Matsuda; Tetsuo
Patent Applications and Registrations
Patent applications and USPTO patent grants for Matsuda; Tetsuo.The latest application filed is for "semiconductor device and method of manufacturing the same".
Company Profile
1.52.41
- Matsuda; Tetsuo - Ishikawa JP
- MATSUDA; Tetsuo - Hakusan JP
- Matsuda; Tetsuo - Kanagawa JP
- Matsuda; Tetsuo - Ibo-gun JP
- Matsuda; Tetsuo - Kanagawa-ken N/A JP
- MATSUDA; Tetsuo - Ishikawa-ken JP
- Matsuda; Tetsuo - Hyogo JP
- Matsuda; Tetsuo - Tano-gun JP
- Matsuda; Tetsuo - Minato-ku JP
- MATSUDA; Tetsuo - Gunma-ken JP
- Matsuda; Tetsuo - Yokohama JP
- Matsuda; Tetsuo - Yokohama-shi JP
- Matsuda, Tetsuo - Gumma-ken JP
- Matsuda, Tetsuo - Gunma JP
- Matsuda; Tetsuo - Poughkeepsie NY
- Matsuda; Tetsuo - Kawasaki JP
- Matsuda; Tetsuo - Tokyo JP
- Matsuda; Tetsuo - Kunitachi JP
- Matsuda; Tetsuo - Shizuoka JP
Patent Activity
| Patent | Date |
|---|---|
| Method of manufacturing a semiconductor device Grant 11,011,609 - Kobayashi , et al. May 18, 2 | 2021-05-18 |
| Semiconductor Device And Method Of Manufacturing The Same App 20180226473 - KOBAYASHI; Kenya ; et al. | 2018-08-09 |
| Semiconductor device and method of manufacturing the same Grant 9,947,751 - Kobayashi , et al. April 17, 2 | 2018-04-17 |
| Semiconductor Device And Method Of Manufacturing The Same App 20180083110 - KOBAYASHI; Kenya ; et al. | 2018-03-22 |
| Semiconductor device and method for manufacturing of same Grant 8,810,032 - Imamura , et al. August 19, 2 | 2014-08-19 |
| Semiconductor Device And Method For Manufacturing Of Same App 20130187281 - IMAMURA; Tomomi ; et al. | 2013-07-25 |
| Semiconductor device including first and second semiconductor regions with increasing impurity concentrations from a substrate surface Grant 8,431,992 - Tokano , et al. April 30, 2 | 2013-04-30 |
| Semiconductor device and method for manufacturing of same Grant 8,415,247 - Imamura , et al. April 9, 2 | 2013-04-09 |
| Semiconductor Device And Method For Manufacturing Same App 20130009241 - MATSUDA; Tetsuo | 2013-01-10 |
| Semiconductor Device, Method For Manufacturing Metal Film, And Method For Manufacturing Semiconductor Device App 20120313162 - Matsuda; Tetsuo ; et al. | 2012-12-13 |
| Method For Manufacturing Semiconductor Device And Semiconductor Device App 20120217575 - Matsuda; Tetsuo | 2012-08-30 |
| Semiconductor Device, Semiconductor Group Member And Semiconductor Device Manufacturing Method App 20120112308 - Matsuda; Tetsuo ; et al. | 2012-05-10 |
| Semiconductor device and method for manufacturing of same Grant 8,067,310 - Imamura , et al. November 29, 2 | 2011-11-29 |
| Semiconductor Device App 20110133278 - TOKANO; Kenichi ; et al. | 2011-06-09 |
| Semiconductor device having trenches filled with a semiconductor having an impurity concentration gradient Grant 7,936,015 - Tokano , et al. May 3, 2 | 2011-05-03 |
| Semiconductor device with tapered trenches and impurity concentration gradients Grant 7,898,031 - Tokano , et al. March 1, 2 | 2011-03-01 |
| Semiconductor Device App 20100258854 - TOKANO; Kenichi ; et al. | 2010-10-14 |
| Semiconductor Device And Method For Manufacturing Of Same App 20100164095 - IMAMURA; Tomomi ; et al. | 2010-07-01 |
| Semiconductor Device App 20090302373 - TOKANO; Kenichi ; et al. | 2009-12-10 |
| Power semiconductor device with epitaxially-filled trenches Grant 7,595,530 - Tokano , et al. September 29, 2 | 2009-09-29 |
| Plating method Grant 7,575,664 - Matsuda , et al. August 18, 2 | 2009-08-18 |
| Remote access server wherein the number of logical link resources is set higher than the number of physical link resources Grant 7,486,663 - Matsuda , et al. February 3, 2 | 2009-02-03 |
| Plating Apparatus App 20080296165 - KUNISAWA; Junji ; et al. | 2008-12-04 |
| Plating Apparatus App 20080251385 - Kunisawa; Junji ; et al. | 2008-10-16 |
| Semiconductor device and method of manufacturing the same Grant 7,420,245 - Yamashita , et al. September 2, 2 | 2008-09-02 |
| Method of performing electrolytic treatment on a conductive layer of a substrate Grant 7,387,717 - Kunisawa , et al. June 17, 2 | 2008-06-17 |
| Method of manufacturing electronic device Grant 7,214,305 - Matsuda , et al. May 8, 2 | 2007-05-08 |
| Semiconductor device App 20060197152 - Tokano; Kenichi ; et al. | 2006-09-07 |
| Semiconductor device and fabrication method of the same App 20060043480 - Tsuchitani; Masanobu ; et al. | 2006-03-02 |
| Semiconductor device and method of manufacturing the same App 20060043481 - Yamashita; Atsuko ; et al. | 2006-03-02 |
| Electronic device manufacturing method Grant 6,998,342 - Matsuda , et al. February 14, 2 | 2006-02-14 |
| Semiconductor device and method for manufacturing the same App 20060006458 - Motai; Takako ; et al. | 2006-01-12 |
| Plating method App 20050211560 - Matsuda, Tetsuo ; et al. | 2005-09-29 |
| Apparatus and method for processing substrate App 20050145482 - Suzuki, Hidenao ; et al. | 2005-07-07 |
| Plating method and plating apparatus Grant 6,913,681 - Matsuda , et al. July 5, 2 | 2005-07-05 |
| Method of manufacturing semiconductor device including two-step polishing operation for cap metal Grant 6,897,143 - Toyoda , et al. May 24, 2 | 2005-05-24 |
| Semiconductor device and method for manufacturing the same App 20040259297 - Inumiya, Seiji ; et al. | 2004-12-23 |
| Method of manufacturing electronic device App 20040226827 - Matsuda, Tetsuo ; et al. | 2004-11-18 |
| Electronic device manufacturing method App 20040203221 - Matsuda, Tetsuo ; et al. | 2004-10-14 |
| Plating method and plating apparatus App 20040195106 - Mishima, Koji ; et al. | 2004-10-07 |
| Remote access server wherein the number of logical link resources is set higher than the number of physical link resources App 20040174866 - Matsuda, Tetsuo ; et al. | 2004-09-09 |
| Semiconductor device and method for manufacturing the same Grant 6,787,827 - Inumiya , et al. September 7, 2 | 2004-09-07 |
| Electroplating apparatus and electroplating method Grant 6,767,437 - Matsuda , et al. July 27, 2 | 2004-07-27 |
| Electronic device manufacturing method Grant 6,764,585 - Matsuda , et al. July 20, 2 | 2004-07-20 |
| Method for forming a plating film, and device for forming the same Grant 6,750,143 - Iijima , et al. June 15, 2 | 2004-06-15 |
| Plating method and plating apparatus Grant 6,746,589 - Mishima , et al. June 8, 2 | 2004-06-08 |
| Plating apparatus App 20040069646 - Kunisawa, Junji ; et al. | 2004-04-15 |
| Method and apparatus for plating substrate with copper App 20040050711 - Mishima, Koji ; et al. | 2004-03-18 |
| Method of manufacturing semiconductor device and semiconductor device App 20040005774 - Toyoda, Hiroshi ; et al. | 2004-01-08 |
| Semiconductor device and method of manufacturing the same App 20030214010 - Toyoda, Hiroshi ; et al. | 2003-11-20 |
| Method and apparatus for plating substrate with copper Grant 6,638,411 - Mishima , et al. October 28, 2 | 2003-10-28 |
| Plating apparatus Grant 6,632,335 - Kunisawa , et al. October 14, 2 | 2003-10-14 |
| Substrate processing method and substrate processing apparatus Grant 6,632,476 - Nakamura , et al. October 14, 2 | 2003-10-14 |
| Semiconductor device having a damascene type wiring layer Grant 6,611,060 - Toyoda , et al. August 26, 2 | 2003-08-26 |
| Eddy current loss measuring sensor, thickness measuring system, thickness measuring method, and recorded medium Grant 6,563,308 - Nagano , et al. May 13, 2 | 2003-05-13 |
| Eddy Current Loss Measuring Sensor, Thickness Measuring System, Thickness Measuring Method, And Recorded Medium App 20030067298 - Nagano, Osamu ; et al. | 2003-04-10 |
| Electroless plating solution and method of forming wiring with the same App 20030024431 - Inoue, Hiroaki ; et al. | 2003-02-06 |
| Semiconductor device and method for manufacturing the same App 20020117698 - Inumiya, Seiji ; et al. | 2002-08-29 |
| Plating method and plating apparatus App 20020096435 - Matsuda, Tetsuo ; et al. | 2002-07-25 |
| Film formation method Grant 6,403,481 - Matsuda , et al. June 11, 2 | 2002-06-11 |
| Plating method and plating apparatus App 20020056647 - Mishima, Koji ; et al. | 2002-05-16 |
| Electronic device manufacturing method App 20020050459 - Matsuda, Tetsuo ; et al. | 2002-05-02 |
| Plating apparatus and plating method for substrate App 20020033339 - Kimura, Norio ; et al. | 2002-03-21 |
| Plating apparatus and plating method for substrate App 20020020627 - Kunisawa, Junji ; et al. | 2002-02-21 |
| Method of manufacturing a copper interconnect Grant 6,348,402 - Kawanoue , et al. February 19, 2 | 2002-02-19 |
| Method of forming diffusion barrier for copper interconnects Grant 6,342,444 - Higashi , et al. January 29, 2 | 2002-01-29 |
| Electroplating apparatus and electroplating method App 20020000379 - Matsuda, Tetsuo ; et al. | 2002-01-03 |
| Method for manufacturing a semiconductor device Grant 6,333,215 - Matsuda , et al. December 25, 2 | 2001-12-25 |
| Semiconductor device manufacturing method and semiconductor device App 20010038147 - Higashi, Kazuyuki ; et al. | 2001-11-08 |
| Substrate processing method and substrate processing apparatus App 20010033894 - Nakamura, Hiroko ; et al. | 2001-10-25 |
| Semiconductor substrate processing apparatus and method App 20010024691 - Kimura, Norio ; et al. | 2001-09-27 |
| Semiconductor device manufacturing method and semiconductor device Grant 6,291,891 - Higashi , et al. September 18, 2 | 2001-09-18 |
| Semiconductor device and method of manufacturing the same App 20010013617 - Toyoda, Hiroshi ; et al. | 2001-08-16 |
| Semiconductor device and method for manufacturing same Grant 6,251,763 - Inumiya , et al. June 26, 2 | 2001-06-26 |
| Semiconductor device and method of manufacturing the same Grant 6,229,211 - Kawanoue , et al. May 8, 2 | 2001-05-08 |
| Method for forming barrier layer for copper metallization Grant 6,150,270 - Matsuda , et al. November 21, 2 | 2000-11-21 |
| Fabrication process using a multi-layer antireflective layer Grant 5,998,100 - Azuma , et al. December 7, 1 | 1999-12-07 |
| Fabrication process using a thin resist Grant 5,759,746 - Azuma , et al. June 2, 1 | 1998-06-02 |
| Method of planarizing a semiconductor workpiece surface Grant 5,679,610 - Matsuda , et al. October 21, 1 | 1997-10-21 |
| Thin film forming method and apparatus Grant 5,658,389 - Matsuda , et al. August 19, 1 | 1997-08-19 |
| PECVD method of depositing fluorine doped oxide using a fluorine precursor containing a glass-forming element Grant 5,563,105 - Dobuzinsky , et al. October 8, 1 | 1996-10-08 |
| Method of manufacturing semiconductor devices Grant 5,413,967 - Matsuda , et al. May 9, 1 | 1995-05-09 |
| Method of manufacturing semiconductor devices Grant 5,132,756 - Matsuda July 21, 1 | 1992-07-21 |
| Method of forming thin film by chemical vapor deposition Grant 4,923,715 - Matsuda , et al. May 8, 1 | 1990-05-08 |
| Multilayer wiring technique for a semiconductor device Grant 4,866,009 - Matsuda September 12, 1 | 1989-09-12 |
| Derivatives of antibiotic tylosin Grant 4,268,665 - Sakakibara , et al. May 19, 1 | 1981-05-19 |
| 3"-Acylated macrolide antibiotics Grant 4,242,504 - Sakakibara , et al. December 30, 1 | 1980-12-30 |
| Novel cellulose microcapsules and preparation thereof Grant 4,118,336 - Morishita , et al. October 3, 1 | 1978-10-03 |
| Antibiotic aculeacins Grant 3,978,210 - Mizuno , et al. August 31, 1 | 1976-08-31 |
| Process for encapsulation of medicaments Grant 3,960,757 - Morishita , et al. June 1, 1 | 1976-06-01 |
| 4-Carbamoyl-1-.beta.-D-ribofuranosylimidazolium-5-olate Grant 3,888,843 - Mizuno , et al. June 10, 1 | 1975-06-10 |
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