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name:-0.077539920806885
name:-0.058470010757446
name:-0.0064890384674072
MATSUO; Mie Patent Filings

MATSUO; Mie

Patent Applications and Registrations

Patent applications and USPTO patent grants for MATSUO; Mie.The latest application filed is for "semiconductor memory device".

Company Profile
6.53.59
  • MATSUO; Mie - Yokkaichi Mie JP
  • Matsuo; Mie - Yokkaichi JP
  • Matsuo; Mie - Kamakura Kanagawa JP
  • Matsuo; Mie - Kamakura JP
  • Matsuo; Mie - Kamakura-shi JP
  • Matsuo; Mie - Kanagawa N/A JP
  • Matsuo; Mie - Kanagawa-ken JP
  • Matsuo; Mie - Minato-ku JP
  • Matsuo; Mie - Yokohama JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Semiconductor Memory Device
App 20220301599 - SANUKI; Tomoya ;   et al.
2022-09-22
Manufacturing method of semiconductor device
Grant 11,417,626 - Matsuo , et al. August 16, 2
2022-08-16
Anodization Apparatus And Anodization Method
App 20220251722 - MATSUO; Mie
2022-08-11
Semiconductor device
Grant 11,355,441 - Nomura , et al. June 7, 2
2022-06-07
Semiconductor Device, Method Of Manufacturing Semiconductor Device, And Method Of Recycling Substrate
App 20220059408 - HAYASHI; Hidekazu ;   et al.
2022-02-24
Memory System
App 20220011963 - SANUKI; Tomoya ;   et al.
2022-01-13
Semiconductor device
Grant 11,189,554 - Okada , et al. November 30, 2
2021-11-30
Semiconductor Device Manufacturing Method And Semiconductor Device
App 20210343584 - Matsuo; Mie
2021-11-04
Semiconductor device manufacturing method and semiconductor device
Grant 11,101,167 - Matsuo August 24, 2
2021-08-24
Semiconductor Memory Device
App 20210118898 - FUKUZUMI; Yoshiaki ;   et al.
2021-04-22
Manufacturing Method Of Semiconductor Device
App 20210074672 - MATSUO; Mie ;   et al.
2021-03-11
Semiconductor memory device having a bonded circuit chip including a solid state drive controller connected to a control circuit
Grant 10,892,269 - Fukuzumi , et al. January 12, 2
2021-01-12
Semiconductor Device Manufacturing Method And Semiconductor Device
App 20200303241 - MATSUO; Mie
2020-09-24
Semiconductor Device
App 20200091056 - Okada; Shiro ;   et al.
2020-03-19
Semiconductor Device
App 20190295954 - NOMURA; Kazushiro ;   et al.
2019-09-26
Semiconductor Memory Device
App 20190273090 - FUKUZUMI; Yoshiaki ;   et al.
2019-09-05
Laser Processing Method
App 20190096763 - MATSUO; Mie
2019-03-28
Composite Substrate, Semiconductor Device, And Method For Manufacturing Thereof
App 20170221705 - MATSUO; Mie ;   et al.
2017-08-03
Method for manufacturing semiconductor device that includes dividing semiconductor substrate by dry etching
Grant 9,633,902 - Matsui , et al. April 25, 2
2017-04-25
Semiconductor Light Emitting Element, Method For Manufacturing Same, And Light Emitting Device
App 20160276532 - MORI; Kentaro ;   et al.
2016-09-22
Method For Manufacturing Semiconductor Device
App 20160268164 - MATSUI; Satoshi ;   et al.
2016-09-15
Method For Manufacturing Semiconductor Device
App 20160268165 - MATSUI; Satoshi ;   et al.
2016-09-15
Light Emitting Device And Manufacturing Method Thereof
App 20160079493 - MATSUO; Mie
2016-03-17
Optical waveguide sensor chip, optical waveguide sensor, and method for manufacturing optical waveguide sensor chip
Grant 8,837,871 - Fujii , et al. September 16, 2
2014-09-16
Method of manufacturing semiconductor device, semiconductor device, and camera module
Grant 8,748,316 - Shirono , et al. June 10, 2
2014-06-10
Semiconductor device and manufacturing method thereof
Grant 8,580,652 - Kawasaki , et al. November 12, 2
2013-11-12
Multichip semiconductor device, chip therefor and method of formation thereof
Grant 8,283,755 - Hayasaka , et al. October 9, 2
2012-10-09
Surface treatment composition, surface treatment method, and method for manufacturing semiconductor device
Grant 8,257,504 - Mori , et al. September 4, 2
2012-09-04
Semiconductor device, through hole having expansion portion and thin insulating film
Grant 8,237,285 - Tanida , et al. August 7, 2
2012-08-07
Semiconductor package and camera module
Grant 8,228,426 - Matsuo , et al. July 24, 2
2012-07-24
Semiconductor device and semiconductor memory tester
Grant 8,179,730 - Shimizu , et al. May 15, 2
2012-05-15
Multichip semiconductor device, chip therefor and method of formation thereof
Grant 8,174,093 - Hayasaka , et al. May 8, 2
2012-05-08
Optical Waveguide Sensor Chip, Optical Waveguide Sensor, And Method For Manufacturing Optical Waveguide Sensor Chip
App 20120014638 - FUJII; Mika ;   et al.
2012-01-19
Back-illuminated type solid-state image pickup apparatus with peripheral circuit unit
Grant 8,098,312 - Matsuo , et al. January 17, 2
2012-01-17
Method Of Manufacturing Semiconductor Device, Semiconductor Device, And Camera Module
App 20110317050 - Shirono; Takashi ;   et al.
2011-12-29
Multichip semiconductor device, chip therefor and method of formation thereof
App 20110215443 - Hayasaka; Nobuo ;   et al.
2011-09-08
Optical Element, Optical Element Manufacturing Method, And Camera Module
App 20110216238 - FUJII; Mika ;   et al.
2011-09-08
Multichip semiconductor device, chip therefor and method of formation thereof
App 20110101522 - Hayasaka; Nobuo ;   et al.
2011-05-05
Semiconductor Device And Semiconductor Memory Tester
App 20110074494 - Shimizu; Yuui ;   et al.
2011-03-31
Semiconductor Device And Manufacturing Method Thereof
App 20110068476 - KAWASAKI; Atsuko ;   et al.
2011-03-24
Semiconductor device and semiconductor memory tester
Grant 7,869,240 - Shimizu , et al. January 11, 2
2011-01-11
Back-illuminated type solid-state image pickup device and camera module using the same
Grant 7,859,073 - Matsuo , et al. December 28, 2
2010-12-28
Semiconductor Device, Camera Module And Method Of Manufacturing Semiconductor Device
App 20100321544 - MATSUO; Mie ;   et al.
2010-12-23
Surface Treatment Composition, Surface Treatment Method, And Method For Manufacturing Semiconductor Device
App 20100311630 - MORI; Yasumasa ;   et al.
2010-12-09
Multichip semiconductor device, chip therefor and method of formation thereof
Grant 7,829,975 - Hayasaka , et al. November 9, 2
2010-11-09
Semiconductor package including through-hole electrode and light-transmitting substrate
Grant 7,808,064 - Kawasaki , et al. October 5, 2
2010-10-05
Semiconductor Device And Manufacturing Method Of Semiconductor Device
App 20100025860 - Tanida; Kazumasa ;   et al.
2010-02-04
Solid-state Image Pickup Apparatus And Camera Module
App 20090295979 - MATSUO; Mie ;   et al.
2009-12-03
Semiconductor Package And Camera Module
App 20090284631 - MATSUO; Mie ;   et al.
2009-11-19
Semiconductor Package Including Through-hole Electrode And Light-transmitting Substrate
App 20090283847 - KAWASAKI; Atsuko ;   et al.
2009-11-19
Method for fabricating semiconductor device
Grant 7,608,537 - Matsuo , et al. October 27, 2
2009-10-27
Semiconductor device having power semiconductor elements
Grant 7,531,876 - Omura , et al. May 12, 2
2009-05-12
Method for manufacturing a semiconductor device
Grant 7,521,352 - Shinomiya , et al. April 21, 2
2009-04-21
Method for fabricating a localize SOI in bulk silicon substrate including changing first trenches formed in the substrate into unclosed empty space by applying heat treatment
Grant 7,507,634 - Sato , et al. March 24, 2
2009-03-24
Electronic component having micro-electrical mechanical system
Grant 7,482,194 - Matsuo January 27, 2
2009-01-27
Back-illuminated Type Solid-state Image Pickup Device And Camera Module Using The Same
App 20090014762 - MATSUO; Mie ;   et al.
2009-01-15
Semiconductor Device And Semiconductor Memory Tester
App 20090003103 - SHIMIZU; Yuui ;   et al.
2009-01-01
Multichip semiconductor device, chip therefor and method of formation thereof
App 20080237888 - Hayasaka; Nobuo ;   et al.
2008-10-02
Semiconductor device having actuator
Grant 7,427,797 - Ohguro , et al. September 23, 2
2008-09-23
Semiconductor device
Grant 7,402,903 - Matsuo July 22, 2
2008-07-22
Method for Fabricating Semiconductor Device
App 20080081466 - MATSUO; Mie ;   et al.
2008-04-03
Multichip semiconductor device, chip therefor and method of formation thereof
Grant 7,335,517 - Hayasaka , et al. February 26, 2
2008-02-26
Semiconductor substrate and its fabrication method
App 20080003771 - Sato; Tsutomu ;   et al.
2008-01-03
Method for manufacturing a semiconductor device
App 20070254474 - Shinomiya; Hideo ;   et al.
2007-11-01
Heating element movement bonding method for semiconductor components
Grant 7,238,919 - Kaneko , et al. July 3, 2
2007-07-03
Method of making empty space in silicon
Grant 7,235,456 - Sato , et al. June 26, 2
2007-06-26
Variable-capacitance element, variable-capacitance device, and portable phone including variable-capacitance device
Grant 7,177,134 - Ikehashi , et al. February 13, 2
2007-02-13
Variable-capacitance element, variable-capacitance device, and portable phone including variable-capacitance device
App 20060209491 - Ikehashi; Tamio ;   et al.
2006-09-21
Bonding method and bonding apparatus
App 20060207985 - Kaneko; Hisashi ;   et al.
2006-09-21
Semiconductor device, semiconductor package member, and semiconductor device manufacturing method
Grant 7,095,112 - Endo , et al. August 22, 2
2006-08-22
Electronic component having micro-electrical mechanical system
App 20060157808 - Matsuo; Mie
2006-07-20
Semiconductor device
Grant 7,067,897 - Hatano , et al. June 27, 2
2006-06-27
Semiconductor substrate and its fabrication method
App 20060131651 - Sato; Tsutomu ;   et al.
2006-06-22
Electronic component having micro-electrical mechanical system
Grant 7,053,456 - Matsuo May 30, 2
2006-05-30
Wafer support plate, holding method of thin wafer, and manufacturing method of semiconductor device
App 20060102290 - Harada; Susumu ;   et al.
2006-05-18
Semiconductor device having actuator
App 20060098059 - Ohguro; Tatsuya ;   et al.
2006-05-11
Semiconductor device and method of manufacturing semiconductor device
App 20060071271 - Omura; Ichiro ;   et al.
2006-04-06
Semiconductor substrate having pillars within a closed empty space
Grant 7,019,364 - Sato , et al. March 28, 2
2006-03-28
Semiconductor device
Grant 7,019,398 - Matsuo March 28, 2
2006-03-28
Semiconductor device and manufacturing method thereof
App 20060055050 - Numata; Hideo ;   et al.
2006-03-16
Stacked type semiconductor device
Grant 6,991,964 - Matsuo , et al. January 31, 2
2006-01-31
Electronic component having micro-electrical mechanical system
App 20050218488 - Matsuo, Mie
2005-10-06
Integrated circuit device and method of manufacturing the same
Grant 6,933,205 - Matsuo , et al. August 23, 2
2005-08-23
Multichip semiconductor device, chip therefor and method of formation thereof
App 20050014311 - Hayasaka, Nobuo ;   et al.
2005-01-20
Stacked type semiconductor device
App 20050001306 - Matsuo, Mie ;   et al.
2005-01-06
Semiconductor device
App 20040262767 - Matsuo, Mie
2004-12-30
Stacked type semiconductor device
Grant 6,812,557 - Matsuo , et al. November 2, 2
2004-11-02
Multichip semiconductor device, chip therefor and method of formation thereof
Grant 6,809,421 - Hayasaka , et al. October 26, 2
2004-10-26
Stacked type semiconductor device
Grant 6,791,175 - Matsuo , et al. September 14, 2
2004-09-14
Stacked type semiconductor device
App 20040129939 - Matsuo, Mie ;   et al.
2004-07-08
Semiconductor device and method of manufacturing the same
Grant 6,734,568 - Matsuo , et al. May 11, 2
2004-05-11
Stacked type semiconductor device
Grant 6,717,251 - Matsuo , et al. April 6, 2
2004-04-06
Semiconductor device, semiconductor package member, and semiconductor device manufacturing method
App 20040056341 - Endo, Mitsuyoshi ;   et al.
2004-03-25
Semiconductor device, its manufacturing process, position matching mark, pattern forming method and pattern forming device
Grant 6,709,966 - Hisatsune , et al. March 23, 2
2004-03-23
Method of manufacturing semiconductor device
App 20040038520 - Seto, Masaharu ;   et al.
2004-02-26
Semiconductor device
App 20030230803 - Matsuo, Mie
2003-12-18
Stacked circuit device and method for evaluating an integrated circuit substrate using the stacked circuit device
Grant 6,614,106 - Matsuo , et al. September 2, 2
2003-09-02
Semiconductor device
App 20030155590 - Hatano, Masaaki ;   et al.
2003-08-21
Integrated circuit device and method of manufacturing the same
App 20030067052 - Matsuo, Mie ;   et al.
2003-04-10
Stacked type semiconductor device
App 20030062612 - Matsuo, Mie ;   et al.
2003-04-03
Semiconductor device and method of manufacturing the same
App 20030052409 - Matsuo, Mie ;   et al.
2003-03-20
Passive semiconductor device mounted as daughter chip on active semiconductor device
Grant 6,504,227 - Matsuo , et al. January 7, 2
2003-01-07
Method, system and program product for trading electronic products
App 20020143656 - Matsuo, Mie ;   et al.
2002-10-03
Stacked type semiconductor device
App 20020036338 - Matsuo, Mie ;   et al.
2002-03-28
Stacked circuit device and method for evaluating an integrated circuit substrate using the stacked circuit device
App 20020036340 - Matsuo, Mie ;   et al.
2002-03-28
Polishing method and polishing apparatus
Grant 5,775,980 - Sasaki , et al. July 7, 1
1998-07-07
Semiconductor device having a metal film formed in a groove in an insulating film
Grant 5,731,634 - Matsuo , et al. March 24, 1
1998-03-24
Polishing method and polishing apparatus
Grant 5,607,718 - Sasaki , et al. March 4, 1
1997-03-04
Method for forming an electrode and/or wiring layer by reducing copper oxide or silver oxide
Grant 5,561,082 - Matsuo , et al. October 1, 1
1996-10-01

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