Matsuda; Mitsuyoshi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Matsuda; Mitsuyoshi.The latest application filed is for "page-turning reader device and feeder device".

Company Profile

0.16.11

Matsuda; Mitsuyoshi - Ageo JP
Matsuda; Mitsuyoshi - Saitama JP
Matsuda; Mitsuyoshi - Yamato N/A JP
Matsuda; Mitsuyoshi - Yamato-shi JP
MATSUDA; Mitsuyoshi - Ageo-shi JP
Matsuda; Mitsuyoshi - Nagoya N/A JP
MATSUDA; Mitsuyoshi - Nagoya-shi JP
Matsuda; Mitsuyoshi - Yamagata JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Electro-deposited copper-alloy foil and electro-deposited copper-alloy foil provided with carrier foil Grant 9,663,868 - Matsuda , et al. May 30, 2	2017-05-30
Method of producing a printed wiring board Grant 9,338,898 - Fujii , et al. May 10, 2	2016-05-10
Electro-deposited copper foil, surface-treated copper foil using the electro-deposited copper foil and copper clad laminate using the surface-treated copper foil, and a method for manufacturing the electro-deposited copper foil Grant 9,307,639 - Sakai , et al. April 5, 2	2016-04-05
Page-turning reader device and feeder device Grant 9,077,827 - Matsuda , et al. July 7, 2	2015-07-07
Page-turning Reader Device And Feeder Device App 20140268257 - Matsuda; Mitsuyoshi ; et al.	2014-09-18
Electrodeposited copper foil, its manufacturing method, surface-treated electrodeposited copper foil using the electrodeposited copper foil, and copper-clad laminate and printed wiring board using the surface-treated electrodeposited copper foil Grant 8,722,199 - Matsuda , et al. May 13, 2	2014-05-13
Surface-treated electro-deposited copper foil and method for manufacturing the same Grant 8,715,836 - Dobashi , et al. May 6, 2	2014-05-06
Method Of Producing Printed Wiring Board And Copper Foil For Laser Processing App 20130247373 - FUJII; Joji ; et al.	2013-09-26
Electro-deposited Copper-alloy Foil And Electro-deposited Copper-alloy Foil Provided With Carrier Foil App 20130171457 - MATSUDA; Mitsuyoshi ; et al.	2013-07-04
Image-forming device Grant 8,457,506 - Abe , et al. June 4, 2	2013-06-04
Method of preparing electrolytic copper solution acidified with sulfuric acid, sulfuric-acid-acidified electrolytic copper solution prepared by the preparation method, and electrodeposited copper film Grant 8,419,920 - Tomonaga , et al. April 16, 2	2013-04-16
Image-forming Device App 20110182593 - ABE; Koji ; et al.	2011-07-28
Method Of Preparing Electrolytic Copper Solution Acidified With Sulfuric Acid, Sulfuric-acid-acidified Electrolytic Copper Solution Prepared By The Preparation Method, And Electrodeposited Copper Film App 20100089758 - Tomonaga; Sakiko ; et al.	2010-04-15
Electrodeposited copper foil, its manufacturing method, surface-treated electrodeposited copper foil using the electrodeposited copper foil, and copper-clad laminate and printed wiring board using the surface-treated electrodeposited copper foil App 20100038115 - Matsuda; Mitsuyoshi ; et al.	2010-02-18
Production Method Of Electro-deposited Copper Foil, Electro-deposited Copper Foil Obtained By The Production Method, Surface-treated Copper Foil Obtained By Using The Electro-deposited Copper Foil And Copper-clad Laminate Obtained By Using The Electro-deposited Copper Foil Or The Surface-treated Cop App 20090166213 - Dobashi; Makoto ; et al.	2009-07-02
Electro-deposited Copper Foil, Surface-treated Copper Foil Using The Electro-deposited Copper Foil And Copper Clad Laminate Using The Surface-treated Copper Foil, And A Method For Manufacturing The Electro-deposited Copper Foil App 20090095515 - Sakai; Hisao ; et al.	2009-04-16
Surface-treated Electro-deposited Copper Foil And Method For Manufacturing The Same App 20090047539 - Dobashi; Makoto ; et al.	2009-02-19
Surface-treated copper foil low-dielectric substrate and copper-clad laminate and printed wiring board using the same Grant 6,969,557 - Matsuda , et al. November 29, 2	2005-11-29
Surface treatment copper foil for low dielectric substrate, copper clad laminate including the same and printed wiring board App 20040191560 - Matsuda, Mitsuyoshi ; et al.	2004-09-30
Coaxial speaker unit Grant 4,821,331 - Murayama , et al. April 11, 1	1989-04-11

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