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name:-0.0082089900970459
name:-0.0070071220397949
name:-0.0029838085174561
Matsumura; Misaki Patent Filings

Matsumura; Misaki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Matsumura; Misaki.The latest application filed is for "reactive hot-melt adhesive".

Company Profile
2.7.8
  • Matsumura; Misaki - Hiratsuka JP
  • Matsumura; Misaki - Hiratsuka-shi Kanagawa
  • Matsumura; Misaki - Kanagawa JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Reactive hot-melt adhesive
Grant 11,186,755 - Matsumura November 30, 2
2021-11-30
Hot melt composition
Grant 11,149,172 - Matsumura , et al. October 19, 2
2021-10-19
Reactive Hot-Melt Adhesive
App 20200048514 - Matsumura; Misaki
2020-02-13
Hot Melt Composition
App 20190338169 - Matsumura; Misaki ;   et al.
2019-11-07
Reactive hot-melt adhesive composition
Grant 10,358,586 - Matsumura July 23, 2
2019-07-23
Reactive hot-melt adhesive composition
Grant 10,174,233 - Matsumura J
2019-01-08
Reactive Hot-Melt Adhesive Composition
App 20170174960 - MATSUMURA; Misaki
2017-06-22
Reactive Hot-Melt Adhesive Composition
App 20170158929 - Matsumura; Misaki
2017-06-08
Epoxy resin composition
Grant 9,617,420 - Matsumura , et al. April 11, 2
2017-04-11
Epoxy Resin Composition
App 20140031500 - Matsumura; Misaki ;   et al.
2014-01-30
Mercaptosilane blocked with vinyl ether group (coupling agent) and rubber composition and pneumatic tire using the same
Grant 7,737,203 - Kameda , et al. June 15, 2
2010-06-15
Mercaptosaline Blocked With Vinyl Ether Group (coupling Agent) And Rubber Composition And Pnuematic Tire Using The Same
App 20090137730 - Kameda; Yoshihiro ;   et al.
2009-05-28
Electropeeling Composition, And Making Use Of The Same, Adhesive And Electropeeling Multilayer Adhesive
App 20090035580 - Chino; Keisuke ;   et al.
2009-02-05

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