Matsunaga; Tetsuhiro

Patent Applications and Registrations

Patent applications and USPTO patent grants for Matsunaga; Tetsuhiro.The latest application filed is for "porous metal foil and production method therefor".

Company Profile

1.11.11

Matsunaga; Tetsuhiro - Ageo N/A JP
Matsunaga; Tetsuhiro - Ageo-Shi JP
Matsunaga; Tetsuhiro - Saitama-Ken JP
Matsunaga; Tetsuhiro - Saitama JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Composite metal foil and production method therefor Grant 9,595,719 - Matsunaga , et al. March 14, 2	2017-03-14
Reinforced porous metal foil and process for production thereof Grant 9,512,527 - Matsunaga , et al. December 6, 2	2016-12-06
Porous metal foil and production method therefor Grant 8,980,438 - Matsunaga , et al. March 17, 2	2015-03-17
Composite Metal Foil And Production Method Therefor App 20130323602 - Matsunaga; Tetsuhiro ; et al.	2013-12-05
Porous Metal Foil And Production Method Therefor App 20130323527 - Matsunaga; Tetsuhiro ; et al.	2013-12-05
Reinforced Porous Metal Foil And Process For Production Thereof App 20130216849 - Matsunaga; Tetsuhiro ; et al.	2013-08-22
Porous metal foil and production method therefor Grant 8,497,026 - Matsunaga , et al. July 30, 2	2013-07-30
Electrodeposited copper foil with carrier foil with a primer resin layer and manufacturing method thereof Grant 8,304,091 - Matsunaga , et al. November 6, 2	2012-11-06
Surface-treated copper foil, manufacturing method of the surface-treated copper foil, and surface-treated copper foil coated with very thin primer resin layer Grant 8,187,723 - Matsunaga May 29, 2	2012-05-29
Porous Metal Foil And Production Method Therefor App 20110318600 - Matsunaga; Tetsuhiro ; et al.	2011-12-29
Surface-treated Copper Foil, Surface-treated Copper Foil With Very Thin Primer Resin Layer, Method For Manufacturing The Surface-treated Copper Foil, And Method For Manufacturing The Surface-treated Copper Foil With Very Thin Primer Resin Layer App 20100068511 - Matsunaga; Tetsuhiro ; et al.	2010-03-18
Copper foil provided with dielectric layer for forming capacitor layer, copper clad laminate for formation of capacitor layer using such copper foil with dielectric layer, and method for manufacturing producing such copper foil with dielectric layer for formation of capacitor layer Grant 7,524,552 - Yokota , et al. April 28, 2	2009-04-28
Surface-treated Copper Foil, Manufacturing Method Of The Surface-treated Copper Foil, And Surface-treated Copper Foil Coated With Very Thin Primer Resin Layer App 20090029186 - Matsunaga; Tetsuhiro	2009-01-29
Electrodeposited Copper Foil with Carrier Foil with a Primer Resin Layer and Manufacturing Method Thereof App 20080107865 - Matsunaga; Tetsuhiro ; et al.	2008-05-08
Copper foil provided with dielectric layer for forming capacitor layer, copper clad laminate for formation of capacitor layer using such such copper foil with dielectric layer, and method for producing such copper foil with dielectric layer for formation of capacitor layer App 20060057420 - Yokota; Toshiko ; et al.	2006-03-16

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