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Patent applications and USPTO patent grants for Matsushima; Seiji.The latest application filed is for "cooling device and semiconductor device".
Patent | Date |
---|---|
Cooler Grant D886,967 - Matsushima | 2020-06-09 |
Cooler Grant D873,396 - Matsushima Ja | 2020-01-21 |
Liquid-cooled-type cooling device and manufacturing method for same Grant 9,845,999 - Matsushima , et al. December 19, 2 | 2017-12-19 |
Cooling Device And Semiconductor Device App 20140091453 - MORI; Shogo ;   et al. | 2014-04-03 |
Liquid-cooled-type Cooling Device And Manufacturing Method For Same App 20130284404 - Matsushima; Seiji ;   et al. | 2013-10-31 |
Power Semiconductor Module Cooling Apparatus App 20130112369 - Matsushima; Seiji | 2013-05-09 |
Liquid-cooled-type Cooling Device App 20110094722 - MORI; Shogo ;   et al. | 2011-04-28 |
Cooling Plate And Manufacturing Method Therefor App 20100314075 - TAKAHASHI; Satoshi ;   et al. | 2010-12-16 |
Heat exchanger plate App 20080245516 - Ishikawa; Soichiro ;   et al. | 2008-10-09 |
Heat exchanger plate and manufacturing method therefor App 20080245517 - Ishikawa; Soichiro ;   et al. | 2008-10-09 |
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