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name:-0.0094561576843262
name:-0.0037851333618164
name:-0.0006721019744873
Matsushima; Seiji Patent Filings

Matsushima; Seiji

Patent Applications and Registrations

Patent applications and USPTO patent grants for Matsushima; Seiji.The latest application filed is for "cooling device and semiconductor device".

Company Profile
0.3.7
  • Matsushima; Seiji - Oyama JP
  • MATSUSHIMA; Seiji - Oyama-shi JP
  • Matsushima; Seiji - Mihara JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Cooler
Grant D886,967 - Matsushima
2020-06-09
Cooler
Grant D873,396 - Matsushima Ja
2020-01-21
Liquid-cooled-type cooling device and manufacturing method for same
Grant 9,845,999 - Matsushima , et al. December 19, 2
2017-12-19
Cooling Device And Semiconductor Device
App 20140091453 - MORI; Shogo ;   et al.
2014-04-03
Liquid-cooled-type Cooling Device And Manufacturing Method For Same
App 20130284404 - Matsushima; Seiji ;   et al.
2013-10-31
Power Semiconductor Module Cooling Apparatus
App 20130112369 - Matsushima; Seiji
2013-05-09
Liquid-cooled-type Cooling Device
App 20110094722 - MORI; Shogo ;   et al.
2011-04-28
Cooling Plate And Manufacturing Method Therefor
App 20100314075 - TAKAHASHI; Satoshi ;   et al.
2010-12-16
Heat exchanger plate
App 20080245516 - Ishikawa; Soichiro ;   et al.
2008-10-09
Heat exchanger plate and manufacturing method therefor
App 20080245517 - Ishikawa; Soichiro ;   et al.
2008-10-09

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