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name:-0.0080130100250244
name:-0.00045013427734375
Matsuda; Masami Patent Filings

Matsuda; Masami

Patent Applications and Registrations

Patent applications and USPTO patent grants for Matsuda; Masami.The latest application filed is for "method for producing wiring board and wiring board".

Company Profile
0.7.2
  • Matsuda; Masami - Saitama JP
  • Matsuda; Masami - Chiyoda-ku Tokyo 100-8220 JP
  • Matsuda, Masami - Hitachi JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Method for producing wiring board and wiring board
Grant 8,512,856 - Takeuchi , et al. August 20, 2
2013-08-20
Method For Producing Wiring Board And Wiring Board
App 20110290543 - Takeuchi; Koji ;   et al.
2011-12-01
Method of and apparatus for treating radioactive liquid wastes containing surface active agents
Grant 6,800,196 - Matsuo , et al. October 5, 2
2004-10-05
Method Of And Apparatus For Treating Radioactive Liquid Wastes Containing Surface Active Agents
App 20040129615 - Matsuo, Toshiaki ;   et al.
2004-07-08
Solid material melting apparatus
Grant 6,502,520 - Nishi , et al. January 7, 2
2003-01-07
Disposal method of radioactive wastes
Grant 5,202,062 - Baba , et al. April 13, 1
1993-04-13
Method and apparatus for analyzing the electrode inpedance
Grant 4,831,324 - Asakura , et al. May 16, 1
1989-05-16
Method for processing radioactive waste resin
Grant 4,654,172 - Matsuda , et al. March 31, 1
1987-03-31

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