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Patent applications and USPTO patent grants for Matsuki; Ryuichi.The latest application filed is for "heat radiation component and semiconductor package including same".
Patent | Date |
---|---|
Heat radiation component and semiconductor package including same Grant 8,674,499 - Murayama , et al. March 18, 2 | 2014-03-18 |
Heat Radiation Component And Semiconductor Package Including Same App 20110291258 - MURAYAMA; Kei ;   et al. | 2011-12-01 |
Method for manufacturing a semiconductor package Grant 7,923,302 - Ueda , et al. April 12, 2 | 2011-04-12 |
Semiconductor Package And Method For Manufacturing The Same App 20100022054 - UEDA; Keisuke ;   et al. | 2010-01-28 |
Semiconductor package and method for manufacturing the same Grant 7,619,316 - Ueda , et al. November 17, 2 | 2009-11-17 |
Semiconductor package and method for manufacturing the same App 20080128915 - Ueda; Keisuke ;   et al. | 2008-06-05 |
Flexible materials processing rotation tool App 20070077874 - Ataka; Yoshitada ;   et al. | 2007-04-05 |
Cutting tool for soft material App 20060130627 - Matsuki; Ryuichi ;   et al. | 2006-06-22 |
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