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Patent applications and USPTO patent grants for Matsuo; Itaru.The latest application filed is for "manufacturing method of semiconductor device".
Patent | Date |
---|---|
Manufacturing method of semiconductor device Grant 10,252,454 - Matsuo | 2019-04-09 |
Manufacturing Method Of Semiconductor Device App 20180281255 - MATSUO; Itaru | 2018-10-04 |
Method of forming leads of a packaged semiconductor device App 20060237087 - Yamasaki; Hidetaka ;   et al. | 2006-10-26 |
Method of forming leads of a semiconductor device Grant 7,077,170 - Yamasaki , et al. July 18, 2 | 2006-07-18 |
Lead forming for a semiconductor device App 20050076967 - Yamasaki, Hidetaka ;   et al. | 2005-04-14 |
Clamping apparatus Grant 6,830,446 - Harada , et al. December 14, 2 | 2004-12-14 |
Resin molding apparatus App 20040022884 - Matsuo, Itaru | 2004-02-05 |
Method for manufacturing a semiconductor device and a resin sealing device therefor App 20030180985 - Katou, Kiyoharu ;   et al. | 2003-09-25 |
Clamping apparatus App 20030108636 - Harada, Hiroyoshi ;   et al. | 2003-06-12 |
Semiconductor device and apparatus for manufacturing same App 20030038363 - Matsuo, Itaru | 2003-02-27 |
Semiconductor device substrate and semiconductor device fabrication method App 20020064899 - Matsuo, Itaru ;   et al. | 2002-05-30 |
Plastic molding device for a semiconductor element Grant 4,755,124 - Tanaka , et al. July 5, 1 | 1988-07-05 |
Process for producing oil-containing, microspherical carbonaceous particles Grant 4,522,627 - Gomi , et al. June 11, 1 | 1985-06-11 |
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