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name:-0.017858982086182
name:-0.014861106872559
name:-0.0014967918395996
Matsumaru; Shogo Patent Filings

Matsumaru; Shogo

Patent Applications and Registrations

Patent applications and USPTO patent grants for Matsumaru; Shogo.The latest application filed is for "resist composition and method of forming resist pattern".

Company Profile
1.12.13
  • Matsumaru; Shogo - Kawasaki JP
  • MATSUMARU; Shogo - Kawasaki-shi JP
  • Matsumaru; Shogo - Kanagawa-ken JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Resist composition and method of forming resist pattern
Grant 10,324,377 - Hirayama , et al.
2019-06-18
Resist composition and method of forming resist pattern
Grant 10,101,658 - Hirayama , et al. October 16, 2
2018-10-16
Resist Composition And Method Of Forming Resist Pattern
App 20160363860 - HIRAYAMA; Taku ;   et al.
2016-12-15
Resist Composition And Method Of Forming Resist Pattern
App 20160209745 - HIRAYAMA; Taku ;   et al.
2016-07-21
Pattern-forming method, metal oxide film-forming material and method for using the metal oxide film-forming material
Grant 8,349,543 - Matsumaru , et al. January 8, 2
2013-01-08
Compound, dissolution inhibitor, positive type resist composition, and method of forming resist pattern
Grant 8,304,163 - Shiono , et al. November 6, 2
2012-11-06
Film-forming material and method of forming pattern
Grant 8,101,013 - MatsuMaru , et al. January 24, 2
2012-01-24
Resist composition and method of forming resist pattern
Grant 8,034,536 - Iwashita , et al. October 11, 2
2011-10-11
Compound, dissolution inhibitor, positive type resist composition, and method of forming resist pattern
Grant 7,943,284 - Shiono , et al. May 17, 2
2011-05-17
Pattern coating material and pattern forming method
Grant 7,932,013 - Matsumaru , et al. April 26, 2
2011-04-26
Compound, Dissolution Inhibitor, Positive Type Resist Composition, And Method Of Forming Resist Pattern
App 20110091810 - SHIONO; Daiju ;   et al.
2011-04-21
Polymer compound, positive resist composition and resist pattern forming method
Grant 7,851,127 - Ogata , et al. December 14, 2
2010-12-14
Resin for photoresist composition, photoresist composition and method for forming resist pattern
Grant 7,829,259 - Hada , et al. November 9, 2
2010-11-09
Resist Composition For Immersion Exposure And Method For Resist Pattern Formation
App 20100028799 - Tsuji; Hiromitsu ;   et al.
2010-02-04
Pattern-forming Method, Metal Oxide Film-forming Material And Method For Using The Metal Oxide Film-forming Material
App 20100003622 - Matsumaru; Shogo ;   et al.
2010-01-07
Resist composition and method of forming resist pattern
App 20090297980 - Iwashita; Jun ;   et al.
2009-12-03
Resin for photoresist composition, photoresist composition and method for forming resist pattern
Grant 7,592,123 - Hada , et al. September 22, 2
2009-09-22
Polymer Compound, Positive Resist Composition And Resist Pattern Forming Method
App 20090162784 - Ogata; Toshiyuki ;   et al.
2009-06-25
Resin For Photoresist Composition, Photoresist Composition And Method For Forming Resist Pattern
App 20090142700 - Hada; Hideo ;   et al.
2009-06-04
Film-forming Material And Method Of Forming Pattern
App 20090134119 - Matsumaru; Shogo ;   et al.
2009-05-28
Compound, Dissolution Inhibitor, Positive Type Resist Composition, And Method Of Forming Resist Pattern
App 20090081580 - Shiono; Daiju ;   et al.
2009-03-26
Pattern Coating Material And Pattern Forming Method
App 20090029284 - Matsumaru; Shogo ;   et al.
2009-01-29
Polymer compound, acid generator, positive resist composition, and method for formation of resist patterns
Grant 7,482,108 - Matsumaru , et al. January 27, 2
2009-01-27
Polymer Compound, Acid Generator, Positive Resist Composition, and Method for Formation of Resist Patterns
App 20070231708 - Matsumaru; Shogo ;   et al.
2007-10-04
Resin for photoresist composition, photoresist composition and method for forming resist pattern
App 20070065748 - Hada; Hideo ;   et al.
2007-03-22

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