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name:-0.01540994644165
name:-0.00043797492980957
MATSUSHIMA; Hironori Patent Filings

MATSUSHIMA; Hironori

Patent Applications and Registrations

Patent applications and USPTO patent grants for MATSUSHIMA; Hironori.The latest application filed is for "resin for active-energy-ray-curable ink, composition for active-energy-ray-curable ink, and active-energy-ray-curable ink".

Company Profile
0.19.13
  • MATSUSHIMA; Hironori - Haven BE
  • Matsushima; Hironori - Kanagawa JP
  • Matsushima; Hironori - Toledo OH
  • Matsushima; Hironori - Tokyo JP
  • Matsushima; Hironori - Hyogo JP
  • Matsushima; Hironori - Sapporo JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Resin For Active-energy-ray-curable Ink, Composition For Active-energy-ray-curable Ink, And Active-energy-ray-curable Ink
App 20220267626 - OKAWACHI; Keijiro ;   et al.
2022-08-25
Semiconductor device and method of manufacturing the same
Grant 9,087,816 - Kuroda , et al. July 21, 2
2015-07-21
Methods for Dendritic Cell Precursor Populations, Dendritic Cell Populations Derived Therefrom, and Uses Thereof
App 20150126398 - Takashima; Akira ;   et al.
2015-05-07
Method of manufacturing semiconductor device
Grant 9,024,454 - Yasunaga , et al. May 5, 2
2015-05-05
Method Of Manufacturing Semiconductor Device
App 20140273353 - YASUNAGA; Masatoshi ;   et al.
2014-09-18
Semiconductor device with copper wire having different width portions
Grant 8,772,952 - Yasunaga , et al. July 8, 2
2014-07-08
Semiconductor Device and Method of Manufacturing the Same
App 20140175678 - Kuroda; Soshi ;   et al.
2014-06-26
Semiconductor device and method of manufacturing the same
Grant 8,692,383 - Kuroda , et al. April 8, 2
2014-04-08
Manufacturing method of semiconductor device
Grant 8,629,002 - Kuroda , et al. January 14, 2
2014-01-14
Manufacturing Method Of Semiconductor Device
App 20130065364 - KURODA; Soshi ;   et al.
2013-03-14
Manufacturing method of semiconductor device
Grant 8,334,172 - Kuroda , et al. December 18, 2
2012-12-18
Semiconductor Device And Method Of Manufacturing The Same
App 20120061850 - KURODA; Soshi ;   et al.
2012-03-15
Dendritic Cell Precursor Populations, Dendritic Cell Populations Derived Therefrom and Uses Thereof
App 20120015040 - Takashima; Akira ;   et al.
2012-01-19
Manufacturing Method Of Semiconductor Device
App 20110201155 - Kuroda; Soshi ;   et al.
2011-08-18
Semiconductor Device
App 20110074019 - YASUNAGA; Masatoshi ;   et al.
2011-03-31
Semiconductor Device And Method For Manufacturing The Same
App 20100320623 - Kuroda; Soshi ;   et al.
2010-12-23
Wiring design support apparatus for bond wire of semiconductor devices
Grant 7,725,847 - Goto , et al. May 25, 2
2010-05-25
Design Support Apparatus for Semiconductor Devices
App 20080250363 - Goto; Akihiro ;   et al.
2008-10-09
Semiconductor device with reduced wiring paths between an array of semiconductor chip parts
Grant 6,984,882 - Matsushima January 10, 2
2006-01-10
Semiconductor device
App 20030234434 - Matsushima, Hironori
2003-12-25
Packaged semiconductor device and manufacturing method thereof
Grant 6,515,360 - Matsushima , et al. February 4, 2
2003-02-04
Semiconductor device
Grant 6,384,485 - Matsushima May 7, 2
2002-05-07
Packaged semiconductor device and manufacturing method thereof
App 20010040288 - Matsushima, Hironori ;   et al.
2001-11-15
Semiconductor device having a packaged semiconductor element and permanent vent and manufacturing method thereof
Grant 6,232,652 - Matsushima May 15, 2
2001-05-15
Resin seal semiconductor package and manufacturing method of the same
Grant 6,191,493 - Yasunaga , et al. February 20, 2
2001-02-20
Semiconductor device including a ball grid array
Grant 6,184,586 - Matsushima February 6, 2
2001-02-06
Resin seal semiconductor package and manufacturing method of the same
Grant 5,920,770 - Yasunaga , et al. July 6, 1
1999-07-06
Resin seal semiconductor package
Grant 5,753,973 - Yasunaga , et al. May 19, 1
1998-05-19
Resin seal semiconductor package
Grant 5,656,863 - Yasunaga , et al. August 12, 1
1997-08-12
Method of direct memory access control
Grant 5,067,075 - Sugano , et al. November 19, 1
1991-11-19

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