Patent | Date |
---|
Semiconductor Memory Device App 20220301599 - SANUKI; Tomoya ;   et al. | 2022-09-22 |
Manufacturing method of semiconductor device Grant 11,417,626 - Matsuo , et al. August 16, 2 | 2022-08-16 |
Anodization Apparatus And Anodization Method App 20220251722 - MATSUO; Mie | 2022-08-11 |
Semiconductor device Grant 11,355,441 - Nomura , et al. June 7, 2 | 2022-06-07 |
Semiconductor Device, Method Of Manufacturing Semiconductor Device, And Method Of Recycling Substrate App 20220059408 - HAYASHI; Hidekazu ;   et al. | 2022-02-24 |
Memory System App 20220011963 - SANUKI; Tomoya ;   et al. | 2022-01-13 |
Semiconductor device Grant 11,189,554 - Okada , et al. November 30, 2 | 2021-11-30 |
Semiconductor Device Manufacturing Method And Semiconductor Device App 20210343584 - Matsuo; Mie | 2021-11-04 |
Semiconductor device manufacturing method and semiconductor device Grant 11,101,167 - Matsuo August 24, 2 | 2021-08-24 |
Semiconductor Memory Device App 20210118898 - FUKUZUMI; Yoshiaki ;   et al. | 2021-04-22 |
Manufacturing Method Of Semiconductor Device App 20210074672 - MATSUO; Mie ;   et al. | 2021-03-11 |
Semiconductor memory device having a bonded circuit chip including a solid state drive controller connected to a control circuit Grant 10,892,269 - Fukuzumi , et al. January 12, 2 | 2021-01-12 |
Semiconductor Device Manufacturing Method And Semiconductor Device App 20200303241 - MATSUO; Mie | 2020-09-24 |
Semiconductor Device App 20200091056 - Okada; Shiro ;   et al. | 2020-03-19 |
Semiconductor Device App 20190295954 - NOMURA; Kazushiro ;   et al. | 2019-09-26 |
Semiconductor Memory Device App 20190273090 - FUKUZUMI; Yoshiaki ;   et al. | 2019-09-05 |
Laser Processing Method App 20190096763 - MATSUO; Mie | 2019-03-28 |
Composite Substrate, Semiconductor Device, And Method For Manufacturing Thereof App 20170221705 - MATSUO; Mie ;   et al. | 2017-08-03 |
Method for manufacturing semiconductor device that includes dividing semiconductor substrate by dry etching Grant 9,633,902 - Matsui , et al. April 25, 2 | 2017-04-25 |
Semiconductor Light Emitting Element, Method For Manufacturing Same, And Light Emitting Device App 20160276532 - MORI; Kentaro ;   et al. | 2016-09-22 |
Method For Manufacturing Semiconductor Device App 20160268164 - MATSUI; Satoshi ;   et al. | 2016-09-15 |
Method For Manufacturing Semiconductor Device App 20160268165 - MATSUI; Satoshi ;   et al. | 2016-09-15 |
Light Emitting Device And Manufacturing Method Thereof App 20160079493 - MATSUO; Mie | 2016-03-17 |
Optical waveguide sensor chip, optical waveguide sensor, and method for manufacturing optical waveguide sensor chip Grant 8,837,871 - Fujii , et al. September 16, 2 | 2014-09-16 |
Method of manufacturing semiconductor device, semiconductor device, and camera module Grant 8,748,316 - Shirono , et al. June 10, 2 | 2014-06-10 |
Semiconductor device and manufacturing method thereof Grant 8,580,652 - Kawasaki , et al. November 12, 2 | 2013-11-12 |
Multichip semiconductor device, chip therefor and method of formation thereof Grant 8,283,755 - Hayasaka , et al. October 9, 2 | 2012-10-09 |
Surface treatment composition, surface treatment method, and method for manufacturing semiconductor device Grant 8,257,504 - Mori , et al. September 4, 2 | 2012-09-04 |
Semiconductor device, through hole having expansion portion and thin insulating film Grant 8,237,285 - Tanida , et al. August 7, 2 | 2012-08-07 |
Semiconductor package and camera module Grant 8,228,426 - Matsuo , et al. July 24, 2 | 2012-07-24 |
Semiconductor device and semiconductor memory tester Grant 8,179,730 - Shimizu , et al. May 15, 2 | 2012-05-15 |
Multichip semiconductor device, chip therefor and method of formation thereof Grant 8,174,093 - Hayasaka , et al. May 8, 2 | 2012-05-08 |
Optical Waveguide Sensor Chip, Optical Waveguide Sensor, And Method For Manufacturing Optical Waveguide Sensor Chip App 20120014638 - FUJII; Mika ;   et al. | 2012-01-19 |
Back-illuminated type solid-state image pickup apparatus with peripheral circuit unit Grant 8,098,312 - Matsuo , et al. January 17, 2 | 2012-01-17 |
Method Of Manufacturing Semiconductor Device, Semiconductor Device, And Camera Module App 20110317050 - Shirono; Takashi ;   et al. | 2011-12-29 |
Multichip semiconductor device, chip therefor and method of formation thereof App 20110215443 - Hayasaka; Nobuo ;   et al. | 2011-09-08 |
Optical Element, Optical Element Manufacturing Method, And Camera Module App 20110216238 - FUJII; Mika ;   et al. | 2011-09-08 |
Multichip semiconductor device, chip therefor and method of formation thereof App 20110101522 - Hayasaka; Nobuo ;   et al. | 2011-05-05 |
Semiconductor Device And Semiconductor Memory Tester App 20110074494 - Shimizu; Yuui ;   et al. | 2011-03-31 |
Semiconductor Device And Manufacturing Method Thereof App 20110068476 - KAWASAKI; Atsuko ;   et al. | 2011-03-24 |
Semiconductor device and semiconductor memory tester Grant 7,869,240 - Shimizu , et al. January 11, 2 | 2011-01-11 |
Back-illuminated type solid-state image pickup device and camera module using the same Grant 7,859,073 - Matsuo , et al. December 28, 2 | 2010-12-28 |
Semiconductor Device, Camera Module And Method Of Manufacturing Semiconductor Device App 20100321544 - MATSUO; Mie ;   et al. | 2010-12-23 |
Surface Treatment Composition, Surface Treatment Method, And Method For Manufacturing Semiconductor Device App 20100311630 - MORI; Yasumasa ;   et al. | 2010-12-09 |
Multichip semiconductor device, chip therefor and method of formation thereof Grant 7,829,975 - Hayasaka , et al. November 9, 2 | 2010-11-09 |
Semiconductor package including through-hole electrode and light-transmitting substrate Grant 7,808,064 - Kawasaki , et al. October 5, 2 | 2010-10-05 |
Semiconductor Device And Manufacturing Method Of Semiconductor Device App 20100025860 - Tanida; Kazumasa ;   et al. | 2010-02-04 |
Solid-state Image Pickup Apparatus And Camera Module App 20090295979 - MATSUO; Mie ;   et al. | 2009-12-03 |
Semiconductor Package And Camera Module App 20090284631 - MATSUO; Mie ;   et al. | 2009-11-19 |
Semiconductor Package Including Through-hole Electrode And Light-transmitting Substrate App 20090283847 - KAWASAKI; Atsuko ;   et al. | 2009-11-19 |
Method for fabricating semiconductor device Grant 7,608,537 - Matsuo , et al. October 27, 2 | 2009-10-27 |
Semiconductor device having power semiconductor elements Grant 7,531,876 - Omura , et al. May 12, 2 | 2009-05-12 |
Method for manufacturing a semiconductor device Grant 7,521,352 - Shinomiya , et al. April 21, 2 | 2009-04-21 |
Method for fabricating a localize SOI in bulk silicon substrate including changing first trenches formed in the substrate into unclosed empty space by applying heat treatment Grant 7,507,634 - Sato , et al. March 24, 2 | 2009-03-24 |
Electronic component having micro-electrical mechanical system Grant 7,482,194 - Matsuo January 27, 2 | 2009-01-27 |
Back-illuminated Type Solid-state Image Pickup Device And Camera Module Using The Same App 20090014762 - MATSUO; Mie ;   et al. | 2009-01-15 |
Semiconductor Device And Semiconductor Memory Tester App 20090003103 - SHIMIZU; Yuui ;   et al. | 2009-01-01 |
Multichip semiconductor device, chip therefor and method of formation thereof App 20080237888 - Hayasaka; Nobuo ;   et al. | 2008-10-02 |
Semiconductor device having actuator Grant 7,427,797 - Ohguro , et al. September 23, 2 | 2008-09-23 |
Semiconductor device Grant 7,402,903 - Matsuo July 22, 2 | 2008-07-22 |
Method for Fabricating Semiconductor Device App 20080081466 - MATSUO; Mie ;   et al. | 2008-04-03 |
Multichip semiconductor device, chip therefor and method of formation thereof Grant 7,335,517 - Hayasaka , et al. February 26, 2 | 2008-02-26 |
Semiconductor substrate and its fabrication method App 20080003771 - Sato; Tsutomu ;   et al. | 2008-01-03 |
Method for manufacturing a semiconductor device App 20070254474 - Shinomiya; Hideo ;   et al. | 2007-11-01 |
Heating element movement bonding method for semiconductor components Grant 7,238,919 - Kaneko , et al. July 3, 2 | 2007-07-03 |
Method of making empty space in silicon Grant 7,235,456 - Sato , et al. June 26, 2 | 2007-06-26 |
Variable-capacitance element, variable-capacitance device, and portable phone including variable-capacitance device Grant 7,177,134 - Ikehashi , et al. February 13, 2 | 2007-02-13 |
Variable-capacitance element, variable-capacitance device, and portable phone including variable-capacitance device App 20060209491 - Ikehashi; Tamio ;   et al. | 2006-09-21 |
Bonding method and bonding apparatus App 20060207985 - Kaneko; Hisashi ;   et al. | 2006-09-21 |
Semiconductor device, semiconductor package member, and semiconductor device manufacturing method Grant 7,095,112 - Endo , et al. August 22, 2 | 2006-08-22 |
Electronic component having micro-electrical mechanical system App 20060157808 - Matsuo; Mie | 2006-07-20 |
Semiconductor device Grant 7,067,897 - Hatano , et al. June 27, 2 | 2006-06-27 |
Semiconductor substrate and its fabrication method App 20060131651 - Sato; Tsutomu ;   et al. | 2006-06-22 |
Electronic component having micro-electrical mechanical system Grant 7,053,456 - Matsuo May 30, 2 | 2006-05-30 |
Wafer support plate, holding method of thin wafer, and manufacturing method of semiconductor device App 20060102290 - Harada; Susumu ;   et al. | 2006-05-18 |
Semiconductor device having actuator App 20060098059 - Ohguro; Tatsuya ;   et al. | 2006-05-11 |
Semiconductor device and method of manufacturing semiconductor device App 20060071271 - Omura; Ichiro ;   et al. | 2006-04-06 |
Semiconductor substrate having pillars within a closed empty space Grant 7,019,364 - Sato , et al. March 28, 2 | 2006-03-28 |
Semiconductor device Grant 7,019,398 - Matsuo March 28, 2 | 2006-03-28 |
Semiconductor device and manufacturing method thereof App 20060055050 - Numata; Hideo ;   et al. | 2006-03-16 |
Stacked type semiconductor device Grant 6,991,964 - Matsuo , et al. January 31, 2 | 2006-01-31 |
Electronic component having micro-electrical mechanical system App 20050218488 - Matsuo, Mie | 2005-10-06 |
Integrated circuit device and method of manufacturing the same Grant 6,933,205 - Matsuo , et al. August 23, 2 | 2005-08-23 |
Multichip semiconductor device, chip therefor and method of formation thereof App 20050014311 - Hayasaka, Nobuo ;   et al. | 2005-01-20 |
Stacked type semiconductor device App 20050001306 - Matsuo, Mie ;   et al. | 2005-01-06 |
Semiconductor device App 20040262767 - Matsuo, Mie | 2004-12-30 |
Stacked type semiconductor device Grant 6,812,557 - Matsuo , et al. November 2, 2 | 2004-11-02 |
Multichip semiconductor device, chip therefor and method of formation thereof Grant 6,809,421 - Hayasaka , et al. October 26, 2 | 2004-10-26 |
Stacked type semiconductor device Grant 6,791,175 - Matsuo , et al. September 14, 2 | 2004-09-14 |
Stacked type semiconductor device App 20040129939 - Matsuo, Mie ;   et al. | 2004-07-08 |
Semiconductor device and method of manufacturing the same Grant 6,734,568 - Matsuo , et al. May 11, 2 | 2004-05-11 |
Stacked type semiconductor device Grant 6,717,251 - Matsuo , et al. April 6, 2 | 2004-04-06 |
Semiconductor device, semiconductor package member, and semiconductor device manufacturing method App 20040056341 - Endo, Mitsuyoshi ;   et al. | 2004-03-25 |
Semiconductor device, its manufacturing process, position matching mark, pattern forming method and pattern forming device Grant 6,709,966 - Hisatsune , et al. March 23, 2 | 2004-03-23 |
Method of manufacturing semiconductor device App 20040038520 - Seto, Masaharu ;   et al. | 2004-02-26 |
Semiconductor device App 20030230803 - Matsuo, Mie | 2003-12-18 |
Stacked circuit device and method for evaluating an integrated circuit substrate using the stacked circuit device Grant 6,614,106 - Matsuo , et al. September 2, 2 | 2003-09-02 |
Semiconductor device App 20030155590 - Hatano, Masaaki ;   et al. | 2003-08-21 |
Integrated circuit device and method of manufacturing the same App 20030067052 - Matsuo, Mie ;   et al. | 2003-04-10 |
Stacked type semiconductor device App 20030062612 - Matsuo, Mie ;   et al. | 2003-04-03 |
Semiconductor device and method of manufacturing the same App 20030052409 - Matsuo, Mie ;   et al. | 2003-03-20 |
Passive semiconductor device mounted as daughter chip on active semiconductor device Grant 6,504,227 - Matsuo , et al. January 7, 2 | 2003-01-07 |
Method, system and program product for trading electronic products App 20020143656 - Matsuo, Mie ;   et al. | 2002-10-03 |
Stacked type semiconductor device App 20020036338 - Matsuo, Mie ;   et al. | 2002-03-28 |
Stacked circuit device and method for evaluating an integrated circuit substrate using the stacked circuit device App 20020036340 - Matsuo, Mie ;   et al. | 2002-03-28 |
Polishing method and polishing apparatus Grant 5,775,980 - Sasaki , et al. July 7, 1 | 1998-07-07 |
Semiconductor device having a metal film formed in a groove in an insulating film Grant 5,731,634 - Matsuo , et al. March 24, 1 | 1998-03-24 |
Polishing method and polishing apparatus Grant 5,607,718 - Sasaki , et al. March 4, 1 | 1997-03-04 |
Method for forming an electrode and/or wiring layer by reducing copper oxide or silver oxide Grant 5,561,082 - Matsuo , et al. October 1, 1 | 1996-10-01 |