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Heat Conducting Sheet And Its Method Of Manufacture
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Sintered Body, Powder And Method For Producing The Same
App 20220212999 - MATSUI; Koji ; et al. | 2022-07-07 |
Personal Identification Medium
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Operation plan creation device, operation plan creation method, and operation plan creation program
Grant 10,466,672 - Kawamura , et al. No | 2019-11-05 |
Moving picture coding device, moving picture coding method, and moving picture coding program
Grant 9,510,003 - Matsui November 29, 2 | 2016-11-29 |
Operation Plan Creation Device, Operation Plan Creation Method, And Operation Plan Creation Program
App 20150378338 - KAWAMURA; Naoya ; et al. | 2015-12-31 |
Throttle body configured to provide turbulent air flow to a combustion chamber of an engine, and engine including same
Grant 8,997,713 - Nakajima , et al. April 7, 2 | 2015-04-07 |
Throttle Body Configured To Provide Turbulent Air Flow To A Combustion Chamber Of An Engine, And Engine Including Same
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Moving Picture Coding Device, Moving Picture Coding Method, And Moving Picture Coding Program
App 20110274160 - MATSUI; Koji | 2011-11-10 |
System for and method of searching structured documents using indexes
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Solder, and mounted components using the same
Grant 7,829,199 - Funaya , et al. November 9, 2 | 2010-11-09 |
Semiconductor package board using a metal base
Grant 7,696,007 - Kikuchi , et al. April 13, 2 | 2010-04-13 |
Semiconductor package board using a metal base
Grant 7,585,699 - Kikuchi , et al. September 8, 2 | 2009-09-08 |
Semiconductor Package Board Using A Metal Base
App 20090162974 - KIKUCHI; Katsumi ; et al. | 2009-06-25 |
System For And Method Of Searching Structured Documents Using Indexes
App 20080235252 - SAKAI; Miyuki ; et al. | 2008-09-25 |
Electronic component unit
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Interconnecting substrate for carrying semiconductor device, method of producing thereof and package of semiconductor device
Grant 7,338,884 - Shimoto , et al. March 4, 2 | 2008-03-04 |
Solder, and Mounted Components Using the Same
App 20080026240 - Funaya; Takuo ; et al. | 2008-01-31 |
File system with file management function and file management method
Grant 7,266,669 - Matsui , et al. September 4, 2 | 2007-09-04 |
Semiconductor package board using a metal base
App 20060244137 - Kikuchi; Katsumi ; et al. | 2006-11-02 |
Electronic component unit
App 20060103028 - Hazeyama; Ichiro ; et al. | 2006-05-18 |
File system with file management function and file management method
App 20060069885 - Matsui; Koji ; et al. | 2006-03-30 |
Interconnecting substrate for carrying semiconductor device, method of producing thereof and package of semiconductor device
App 20050130413 - Shimoto, Tadanori ; et al. | 2005-06-16 |
Semiconductor package board using a metal base
App 20050098875 - Kikuchi, Katsumi ; et al. | 2005-05-12 |
Interconnecting substrate for carrying semiconductor device, method of producing thereof and package of semiconductor device
Grant 6,861,757 - Shimoto , et al. March 1, 2 | 2005-03-01 |
Semiconductor package board using a metal base
Grant 6,841,862 - Kikuchi , et al. January 11, 2 | 2005-01-11 |
Electronic device assembly and a method of connecting electronic devices constituting the same
Grant 6,798,070 - Funaya , et al. September 28, 2 | 2004-09-28 |
Electronic component
Grant 6,674,016 - Kubo , et al. January 6, 2 | 2004-01-06 |
Electronic component
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Method for manufacturing flexible printed circuit and flexible printed circuit obtained in the method
App 20030064147 - Fujii, Hirofumi ; et al. | 2003-04-03 |
Interconnecting substrate for carrying semiconductor device, method of producing thereof and package of semiconductor device
App 20030045024 - Shimoto, Tadanori ; et al. | 2003-03-06 |
Thin film resistor and method for forming the same
Grant 6,466,124 - Shibuya , et al. October 15, 2 | 2002-10-15 |
Supporting Substrate To Be Bonded With Semiconductor Bare Chip And Method Of Thermocompression-bonding The Same
App 20020092610 - FUNAYA, TAKUO ; et al. | 2002-07-18 |
Electronic device assembly and a method of connecting electronic devices constituting the same
App 20020042164 - Funaya, Takuo ; et al. | 2002-04-11 |
Thin-film resistor, wiring substrate, and method for manufacturing the same
App 20020030577 - Shibuya, Akinobu ; et al. | 2002-03-14 |
Wiring board for high dense mounting and method of producing the same
App 20020024138 - Shimoto, Tadanori ; et al. | 2002-02-28 |
Thin film capacitor avoiding short circuit between electrodes
App 20020020836 - Kikuchi, Katsumi ; et al. | 2002-02-21 |
Semiconductor package board using a metal base
App 20020001937 - Kikuchi, Katsumi ; et al. | 2002-01-03 |
Thin-film resistor, wiring substrate, and method for manufacturing the same
Grant 6,331,811 - Shibuya , et al. December 18, 2 | 2001-12-18 |
Thin-film Resistor, Wiring Substrate, And Method For Manufacturing The Same
App 20010019301 - SHIBUYA, AKINOBU ; et al. | 2001-09-06 |
Thin film capacitor formed in via
Grant 6,278,153 - Kikuchi , et al. August 21, 2 | 2001-08-21 |
Molded resin composition exhibiting good adhesion to conductive material on a surface
App 20010011111 - Funada, Yoshitsugu ; et al. | 2001-08-02 |
Electronic device assembly and a method of connecting electronic devices constituting the same
App 20010003656 - Funaya, Takuo ; et al. | 2001-06-14 |
Semiconductor carrier and method for manufacturing the same
Grant 6,204,565 - Shimoto , et al. March 20, 2 | 2001-03-20 |
Carrier film and process for producing the same
Grant 6,156,414 - Shimoto , et al. December 5, 2 | 2000-12-05 |
Zirconia sintered body, process for production thereof, and application thereof
Grant 6,087,285 - Oomichi , et al. July 11, 2 | 2000-07-11 |
Method of thermocompression bonding a supporting substrate to a semiconductor bare chip
Grant 6,042,682 - Funaya , et al. March 28, 2 | 2000-03-28 |
Zirconia fine powder and method for its production
Grant 6,030,914 - Matsui February 29, 2 | 2000-02-29 |
Method of manufacturing a tab semiconductor device
Grant 5,972,739 - Funada , et al. October 26, 1 | 1999-10-26 |
Multilayer wiring structure
Grant 5,889,233 - Shimoto , et al. March 30, 1 | 1999-03-30 |
Interconnection structures and method of making same
Grant 5,830,563 - Shimoto , et al. November 3, 1 | 1998-11-03 |
Method of bonding circuit boards
Grant 5,545,281 - Matsui , et al. August 13, 1 | 1996-08-13 |
Multilayer printed circuit board
Grant 5,483,101 - Shimoto , et al. January 9, 1 | 1996-01-09 |
Method of connecting an integrated circuit chip to a substrate
Grant 5,384,952 - Matsui January 31, 1 | 1995-01-31 |
Multilayer printed circuit board
Grant 5,372,872 - Funada , et al. December 13, 1 | 1994-12-13 |
Method of bonding circuit boards
Grant 5,318,651 - Matsui , et al. June 7, 1 | 1994-06-07 |
Anisotropic conductive material and method for connecting integrated circuit element by using the anisotropic conductive material
Grant 5,302,456 - Matsui April 12, 1 | 1994-04-12 |
Liquid crystal device with benzocyclobutene alignment layer and protective coating for electrodes
Grant 5,287,208 - Shimoto , et al. February 15, 1 | 1994-02-15 |
Burner with a cylindrical body
Grant 4,993,939 - Fukuda , et al. February 19, 1 | 1991-02-19 |
Burner
Grant 4,971,552 - Fukuda , et al. November 20, 1 | 1990-11-20 |
Method for production of a fluid separation module
Grant 4,475,973 - Tanaka , et al. October 9, 1 | 1984-10-09 |
Electric circuit for energizing and deenergizing an exciter lamp of a talkie projector
Grant 3,903,454 - Matsui , et al. September 2, 1 | 1975-09-02 |
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