Matsuo; Mitsuhiro
Patent Applications and Registrations
Patent applications and USPTO patent grants for Matsuo; Mitsuhiro.The latest application filed is for "magnetic component unit".
Company Profile
2.27.26
- Matsuo; Mitsuhiro - Otake JP
- Matsuo; Mitsuhiro - Fukushima JP
- Matsuo; Mitsuhiro - Otake-shi JP
- Matsuo; Mitsuhiro - Tokyo JP
- Matsuo; Mitsuhiro - Hiroshima N/A JP
- Matsuo; Mitsuhiro - Osaka JP
- Matsuo; Mitsuhiro - Ebetsu-shi JP
- Matsuo; Mitsuhiro - Moriguchi JP
- Matsuo; Mitsuhiro - Osaka-shi JP
- Matsuo, Mitsuhiro - Moriguchi-shi JP
Patent Activity
| Patent | Date |
|---|---|
| Methacrylic acid ester polymer, method for producing same, active energy ray-curable composition, and optical recording medium Grant 10,927,198 - Izumi , et al. February 23, 2 | 2021-02-23 |
| Magnetic component unit Grant 10,186,363 - Matsuo , et al. Ja | 2019-01-22 |
| Magnetic Component Unit App 20180019047 - MATSUO; Mitsuhiro ; et al. | 2018-01-18 |
| Method for producing methacrylic-based polymer Grant 8,981,019 - Yoshimura , et al. March 17, 2 | 2015-03-17 |
| Methacrylic Acid Ester Polymer, Method For Producing Same, Active Energy Ray-curable Composition, And Optical Recording Medium App 20140349129 - Izumi; Shinichirou ; et al. | 2014-11-27 |
| Set top box Grant D717,747 - Nishimoto , et al. November 18, 2 | 2014-11-18 |
| Set top box Grant D717,748 - Nishimoto , et al. November 18, 2 | 2014-11-18 |
| Apparatus for producing methacrylic polymer and production method thereof Grant 8,877,879 - Hayashida , et al. November 4, 2 | 2014-11-04 |
| Method For Producing Methacrylic-based Polymer App 20140309383 - Yoshimura; Hisaaki ; et al. | 2014-10-16 |
| Plastic optical fiber cable and method of transmitting signal Grant 8,422,844 - Tsukamoto , et al. April 16, 2 | 2013-04-16 |
| Apparatus For Producing Methacrylic Polymer And Production Method Thereof App 20130041117 - Hayashida; Masahiro ; et al. | 2013-02-14 |
| Plastic Optical Fiber Cable And Method Of Transmitting Signal App 20110176814 - Tsukamoto; Yoshihiro ; et al. | 2011-07-21 |
| Bidirectional power supply device Grant 7,839,128 - Yoshida , et al. November 23, 2 | 2010-11-23 |
| Power supply unit Grant 7,830,035 - Yoshida , et al. November 9, 2 | 2010-11-09 |
| Power supply device Grant 7,816,806 - Yoshida , et al. October 19, 2 | 2010-10-19 |
| Bidirectional Dc-dc Converter App 20100164446 - Matsuo; Mitsuhiro ; et al. | 2010-07-01 |
| Dc/dc Converter App 20100091530 - Yoshida; Koji ; et al. | 2010-04-15 |
| Power supply system Grant 7,679,337 - Yoshida , et al. March 16, 2 | 2010-03-16 |
| Power Supply Unit App 20090315401 - Yoshida; Koji ; et al. | 2009-12-24 |
| Power Supply Device App 20090236915 - Yoshida; Koji ; et al. | 2009-09-24 |
| Power Supply System App 20090200991 - Yoshida; Koji ; et al. | 2009-08-13 |
| Bidirectional Power Supply Device App 20090051337 - Yoshida; Koji ; et al. | 2009-02-26 |
| Switching power supply Grant 7,400,519 - Yoshida , et al. July 15, 2 | 2008-07-15 |
| Switching power supply apparatus and electronic device using the same Grant 7,351,931 - Yoshida , et al. April 1, 2 | 2008-04-01 |
| Encryption/decryption device, communication controller, and electronic instrument App 20070180270 - Kumagai; Tomonori ; et al. | 2007-08-02 |
| Encryption/decryption device, communication controller, and electronic instrument App 20060188098 - Kumagai; Tomonori ; et al. | 2006-08-24 |
| Switching power supply apparatus and electronic device using the same App 20060181252 - Yoshida; Koji ; et al. | 2006-08-17 |
| Method of manufacturing a thermal conductive circuit board with grounding pattern connected to a heat sink Grant 7,059,042 - Hirano , et al. June 13, 2 | 2006-06-13 |
| Power module and production method thereof Grant 7,057,896 - Matsuo , et al. June 6, 2 | 2006-06-06 |
| Switching power supply Grant 7,046,532 - Matsuo , et al. May 16, 2 | 2006-05-16 |
| Power module with improved heat dissipation Grant 7,038,310 - Nakatani , et al. May 2, 2 | 2006-05-02 |
| Thermally conductive substrate, thermally conductive substrate manufacturing method and power module Grant 7,033,865 - Yamashita , et al. April 25, 2 | 2006-04-25 |
| Switching power supply App 20060083029 - Yoshida; Koji ; et al. | 2006-04-20 |
| Switching power supply device Grant 6,972,656 - Takeshima , et al. December 6, 2 | 2005-12-06 |
| Switching power supply Grant 6,970,367 - Takeshima , et al. November 29, 2 | 2005-11-29 |
| Thermal conductive board, method of manufacturing the same, and power module with the same incorporated therein App 20050158916 - Hirano, Koichi ; et al. | 2005-07-21 |
| Switching power supply App 20050052888 - Takeshima, Yoshihiro ; et al. | 2005-03-10 |
| Method of manufacturing a thermally conductive circuit board with a ground pattern connected to a heat sink Grant 6,860,004 - Hirano , et al. March 1, 2 | 2005-03-01 |
| Switching power supply App 20040233685 - Matsuo, Mitsuhiro ; et al. | 2004-11-25 |
| Thermally conductive substrate, thermally conductive substrate manufacturing method and power module App 20040207053 - Yamashita, Yoshihisa ; et al. | 2004-10-21 |
| Power module and production method thereof App 20040070946 - Matsuo, Mitsuhiro ; et al. | 2004-04-15 |
| Switching power supply device App 20040042240 - Takeshima, Yoshihiro ; et al. | 2004-03-04 |
| Thermally conductive substrate, thermally conductive substrate manufacturing method and power module Grant 6,700,182 - Yamashita , et al. March 2, 2 | 2004-03-02 |
| Thermal conductive substrate and the method for manufacturing the same App 20030148079 - Hirano, Koichi ; et al. | 2003-08-07 |
| Thermal conductive substrate and the method for manufacturing the same Grant 6,570,099 - Hirano , et al. May 27, 2 | 2003-05-27 |
| Thermal conductive board, method of manufacturing the same, and power module with the same incorporated therein App 20030076663 - Hirano, Koichi ; et al. | 2003-04-24 |
| Thermally conductive board, method of manufacturing the same, and power module with the same incorporated therein Grant 6,522,555 - Hirano , et al. February 18, 2 | 2003-02-18 |
| Thermally conductive substrate, thermally conductive substrate manufacturing method and power module App 20020020897 - Yamashita, Yoshihisa ; et al. | 2002-02-21 |
| Thermally conductive board, method of manufacturing the same, and power module with the same incorporated therein App 20010036065 - Hirano, Koichi ; et al. | 2001-11-01 |
| Structure of a semiconductor chip having a conductive layer Grant 5,288,948 - Fukuda , et al. February 22, 1 | 1994-02-22 |
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