Matsuki; Ryuichi
Patent Applications and Registrations
Patent applications and USPTO patent grants for Matsuki; Ryuichi.The latest application filed is for "heat radiation component and semiconductor package including same".
- Matsuki; Ryuichi - Nagano JP
- Matsuki; Ryuichi - Nagano-shi JP
- Matsuki; Ryuichi - Naka-shi JP
- Matsuki; Ryuichi - Ibaraki-ken JP
| Patent | Date |
|---|---|
| Heat radiation component and semiconductor package including same Grant 8,674,499 - Murayama , et al. March 18, 2 | 2014-03-18 |
| Heat Radiation Component And Semiconductor Package Including Same App 20110291258 - MURAYAMA; Kei ; et al. | 2011-12-01 |
| Method for manufacturing a semiconductor package Grant 7,923,302 - Ueda , et al. April 12, 2 | 2011-04-12 |
| Semiconductor Package And Method For Manufacturing The Same App 20100022054 - UEDA; Keisuke ; et al. | 2010-01-28 |
| Semiconductor package and method for manufacturing the same Grant 7,619,316 - Ueda , et al. November 17, 2 | 2009-11-17 |
| Semiconductor package and method for manufacturing the same App 20080128915 - Ueda; Keisuke ; et al. | 2008-06-05 |
| Flexible materials processing rotation tool App 20070077874 - Ataka; Yoshitada ; et al. | 2007-04-05 |
| Cutting tool for soft material App 20060130627 - Matsuki; Ryuichi ; et al. | 2006-06-22 |
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