loadpatents
name:-0.026908874511719
name:-0.017155885696411
name:-0.0036628246307373
MATSUNO; KOSO Patent Filings

MATSUNO; KOSO

Patent Applications and Registrations

Patent applications and USPTO patent grants for MATSUNO; KOSO.The latest application filed is for "mounting method and mounting structure formed by the same".

Company Profile
2.16.20
  • MATSUNO; KOSO - Osaka JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Mounting Method And Mounting Structure Formed By The Same
App 20220030721 - OHASHI; NAOMICHI ;   et al.
2022-01-27
Photocurable Composition And Liquid Crystal Display Device
App 20210380747 - KAWASHIMA; KEISUKE ;   et al.
2021-12-09
Resin Flux Solder Paste And Mount Structure
App 20210354251 - Hino; Hirohisa ;   et al.
2021-11-18
Curable Resin Composition And Mounting Structure
App 20210309829 - OHASHI; NAOMICHI ;   et al.
2021-10-07
Photocurable composition
Grant 11,053,328 - Kawashima , et al. July 6, 2
2021-07-06
Solder Paste And Mounting Structure
App 20210129273 - OHASHI; NAOMICHI ;   et al.
2021-05-06
Solder Paste And Joining Structure
App 20210121992 - OHASHI; NAOMICHI ;   et al.
2021-04-29
Photocurable Composition
App 20200325252 - KAWASHIMA; KEISUKE ;   et al.
2020-10-15
Photocurable Resin Composition, Adhesive, Stacked Structure, Method For Fabricating The Stacked Structure, And Display Device
App 20200040131 - FUKAMOTO; Yusuke ;   et al.
2020-02-06
Solder Paste And Mount Structure
App 20190232438 - HINO; HIROHISA ;   et al.
2019-08-01
Method and device for peeling off silicon wafers
Grant 8,992,726 - Matsuno , et al. March 31, 2
2015-03-31
Electrode bonding structure, and manufacturing method for electrode bonding structure
Grant 8,867,228 - Katsura , et al. October 21, 2
2014-10-21
Method And Device For Peeling Off Silicon Wafers
App 20130319619 - MATSUNO; Koso ;   et al.
2013-12-05
Package structure
Grant 8,482,931 - Kuwabara , et al. July 9, 2
2013-07-09
Mounted structure
Grant 8,410,377 - Yamaguchi , et al. April 2, 2
2013-04-02
Mounting structure for semiconductor element with underfill resin
Grant 8,378,472 - Matsuno , et al. February 19, 2
2013-02-19
Electronic component packaging structure having two-layer moisture-proof coating and method for manufacturing the same
Grant 8,344,268 - Tsujimura , et al. January 1, 2
2013-01-01
Structure with electronic component mounted therein and method for manufacturing such structure
Grant 8,345,444 - Sakatani , et al. January 1, 2
2013-01-01
Mounting structure and electronic equipment
Grant 8,319,108 - Yamaguchi , et al. November 27, 2
2012-11-27
Electrode Bonding Structure, And Manufacturing Method For Electrode Bonding Structure
App 20120285731 - KATSURA; Hiroaki ;   et al.
2012-11-15
Mounted structural body and method of manufacturing the same
Grant 8,179,686 - Sakatani , et al. May 15, 2
2012-05-15
Mounting structure
Grant 8,138,426 - Matsuno , et al. March 20, 2
2012-03-20
Structure With Electronic Component Mounted Therein And Method For Manufacturing Such Structure
App 20110110050 - Sakatani; Shigeaki ;   et al.
2011-05-12
Mounting Structure
App 20100224398 - Matsuno; Koso ;   et al.
2010-09-09
Electrically conductive adhesive
Grant 7,785,500 - Yamaguchi , et al. August 31, 2
2010-08-31
Package Structure
App 20100159719 - KUWABARA; Ryo ;   et al.
2010-06-24
Mounting Structure And Electronic Equipment
App 20100032190 - YAMAGUCHI; Atsushi ;   et al.
2010-02-11
Electronic Component Packaging Structure Having Two-layer Moisture-proof Coating And Method For Manufacturing The Same
App 20100002401 - TSUJIMURA; Hideyuki ;   et al.
2010-01-07
Mounted Structural Body And Method Of Manufacturing The Same
App 20090120675 - SAKATANI; Shigeaki ;   et al.
2009-05-14
Electrically Conductive Adhesive
App 20090114885 - Yamaguchi; Atsushi ;   et al.
2009-05-07
Mounted Structure
App 20090116205 - Yamaguchi; Atsushi ;   et al.
2009-05-07
Mounting Structure
App 20090116203 - MATSUNO; Koso ;   et al.
2009-05-07

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