Matsuda; Yuichi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Matsuda; Yuichi.The latest application filed is for "efficient control of containers in a parallel distributed system".

Company Profile

3.39.42

Matsuda; Yuichi - Sodegaura JP
MATSUDA; YUICHI - Yokohama JP
MATSUDA; Yuichi - Sodegaura-shi CHIBA
Matsuda; Yuichi - Toyama N/A JP
Matsuda; Yuichi - Nagano JP
Matsuda; Yuichi - Kawasaki JP
Matsuda; Yuichi - Nagano-shi JP
Matsuda; Yuichi - Chiba JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Fiber-reinforced polypropylene-based resin composition and molded product thereof Grant 10,858,507 - Matsuda December 8, 2	2020-12-08
Efficient Control Of Containers In A Parallel Distributed System App 20190286468 - MATSUDA; YUICHI ; et al.	2019-09-19
Fiber-reinforced Polypropylene-based Resin Composition And Molded Product Thereof App 20190144651 - MATSUDA; Yuichi	2019-05-16
Storage medium, information processing device, and information processing method Grant 9,921,874 - Matsuda , et al. March 20, 2	2018-03-20
Substrate processing apparatus Grant 9,698,037 - Nakashima , et al. July 4, 2	2017-07-04
Data processing control method, computer-readable recording medium, and data processing control device for performing a Mapreduce process Grant 9,535,743 - Kuromatsu , et al. January 3, 2	2017-01-03
Propylene Resin Composition App 20160376430 - KUSUMOTO; Tatsuya ; et al.	2016-12-29
Probe card having a wiring substrate Grant 9,488,677 - Fukasawa , et al. November 8, 2	2016-11-08
Probe card Grant 9,476,913 - Fukasawa , et al. October 25, 2	2016-10-25
Probe card Grant 9,470,718 - Fukasawa , et al. October 18, 2	2016-10-18
Probe card and method for manufacturing probe card Grant 9,459,289 - Horiuchi , et al. October 4, 2	2016-10-04
Joining structure using thermal interface material Grant 9,460,983 - Horiuchi , et al. October 4, 2	2016-10-04
Stacked electronic device Grant 9,373,587 - Horiuchi , et al. June 21, 2	2016-06-21
Delay time measuring apparatus, computer readable record medium on which delay time measuring program is recorded, and delay time measuring method Grant 9,344,347 - Matsuda , et al. May 17, 2	2016-05-17
Data Processing Control Method, Computer-readable Recording Medium, And Data Processing Control Device App 20160019090 - KUROMATSU; Nobuyuki ; et al.	2016-01-21
Computer-readable Recording Medium, Task Assignment Method, And Task Assignment Apparatus App 20150365474 - MATSUDA; Yuichi	2015-12-17
Wiring substrate, method for manufacturing wiring substrate, and semiconductor package Grant 9,202,781 - Karasawa , et al. December 1, 2	2015-12-01
Wiring substrate and method of manufacturing the same Grant 9,204,544 - Horiuchi , et al. December 1, 2	2015-12-01
Computer-readable Recording Medium, Task Assignment Device, Task Execution Device, And Task Assignment Method App 20150254102 - UEDA; Haruyasu ; et al.	2015-09-10
Probe Card And Method For Manufacturing Probe Card App 20150137849 - Horiuchi; Michio ; et al.	2015-05-21
Data Processing Method And Information Processing Apparatus App 20150128150 - Ueda; Haruyasu ; et al.	2015-05-07
Wiring substrate, its manufacturing method, and semiconductor device Grant 9,006,586 - Horiuchi , et al. April 14, 2	2015-04-14
Probe Card And Method Of Manufacturing The Same App 20150022229 - FUKASAWA; Ryo ; et al.	2015-01-22
Probe Card And Method Of Manufacturing The Same App 20150022230 - FUKASAWA; Ryo ; et al.	2015-01-22
Assigning Method, Apparatus, And System App 20140372611 - Matsuda; Yuichi ; et al.	2014-12-18
Electronic Component Device And Method Of Manufacturing The Same App 20140347833 - HORIUCHI; Michio ; et al.	2014-11-27
Wiring Substrate And Method Of Manufacturing The Same App 20140262465 - HORIUCHI; Michio ; et al.	2014-09-18
Information managing computer product, apparatus, and method Grant 8,832,496 - Matsuda , et al. September 9, 2	2014-09-09
Probe Card And Method Of Manufacturing The Same App 20140125372 - FUKASAWA; Ryo ; et al.	2014-05-08
Wiring Substrate, Method For Manufacturing Wiring Substrate, And Semiconductor Package App 20140117539 - KARASAWA; Yuko ; et al.	2014-05-01
Semiconductor device including a core substrate and a semiconductor element Grant 8,664,764 - Horiuchi , et al. March 4, 2	2014-03-04
Capacitor containing a large number of filamentous conductors and method of manufacturing the same Grant 8,638,542 - Horiuchi , et al. January 28, 2	2014-01-28
Storage Medium, Information Processing Device, And Information Processing Method App 20130326535 - MATSUDA; Yuichi ; et al.	2013-12-05
Thermal Interface Material, Method For Manufacturing Thermal Interface Material, And Joining Structure Using Thermal Interface Material App 20130081796 - Horiuchi; Michio ; et al.	2013-04-04
Base Member App 20130048350 - Horiuchi; Michio ; et al.	2013-02-28
Wiring board Grant 8,362,369 - Horiuchi , et al. January 29, 2	2013-01-29
Wiring Substrate, Its Manufacturing Method, And Semiconductor Device App 20120327626 - Horiuchi; Michio ; et al.	2012-12-27
Semiconductor Device App 20120313245 - HORIUCHI; Michio ; et al.	2012-12-13
Wiring substrate and semiconductor apparatus including the wiring substrate Grant 8,324,513 - Horiuchi , et al. December 4, 2	2012-12-04
Wiring board having piercing linear conductors and semiconductor device using the same Grant 8,242,612 - Horiuchi , et al. August 14, 2	2012-08-14
Event Dependency Management Apparatus And Event Dependency Management Method App 20120159519 - Matsuda; Yuichi	2012-06-21
Semiconductor device and method of manufacturing semiconductor device Grant 8,138,609 - Horiuchi , et al. March 20, 2	2012-03-20
Substrate Processing Apparatus App 20110305543 - NAKASHIMA; Seiyo ; et al.	2011-12-15
Information Managing Computer Product, Apparatus, And Method App 20110184991 - MATSUDA; Yuichi ; et al.	2011-07-28
Wiring Substrate And Semiconductor Apparatus Including The Wiring Substrate App 20110175235 - Horiuchi; Michio ; et al.	2011-07-21
Conductive Film, Method Of Manufacturing The Same, Semiconductor Device And Method Of Manufacturing The Same App 20110095433 - HORIUCHI; Michio ; et al.	2011-04-28
Conductive Film, Method Of Manufacturing The Same, Semiconductor Device And Method Of Manufacturing The Same App 20110095419 - Horiuchi; Michio ; et al.	2011-04-28
Wiring Board And Semiconductor Device App 20110018144 - Horiuchi; Michio ; et al.	2011-01-27
Semiconductor Device And Method Of Manufacturing Semiconductor Device App 20110012266 - HORIUCHI; Michio ; et al.	2011-01-20
Capacitor And Method Of Manufacturing The Same App 20110013340 - HORIUCHI; Michio ; et al.	2011-01-20
Wiring Board App 20100307808 - HORIUCHI; Michio ; et al.	2010-12-09
Aliphatic polyester resin composition containing copolymer Grant 7,847,021 - Shinoda , et al. December 7, 2	2010-12-07
Multilayered substrate for semiconductor device and method of manufacturing same Grant 7,763,809 - Rokugawa , et al. July 27, 2	2010-07-27
Computer-readable recording medium recording communication programs, communication method and communication apparatus Grant 7,725,548 - Ohtani , et al. May 25, 2	2010-05-25
Delay Time Measuring Apparatus, Computer Readable Record Medium On Which Delay Time Measuring Program Is Recorded, And Delay Time Measuring Method App 20090310500 - Matsuda; Yuichi ; et al.	2009-12-17
Molded object obtained by in-mold coating and process for producing the same Grant 7,482,063 - Minoda , et al. January 27, 2	2009-01-27
Access control method, access control apparatus, and computer product App 20070174282 - Matsuda; Yuichi ; et al.	2007-07-26
Aliphatic polyester resin composition containing copolymer App 20070160861 - Shinoda; Hosei ; et al.	2007-07-12
Computer-readable recording medium recording communication programs, communication method and communication apparatus App 20070136422 - Ohtani; Takeshi ; et al.	2007-06-14
Molded object obtained by in-mold coating and process for producing the same App 20050214559 - Minoda, Takeshi ; et al.	2005-09-29
Insulated multilayered substrate having connecting leads for mounting a semiconductor element thereon Grant 6,931,724 - Rokugawa , et al. August 23, 2	2005-08-23
Multilayered substrate for semiconductor device and method of manufacturing same App 20050017271 - Rokugawa, Akio ; et al.	2005-01-27
Interconnection substrate having metal columns covered by a resin film, and manufacturing method thereof Grant 6,828,669 - Iijima , et al. December 7, 2	2004-12-07
Flame-retarding thermoplastic resin composition Grant 6,756,430 - Matsuda , et al. June 29, 2	2004-06-29
Multilayered substrate for semiconductor device App 20020195272 - Rokugawa, Akio ; et al.	2002-12-26
Multilayered substrate for semiconductor device Grant 6,441,314 - Rokugawa , et al. August 27, 2	2002-08-27
Method of making multilayered substrate for semiconductor device Grant 6,418,615 - Rokugawa , et al. July 16, 2	2002-07-16
Flame-retarding thermoplastic resin composition App 20020013392 - Matsuda, Yuichi ; et al.	2002-01-31
Multilayered Substrate for Semiconductor Device App 20010013425 - Rokugawa, Akio ; et al.	2001-08-16
Interconnection substrate having metal columns covered by a resin film, and manufacturing method thereof App 20010008309 - Iijima, Takahiro ; et al.	2001-07-19
System for achieving alarm masking processing Grant 5,636,206 - Amemiya , et al. June 3, 1	1997-06-03

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.