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name:-0.0034971237182617
name:-0.004040002822876
name:-0.0005190372467041
Matsumine; Masao Patent Filings

Matsumine; Masao

Patent Applications and Registrations

Patent applications and USPTO patent grants for Matsumine; Masao.The latest application filed is for "method for producing soi substrate and soi substrate".

Company Profile
0.4.3
  • Matsumine; Masao - Chikuma N/A JP
  • Matsumine; Masao - Nagano JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Method for producing SOI substrate and SOI substrate
Grant 8,709,911 - Matsumine April 29, 2
2014-04-29
Method for producing SOI wafer
Grant 8,268,705 - Yoshida , et al. September 18, 2
2012-09-18
Method for producing SOI wafer
Grant 7,910,455 - Yoshida , et al. March 22, 2
2011-03-22
Method For Producing Soi Substrate And Soi Substrate
App 20100044829 - Matsumine; Masao
2010-02-25
Method for Producing Soi Wafer
App 20090280620 - Yoshida; Kazuhiko ;   et al.
2009-11-12
Method for Producing Soi Wafer
App 20090104752 - Yoshida; Kazuhiko ;   et al.
2009-04-23

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