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Patent applications and USPTO patent grants for Matsumura; Misaki.The latest application filed is for "reactive hot-melt adhesive".
Patent | Date |
---|---|
Reactive hot-melt adhesive Grant 11,186,755 - Matsumura November 30, 2 | 2021-11-30 |
Hot melt composition Grant 11,149,172 - Matsumura , et al. October 19, 2 | 2021-10-19 |
Reactive Hot-Melt Adhesive App 20200048514 - Matsumura; Misaki | 2020-02-13 |
Hot Melt Composition App 20190338169 - Matsumura; Misaki ;   et al. | 2019-11-07 |
Reactive hot-melt adhesive composition Grant 10,358,586 - Matsumura July 23, 2 | 2019-07-23 |
Reactive hot-melt adhesive composition Grant 10,174,233 - Matsumura J | 2019-01-08 |
Reactive Hot-Melt Adhesive Composition App 20170174960 - MATSUMURA; Misaki | 2017-06-22 |
Reactive Hot-Melt Adhesive Composition App 20170158929 - Matsumura; Misaki | 2017-06-08 |
Epoxy resin composition Grant 9,617,420 - Matsumura , et al. April 11, 2 | 2017-04-11 |
Epoxy Resin Composition App 20140031500 - Matsumura; Misaki ;   et al. | 2014-01-30 |
Mercaptosilane blocked with vinyl ether group (coupling agent) and rubber composition and pneumatic tire using the same Grant 7,737,203 - Kameda , et al. June 15, 2 | 2010-06-15 |
Mercaptosaline Blocked With Vinyl Ether Group (coupling Agent) And Rubber Composition And Pnuematic Tire Using The Same App 20090137730 - Kameda; Yoshihiro ;   et al. | 2009-05-28 |
Electropeeling Composition, And Making Use Of The Same, Adhesive And Electropeeling Multilayer Adhesive App 20090035580 - Chino; Keisuke ;   et al. | 2009-02-05 |
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