
Grant 6,737,319 - Morimoto , et al. May 18, 2
2004-05-18
Semiconductor device containing copper diffusion preventive film of silicon carbide
Grant 6,737,746 - Matsuura May 18, 2
2004-05-18
Electronic device and method for fabricating the same
App 20040089924 - Yuasa, Hiroshi ;   et al.
2004-05-13
Semiconductor device and method of manufacturing the same
App 20030089988 - Matsuura, Masazumi
2003-05-15
Method of manufacturing semiconductor device and semiconductor device
App 20030068880 - Morimoto, Noboru ;   et al.
2003-04-10
Semiconductor device and method of fabricating the semiconductor device
App 20030015798 - Haruhana, Hideyo ;   et al.
2003-01-23
Method of forming dielectric film and dielectric film
App 20020182891 - Matsuura, Masazumi
2002-12-05
Method of forming dielectric film and dielectric film
App 20020090833 - Matsuura, Masazumi
2002-07-11
Semiconductor device and method of manufacturing the same
App 20010021557 - Matsuura, Masazumi ;   et al.
2001-09-13
Semiconductor device organic insulator film
Grant 6,124,641 - Matsuura September 26, 2
2000-09-26
Method of making a semiconductor device
Grant 5,926,732 - Matsuura July 20, 1
1999-07-20
Semiconductor device and manufacturing process thereof
Grant 5,811,849 - Matsuura September 22, 1
1998-09-22
Semiconductor device comprising an SiOF insulative film
Grant 5,703,404 - Matsuura December 30, 1
1997-12-30
Semiconductor device and method of fabricating the same
Grant 5,598,027 - Matsuura January 28, 1
1997-01-28
Method of manufacturing a semiconductor device having multilayer insulating films
Grant 5,459,105 - Matsuura October 17, 1
1995-10-17
Semiconductor device having an interlayer insulating film of high crack resistance
Grant 5,319,247 - Matsuura June 7, 1
1994-06-07
Method of manufacturing semiconductor device including interlaying insulating film
Grant 5,250,468 - Matsuura , et al. October 5, 1
1993-10-05
Semiconductor device including nitride layer
Grant 5,177,588 - Ii , et al. January 5, 1
1993-01-05
Semiconductor device including interlayer insulating film
Grant 5,132,774 - Matsuura , et al. July 21, 1
1992-07-21
Ozone generating method
Grant 5,047,127 - Tottori , et al. September 10, 1
1991-09-10

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.

© 2024 USPTO.report | Privacy Policy | Resources | RSS Feed of Trademarks | Trademark Filings Twitter Feed