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Resin composition, heat-resistant resin paste and semiconductor device using these and method of preparing the same Grant 7,560,307 - Yano , et al. July 14, 2 | 2009-07-14 |
Adhesive Film For Semiconductor Use, Metal Sheet Laminated With Adhesive Film, Wiring Circuit Laminated With Adhesive Film, And Semiconductor Device Using Same, And Method For Producing Semiconductor Device App 20090053498 - MATSUURA; Hidekazu ;   et al. | 2009-02-26 |
Adhesive film for semiconductor, lead frame and semiconductor device using the same, and method of producing semiconductor device Grant 7,479,412 - Kawai , et al. January 20, 2 | 2009-01-20 |
Adhesive film for semiconductor, metal sheet with such adhesive film, wiring substrate with adhesive film, semiconductor device, and method for manufacturing semiconductor device Grant 7,449,367 - Matsuura , et al. November 11, 2 | 2008-11-11 |
Adhesive Film For Semiconductor, Lead Frame And Semiconductor Device Using The Same, And Method Of Producing Semiconductor Device App 20080194062 - KAWAI; Toshiyasu ;   et al. | 2008-08-14 |
Adhesive film for semiconductor, lead frame and semiconductor device using the same, and method of producing semiconductor device Grant 7,378,722 - Kawai , et al. May 27, 2 | 2008-05-27 |
Resin composition, heat-resistant resin paste and semiconductor device using these and method of preparing the same App 20060180908 - Yano; Yasuhiro ;   et al. | 2006-08-17 |
Adhesive film for semiconductor, lead frame and semiconductor device using the same, and method of producing semiconductor device App 20060138616 - Kawai; Toshiyasu ;   et al. | 2006-06-29 |
Resin composition, heat-resistant resin paste and semiconductor device using them and method for manufacture thereof Grant 7,061,081 - Yano , et al. June 13, 2 | 2006-06-13 |
Adhesive film for semiconductor, lead frame and semiconductor device using the same, and method of producing semiconductor device Grant 7,057,266 - Kawai , et al. June 6, 2 | 2006-06-06 |
Adhesive film for semiconductor, metal sheet with such adhesive film, wiring substrate with adhesive film, semiconductor device, and method for manufactring semiconductor device App 20060043607 - Matsuura; Hidekazu ;   et al. | 2006-03-02 |
Adhesive film, lead frame with adhesive film, and semiconductor device using same App 20050255278 - Matsuura, Hidekazu ;   et al. | 2005-11-17 |
Photosensitive resin composition, process of forming patterns with the same, and electronic components Grant 6,849,385 - Nagoya , et al. February 1, 2 | 2005-02-01 |
Photosensitive resin composition, process of forming patterns with the same, and electronic components App 20040180286 - Nagoya, Tomohiro ;   et al. | 2004-09-16 |
Adhesive film for semiconductor, lead frame and semiconductor device using the same, and method of producing semiconductor device App 20040124544 - Kawai, Toshiyasu ;   et al. | 2004-07-01 |
Adhesive film for semiconductor, lead frame and semiconductor device using the same Grant 6,744,133 - Tanabe , et al. June 1, 2 | 2004-06-01 |
Adhesive film for semiconductor, lead frame with adhesive film for semiconductor and semiconductor device using the same Grant 6,733,880 - Tanabe , et al. May 11, 2 | 2004-05-11 |
Adhesive film for semiconductor, lead frame and semiconductor device using the same, and method for manufacturing semiconductor device Grant 6,700,185 - Kawai , et al. March 2, 2 | 2004-03-02 |
Adhesive film for semiconductor, lead frame and semiconductor device using the same App 20030102573 - Tanabe, Yoshiyuki ;   et al. | 2003-06-05 |
Resin composition, heat-resistant resin paste and semiconductor device using them and method for manufacture thereof App 20030082925 - Yano, Yasuhiro ;   et al. | 2003-05-01 |
Process for fabricating a crack resistant resin encapsulated semiconductor chip package Grant 6,372,080 - Matsuura , et al. April 16, 2 | 2002-04-16 |
Method of producing a lead frame with composite film attached, and use of the lead frame App 20020007905 - Matsuura, Hidekazu ;   et al. | 2002-01-24 |
Heat -resistant adhesive sheet App 20010015484 - Matsuura, Hidekazu ;   et al. | 2001-08-23 |
Process for fabricating a crack resistant resin encapsulated semiconductor chip package Grant 6,248,613 - Matsuura , et al. June 19, 2 | 2001-06-19 |
Process for fabricating a crack resistant resin encapsulated semiconductor chip package Grant 6,046,072 - Matsuura , et al. April 4, 2 | 2000-04-04 |
Virtual computer control system effectively using a CPU with predetermined assignment ratios of resources based on a first and second priority mechanism Grant 5,530,860 - Matsuura June 25, 1 | 1996-06-25 |
Global communication interrupt control system for communication between real and virtual machine systems using global communication functions of a shared memory Grant 5,452,462 - Matsuura , et al. September 19, 1 | 1995-09-19 |