Matsumoto; Moriji

Patent Applications and Registrations

Patent applications and USPTO patent grants for Matsumoto; Moriji.The latest application filed is for "semiconductor device, method for manufacturing the same, and plating solution".

Company Profile

0.10.19

Matsumoto; Moriji - Kanagawa JP
Matsumoto; Moriji - Fujisawa-shi JP
Matsumoto; Moriji - Fujisawa JP
Matsumoto, Moriji - Kanagawa-ken JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Plating solution, semiconductor device and method for manufacturing the same Grant 7,344,986 - Inoue , et al. March 18, 2	2008-03-18
Semiconductor device, method for manufacturing the same, and plating solution App 20080011228 - Inoue; Hiroaki ; et al.	2008-01-17
Semiconductor device, method for manufacturing the same, and plating solution Grant 7,279,408 - Inoue , et al. October 9, 2	2007-10-09
Substrate processing apparatus and substrate plating apparatus Grant 7,208,074 - Mishima , et al. April 24, 2	2007-04-24
Semiconductor device, method for manufacturing the same, and plating solution Grant 7,060,618 - Inoue , et al. June 13, 2	2006-06-13
Semiconductor device, method for manufacturing the same, and plating solution App 20060040487 - Inoue; Hiroaki ; et al.	2006-02-23
Substrate processing apparatus and substrate plating apparatus App 20060027452 - Mishima; Koji ; et al.	2006-02-09
Method for forming protective film and electroless plating bath App 20050282384 - Nawafune, Hidemi ; et al.	2005-12-22
Electroless Ni-B plating liquid, electronic device and method for manufacturing the same Grant 6,936,302 - Inoue , et al. August 30, 2	2005-08-30
Plating apparatus and method App 20050074559 - Inoue, Hiroaki ; et al.	2005-04-07
Plating apparatus and method Grant 6,858,084 - Inoue , et al. February 22, 2	2005-02-22
Plating solution, semiconductor device and method for manufacturing the same App 20040235298 - Inoue, Hiroaki ; et al.	2004-11-25
Semiconductor device and method for manufacturing the same App 20040235237 - Inoue, Hiroaki ; et al.	2004-11-25
Electroless plating liquid and semiconductor device Grant 6,821,902 - Inoue , et al. November 23, 2	2004-11-23
Catalyst-imparting treatment solution and electroless plating method App 20040186008 - Inoue, Hiroaki ; et al.	2004-09-23
Electroless Ni-B plating liquid, electronic device and method for manufacturing the same App 20040182277 - Inoue, Hiroaki ; et al.	2004-09-23
Electroless plating method and device, and substrate processing method and apparatus App 20040170766 - Inoue, Hiroaki ; et al.	2004-09-02
Electroless plating liquid and semiconductor device App 20040157441 - Inoue, Hiroaki ; et al.	2004-08-12
Substrate processing apparatus and substrate plating apparatus App 20040134789 - Mishima, Koji ; et al.	2004-07-15
Electroless plating liquid and semiconductor device Grant 6,717,189 - Inoue , et al. April 6, 2	2004-04-06
Electroless Ni--B plating liquid, electronic device and method for manufacturing the same Grant 6,706,422 - Inoue , et al. March 16, 2	2004-03-16
Substrate processing apparatus and substrate plating apparatus Grant 6,689,257 - Mishima , et al. February 10, 2	2004-02-10
Semiconductor device, method for manufacturing the same, and plating solution App 20030075808 - Inoue, Hiroaki ; et al.	2003-04-24
Plating apparatus and method App 20030019426 - Inoue, Hiroaki ; et al.	2003-01-30
Electroless plating liquid and semiconductor device App 20020185658 - Inoue, Hiroaki ; et al.	2002-12-12
Electroless Ni-B plating liquid, electronic device and method for manufacturing the same App 20020100391 - Inoue, Hiroaki ; et al.	2002-08-01
Method for forming interconnects and semiconductor device App 20020090814 - Inoue, Hiroaki ; et al.	2002-07-11
Substrate processing apparatus and substrate plating apparatus App 20020000371 - Mishima, Koji ; et al.	2002-01-03
Semiconductor substrate processing apparatus and method App 20010024691 - Kimura, Norio ; et al.	2001-09-27

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