Matsubayashi; Ryo

Patent Applications and Registrations

Patent applications and USPTO patent grants for Matsubayashi; Ryo.The latest application filed is for "method of manufacturing bonded body".

Company Profile

0.7.7

Matsubayashi; Ryo - Saitama JP
Matsubayashi; Ryo - Hanno JP
Matsubayashi; Ryo - Hanno-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method of manufacturing bonded body Grant 10,083,844 - Matsubayashi , et al. September 25, 2	2018-09-25
Bonding device, bonding method and pressure applying unit Grant 10,037,903 - Matsubayashi July 31, 2	2018-07-31
Pressure applying unit Grant 9,956,643 - Matsubayashi May 1, 2	2018-05-01
Composite nanometal paste containing copper filler and joining method Grant 9,796,052 - Komatsu , et al. October 24, 2	2017-10-24
Method Of Manufacturing Bonded Body App 20170103903 - MATSUBAYASHI; Ryo ; et al.	2017-04-13
Bonding Device, Bonding Method And Pressure Applying Unit App 20170076963 - MATSUBAYASHI; Ryo	2017-03-16
Pressure Applying Unit App 20170066075 - MATSUBAYASHI; Ryo	2017-03-09
Transferring Member And Pressure Applying Unit App 20170069592 - MATSUBAYASHI; Ryo	2017-03-09
Composite Nanometal Paste Containing Copper Filler And Joining Method App 20150053753 - Komatsu; Teruo ; et al.	2015-02-26
Composite nanometal paste of two-metallic-component type, bonding method, and electronic part Grant 8,491,998 - Komatsu , et al. July 23, 2	2013-07-23
Composite Nanometal Paste of Two-Metallic-Component Type, Bonding Method, and Electronic Part App 20120114972 - Komatsu; Teruo ; et al.	2012-05-10

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