MATSUOKA; Susumu

Patent Applications and Registrations

Patent applications and USPTO patent grants for MATSUOKA; Susumu.The latest application filed is for "hardly soluble beverage product".

Company Profile

0.11.13

MATSUOKA; Susumu - Miyaki-gun JP
Matsuoka; Susumu - Nagoya JP
Matsuoka; Susumu - Osaka JP
Matsuoka; Susumu - Nagoya-city JP
Matsuoka; Susumu - Tokyo JP
Matsuoka; Susumu - Kadoma JP
Matsuoka; Susumu - Hirakata JP
Matsuoka, Susumu - Hirakata-shi JP
Matsuoka; Susumu - Atsugi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Hardly Soluble Beverage Product App 20220232858 - FUJISHIGE; Eiji ; et al.	2022-07-28
Die for molding honeycomb structure and manufacturing method thereof Grant 8,226,400 - Matsuoka , et al. July 24, 2	2012-07-24
Circuit board and method for jointing circuit board Grant 8,115,109 - Koyama , et al. February 14, 2	2012-02-14
Bump forming method and bump forming apparatus Grant 7,905,011 - Taniguchi , et al. March 15, 2	2011-03-15
Die for molding honeycomb structure and manufacturing method thereof App 20100119640 - Matsuoka; Susumu ; et al.	2010-05-13
Die for molding honeycomb structure and manufacturing method thereof Grant 7,670,644 - Matsuoka , et al. March 2, 2	2010-03-02
Antifreeze composition comprising benzimidazole and triazine Grant 7,645,394 - Matsuoka , et al. January 12, 2	2010-01-12
Circuit Board And Method For Jointing Circuit Board App 20090266592 - Koyama; Masayoshi ; et al.	2009-10-29
Bump Forming Method And Bump Forming Apparatus App 20090229120 - Taniguchi; Yasushi ; et al.	2009-09-17
Method for manufacturing component built-in module, and component built-in module Grant 7,488,895 - Hayashi , et al. February 10, 2	2009-02-10
Multi-layer Circuit Substrate Manufacturing Method And Multi-layer Circuit Substrate App 20090032285 - Ueda; Yoji ; et al.	2009-02-05
Die for forming honeycomb structure, and method of manufacturing the same Grant 7,384,258 - Kuwahara , et al. June 10, 2	2008-06-10
Method for manufacturing component built-in module, and component built-in module App 20070119617 - Hayashi; Yoshitake ; et al.	2007-05-31
Method for removing titanium based coating film or oxide of titanium Grant 7,074,279 - Matsumoto , et al. July 11, 2	2006-07-11
Die for extrusion forming of ceramics App 20060088621 - Matsuoka; Susumu ; et al.	2006-04-27
Die for forming honeycomb structure, and method of manufacturing the same App 20060018988 - Kuwahara; Hiroshi ; et al.	2006-01-26
Antifreeze App 20050121646 - Matsuoka, Susumu ; et al.	2005-06-09
Honeycomb structural body forming ferrule and method of manufacturing the ferrule App 20050031727 - Matsuoka, Susumu ; et al.	2005-02-10
Method for removing titanium based coating film or oxide of titanium App 20040110654 - Matsumoto, Keiji ; et al.	2004-06-10
Method of producing a circuit board Grant 6,691,409 - Suzuki , et al. February 17, 2	2004-02-17
Circuit board and production of the same App 20030066683 - Suzuki, Takeshi ; et al.	2003-04-10
Circuit board and production of the same App 20020038725 - Suzuki, Takeshi ; et al.	2002-04-04
Power semiconductor device with heat dissipating property Grant 5,229,915 - Ishibashi , et al. July 20, 1	1993-07-20
Apparatus for controlling friction between leaf springs of a laminated leaf spring assembly Grant 4,456,232 - Shinbori , et al. June 26, 1	1984-06-26

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