Matsuura; Hidekazu

Patent Applications and Registrations

Patent applications and USPTO patent grants for Matsuura; Hidekazu.The latest application filed is for "adhesive film for semiconductor use, metal sheet laminated with adhesive film, wiring circuit laminated with adhesive film, and semiconductor device using same, and method for producing semiconductor device".

Company Profile

0.15.12

Matsuura; Hidekazu - Ichihara JP
MATSUURA; Hidekazu - Ichihara-shi JP
Matsuura; Hidekazu - Chiba JP
Matsuura; Hidekazu - Oyama JP
Matsuura, Hidekazu - Oyama-shi JP
Matsuura; Hidekazu - Kawasaki JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Resin composition, heat-resistant resin paste and semiconductor device using these and method of preparing the same Grant 7,560,307 - Yano , et al. July 14, 2	2009-07-14
Adhesive Film For Semiconductor Use, Metal Sheet Laminated With Adhesive Film, Wiring Circuit Laminated With Adhesive Film, And Semiconductor Device Using Same, And Method For Producing Semiconductor Device App 20090053498 - MATSUURA; Hidekazu ; et al.	2009-02-26
Adhesive film for semiconductor, lead frame and semiconductor device using the same, and method of producing semiconductor device Grant 7,479,412 - Kawai , et al. January 20, 2	2009-01-20
Adhesive film for semiconductor, metal sheet with such adhesive film, wiring substrate with adhesive film, semiconductor device, and method for manufacturing semiconductor device Grant 7,449,367 - Matsuura , et al. November 11, 2	2008-11-11
Adhesive Film For Semiconductor, Lead Frame And Semiconductor Device Using The Same, And Method Of Producing Semiconductor Device App 20080194062 - KAWAI; Toshiyasu ; et al.	2008-08-14
Adhesive film for semiconductor, lead frame and semiconductor device using the same, and method of producing semiconductor device Grant 7,378,722 - Kawai , et al. May 27, 2	2008-05-27
Resin composition, heat-resistant resin paste and semiconductor device using these and method of preparing the same App 20060180908 - Yano; Yasuhiro ; et al.	2006-08-17
Adhesive film for semiconductor, lead frame and semiconductor device using the same, and method of producing semiconductor device App 20060138616 - Kawai; Toshiyasu ; et al.	2006-06-29
Resin composition, heat-resistant resin paste and semiconductor device using them and method for manufacture thereof Grant 7,061,081 - Yano , et al. June 13, 2	2006-06-13
Adhesive film for semiconductor, lead frame and semiconductor device using the same, and method of producing semiconductor device Grant 7,057,266 - Kawai , et al. June 6, 2	2006-06-06
Adhesive film for semiconductor, metal sheet with such adhesive film, wiring substrate with adhesive film, semiconductor device, and method for manufactring semiconductor device App 20060043607 - Matsuura; Hidekazu ; et al.	2006-03-02
Adhesive film, lead frame with adhesive film, and semiconductor device using same App 20050255278 - Matsuura, Hidekazu ; et al.	2005-11-17
Photosensitive resin composition, process of forming patterns with the same, and electronic components Grant 6,849,385 - Nagoya , et al. February 1, 2	2005-02-01
Photosensitive resin composition, process of forming patterns with the same, and electronic components App 20040180286 - Nagoya, Tomohiro ; et al.	2004-09-16
Adhesive film for semiconductor, lead frame and semiconductor device using the same, and method of producing semiconductor device App 20040124544 - Kawai, Toshiyasu ; et al.	2004-07-01
Adhesive film for semiconductor, lead frame and semiconductor device using the same Grant 6,744,133 - Tanabe , et al. June 1, 2	2004-06-01
Adhesive film for semiconductor, lead frame with adhesive film for semiconductor and semiconductor device using the same Grant 6,733,880 - Tanabe , et al. May 11, 2	2004-05-11
Adhesive film for semiconductor, lead frame and semiconductor device using the same, and method for manufacturing semiconductor device Grant 6,700,185 - Kawai , et al. March 2, 2	2004-03-02
Adhesive film for semiconductor, lead frame and semiconductor device using the same App 20030102573 - Tanabe, Yoshiyuki ; et al.	2003-06-05
Resin composition, heat-resistant resin paste and semiconductor device using them and method for manufacture thereof App 20030082925 - Yano, Yasuhiro ; et al.	2003-05-01
Process for fabricating a crack resistant resin encapsulated semiconductor chip package Grant 6,372,080 - Matsuura , et al. April 16, 2	2002-04-16
Method of producing a lead frame with composite film attached, and use of the lead frame App 20020007905 - Matsuura, Hidekazu ; et al.	2002-01-24
Heat -resistant adhesive sheet App 20010015484 - Matsuura, Hidekazu ; et al.	2001-08-23
Process for fabricating a crack resistant resin encapsulated semiconductor chip package Grant 6,248,613 - Matsuura , et al. June 19, 2	2001-06-19
Process for fabricating a crack resistant resin encapsulated semiconductor chip package Grant 6,046,072 - Matsuura , et al. April 4, 2	2000-04-04
Virtual computer control system effectively using a CPU with predetermined assignment ratios of resources based on a first and second priority mechanism Grant 5,530,860 - Matsuura June 25, 1	1996-06-25
Global communication interrupt control system for communication between real and virtual machine systems using global communication functions of a shared memory Grant 5,452,462 - Matsuura , et al. September 19, 1	1995-09-19

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