Matsuda; Motoaki
Patent Applications and Registrations
Patent applications and USPTO patent grants for Matsuda; Motoaki.The latest application filed is for "method for depositing lead-free tin alloy".
- Matsuda; Motoaki - Kumamoto JP
- Matsuda, Motoaki - Kumamoto-shi JP
| Patent | Date |
|---|---|
| Flip-chip BGA semiconductor device for achieving a superior cleaning effect Grant 6,956,290 - Matsuda October 18, 2 | 2005-10-18 |
| Method for depositing lead-free tin alloy App 20040132299 - Matsuda, Motoaki ; et al. | 2004-07-08 |
| Flip-chip BGA semiconductor device for achieving a superior cleaning effect App 20040051182 - Matsuda, Motoaki | 2004-03-18 |
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