Matsuse; Kimihiro

Patent Applications and Registrations

Patent applications and USPTO patent grants for Matsuse; Kimihiro.The latest application filed is for "apparatus and method for real-time sensing of properties in industrial manufacturing equipment".

Company Profile

1.15.8

Matsuse; Kimihiro - Tokyo JP
Matsuse; Kimihiro - Minato-ku Tokyo
Matsuse; Kimihiro - Inagi JP
Matsuse, Kimihiro - Inagi-shi JP
Matsuse, Kimihiro - Tokyo-To JP
Matsuse, Kimihiro - Tama-shi JP
Matsuse; Kimihiro - Tama JP
Matsuse; Kimihiro - Yokohama JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Apparatus And Method For Real-time Sensing Of Properties In Industrial Manufacturing Equipment App 20210343560 - Ballandras; Sylvain ; et al.	2021-11-04
Apparatus and method for real-time sensing of properties in industrial manufacturing equipment Grant 11,114,321 - Ballandras , et al. September 7, 2	2021-09-07
Apparatus And Method For Real-time Sensing Of Properties In Industrial Manufacturing Equipment App 20190057887 - Ballandras; Sylvain ; et al.	2019-02-21
Method of forming a metal film for electrode Grant 7,829,144 - Matsuse , et al. November 9, 2	2010-11-09
TiSiN film forming method, diffusion barrier TiSiN film, semiconductor device, method of fabricating the same and TiSiN film forming system Grant 7,153,773 - Otsuki , et al. December 26, 2	2006-12-26
Method of forming a metal film for electrode App 20050191803 - Matsuse, Kimihiro ; et al.	2005-09-01
Method for forming TiSiN film, diffusion preventive film comprising TiSiN film, semiconductor device and its production method, and apparatus for forming TiSiN film Grant 6,919,273 - Otsuki , et al. July 19, 2	2005-07-19
Method of forming a barrier film and method of forming wiring structure and electrodes of semiconductor device having a barrier film Grant 6,861,356 - Matsuse , et al. March 1, 2	2005-03-01
Method of forming semiconductor wiring structures Grant 6,838,376 - Matsuse , et al. January 4, 2	2005-01-04
TiSiN film forming method, diffusion barrier TiSiN film, semiconductor device, method of fabricating the same and TiSiN film forming system App 20040232467 - Otsuki, Hayashi ; et al.	2004-11-25
Film forming apparatus and film forming method Grant 6,576,062 - Matsuse June 10, 2	2003-06-10
Wiring Structure Of Semiconductor Device, Electrode, And Method For Forming Them App 20030034560 - MATSUSE, KIMIHIRO ; et al.	2003-02-20
Method of forming a barrier film and method of forming wiring structure and electrodes of semiconductor device having a barrier film App 20020197856 - Matsuse, Kimihiro ; et al.	2002-12-26
Method and apparatus for forming a film on an object to be processed Grant 6,454,909 - Matsuse , et al. September 24, 2	2002-09-24
Laminated structure and a method of forming the same App 20020058384 - Koizumi, Masato ; et al.	2002-05-16
Film forming apparatus and film forming method App 20010007244 - Matsuse, Kimihiro	2001-07-12
Apparatus for forming laminated thin films or layers Grant 6,251,188 - Hashimoto , et al. June 26, 2	2001-06-26
Method of forming tungsten silicide film Grant 6,245,673 - Okubo , et al. June 12, 2	2001-06-12
Method and apparatus for forming laminated thin films or layers Grant 6,022,586 - Hashimoto , et al. February 8, 2	2000-02-08
Heat treatment apparatus Grant 5,997,651 - Matsuse , et al. December 7, 1	1999-12-07
Vacuum processing apparatus Grant 5,951,772 - Matsuse , et al. September 14, 1	1999-09-14
Vacuum processing apparatus Grant 5,647,945 - Matsuse , et al. July 15, 1	1997-07-15
Treating method Grant 4,913,790 - Narita , et al. April 3, 1	1990-04-03

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