| Patent | Date |
|---|
Substrate Processing Method And Substrate Processing Device
App 20220068642 - KAGAWA; Koji ; et al. | 2022-03-03 |
Method And Apparatus For Reducing Impurity In A Film
App 20210272809 - MATSUBARA; Yoshihisa | 2021-09-02 |
Semiconductor device and manufacturing method thereof
Grant 10,418,323 - Matsubara , et al. Sept | 2019-09-17 |
Semiconductor device and manufacturing method thereof
Grant 10,411,025 - Matsubara Sept | 2019-09-10 |
Semiconductor device
Grant 10,115,656 - Matsubara October 30, 2 | 2018-10-30 |
Semiconductor Device And Manufacturing Method Thereof
App 20180301462 - MATSUBARA; Yoshihisa | 2018-10-18 |
Semiconductor device and method of manufacturing semiconductor device
Grant 10,008,435 - Matsubara June 26, 2 | 2018-06-26 |
Semiconductor Device And Manufacturing Method Of The Same
App 20180090451 - MATSUBARA; Yoshihisa ; et al. | 2018-03-29 |
Semiconductor Device
App 20180061735 - MATSUBARA; Yoshihisa | 2018-03-01 |
Semiconductor Device And Method Of Manufacturing Semiconductor Device
App 20170358517 - MATSUBARA; Yoshihisa | 2017-12-14 |
Semiconductor device
Grant 9,837,335 - Matsubara December 5, 2 | 2017-12-05 |
Semiconductor Device
App 20170170095 - MATSUBARA; Yoshihisa | 2017-06-15 |
Semiconductor Device And Manufacturing Method Thereof
App 20160218060 - MATSUBARA; Yoshihisa ; et al. | 2016-07-28 |
Semiconductor device and manufacturing method of the semiconductor device
Grant 9,035,404 - Matsubara May 19, 2 | 2015-05-19 |
Semiconductor Device Including Copper Wiring And Via Wiring Having Length Longer Than Width Thereof And Method Of Manufacturing The Same
App 20140306345 - Matsubara; Yoshihisa | 2014-10-16 |
Semiconductor device including copper wiring and via wiring having length longer than width thereof and method of manufacturing the same
Grant 8,802,562 - Matsubara August 12, 2 | 2014-08-12 |
Semiconductor Device And Manufacturing Method Of The Semiconductor Device
App 20140103475 - Matsubara; Yoshihisa | 2014-04-17 |
Semiconductor device and manufacturing method of the semiconductor device
Grant 8,664,010 - Matsubara March 4, 2 | 2014-03-04 |
Semiconductor Device Including Copper Wiring And Via Wiring Having Length Longer Than Width Thereof And Method Of Manufacturing The Same
App 20140057432 - MATSUBARA; Yoshihisa | 2014-02-27 |
Semiconductor device
Grant 8,598,704 - Matsubara December 3, 2 | 2013-12-03 |
Semiconductor device
Grant 8,598,703 - Matsubara December 3, 2 | 2013-12-03 |
Helicopter
Grant D692,797 - Ohnishi , et al. November 5, 2 | 2013-11-05 |
Semiconductor device, method of manufacturing the same, and method of designing the same
Grant 8,519,389 - Matsubara August 27, 2 | 2013-08-27 |
Semiconductor Device
App 20130127068 - MATSUBARA; Yoshihisa | 2013-05-23 |
Semiconductor integrated circuit and method for manufacturing same, and mask
Grant 8,278,760 - Matsubara October 2, 2 | 2012-10-02 |
Semiconductor device and method of manufacturing the same
Grant 8,193,582 - Matsubara June 5, 2 | 2012-06-05 |
Displacement detection pattern for detecting displacement between wiring and via plug, displacement detection method, and semiconductor device
Grant 8,102,053 - Matsubara January 24, 2 | 2012-01-24 |
Semiconductor Device, Method Of Manufacturing The Same, And Method Of Designing The Same
App 20120012843 - MATSUBARA; Yoshihisa | 2012-01-19 |
Method For Manufacturing A Semiconductor Device
App 20110263113 - MATSUBARA; Yoshihisa ; et al. | 2011-10-27 |
Semiconductor device
App 20110254174 - Matsubara; Yoshihisa | 2011-10-20 |
Semiconductor device and manufacturing method of the semiconductor device
App 20110241142 - Matsubara; Yoshihisa | 2011-10-06 |
Semiconductor device
Grant 7,989,952 - Matsubara August 2, 2 | 2011-08-02 |
Semiconductor device and process for manufacturing same
Grant 7,986,012 - Matsubara , et al. July 26, 2 | 2011-07-26 |
Semiconductor device, wafer and method of designing and manufacturing the same
Grant 7,838,408 - Matsubara , et al. November 23, 2 | 2010-11-23 |
Semiconductor integrated circuit device featuring processed minimum circuit pattern, and design method therefor
Grant 7,831,939 - Matsubara November 9, 2 | 2010-11-09 |
Method of manufacturing semiconductor device
Grant 7,785,986 - Matsubara , et al. August 31, 2 | 2010-08-31 |
Semiconductor device
Grant 7,692,306 - Matsubara April 6, 2 | 2010-04-06 |
Semiconductor device and method of manufacturing the same
App 20100006932 - Matsubara; Yoshihisa | 2010-01-14 |
Semiconductor device and method of manufacturing the same
Grant 7,645,692 - Matsubara , et al. January 12, 2 | 2010-01-12 |
Method for manufacturing semiconductor device including metal gate electrode and semiconductor device
App 20090321842 - Matsubara; Yoshihisa | 2009-12-31 |
Semiconductor device having function circuits selectively connected to bonding wire
App 20090302451 - Matsubara; Yoshihisa | 2009-12-10 |
Semiconductor device
App 20090230559 - Matsubara; Yoshihisa | 2009-09-17 |
Method Of Manufacturing Semiconductor Device
App 20090176333 - MATSUBARA; Yoshihisa ; et al. | 2009-07-09 |
Semiconductor Device And Process For Manufacturing Same
App 20090159978 - Matsubara; Yoshihisa ; et al. | 2009-06-25 |
Semiconductor device
Grant 7,538,428 - Matsubara May 26, 2 | 2009-05-26 |
Semiconductor Device And Manufacturing Method Thereof
App 20090085131 - MATSUBARA; Yoshihisa | 2009-04-02 |
Method of transporting semiconductor device and method of manufacturing semiconductor device
Grant 7,504,315 - Matsubara , et al. March 17, 2 | 2009-03-17 |
Method Of Manfacturing Semiconductor Device
App 20080285006 - MATSUBARA; Yoshihisa | 2008-11-20 |
Semiconductor Device, Wafer And Method Of Designing And Manufacturing The Same
App 20080274586 - Matsubara; Yoshihisa ; et al. | 2008-11-06 |
Displacement detection pattern for detecting displacement between wiring and via plug, displacement detection method, and semiconductor device
App 20080252306 - Matsubara; Yoshihisa | 2008-10-16 |
Semiconductor Device
App 20080211099 - MATSUBARA; Yoshihisa | 2008-09-04 |
Semiconductor device including copper wiring and via wiring having length longer than width thereof and method of manufacturing the same
App 20080197494 - Matsubara; Yoshihisa | 2008-08-21 |
Method Of Manufacturing Semiconductor Device
App 20080194096 - MATSUBARA; Yoshihisa | 2008-08-14 |
Semiconductor Integrated Circuit Device Featuring Processed Minimum Circuit Pattern, And Design Method Therefor
App 20080148207 - MATSUBARA; Yoshihisa | 2008-06-19 |
Semiconductor Device And Method Of Manufacturing The Same
App 20080121964 - MATSUBARA; Yoshihisa ; et al. | 2008-05-29 |
Semiconductor device having multilayer structure and method for manufacturing thereof
Grant 7,365,431 - Matsubara April 29, 2 | 2008-04-29 |
Semiconductor device, wafer and method of designing and manufacturing the same
Grant 7,332,753 - Matsubara , et al. February 19, 2 | 2008-02-19 |
Semiconductor device
App 20070249162 - Matsubara; Yoshihisa | 2007-10-25 |
Semiconductor device and method for manufacturing same
App 20070249157 - Matsubara; Yoshihisa | 2007-10-25 |
Semiconductor integrated circuit and method for manufacturing same, and mask
App 20070241329 - Matsubara; Yoshihisa | 2007-10-18 |
Semiconductor device, method of forming wiring pattern, and method of generating mask wiring data
App 20070096309 - Matsubara; Yoshihisa | 2007-05-03 |
Semiconductor device
App 20070096310 - Matsubara; Yoshihisa | 2007-05-03 |
Semiconductor device having multiple-layered interconnect
App 20070001309 - Matsubara; Yoshihisa | 2007-01-04 |
Semiconductor device having bonding pad above low-k dielectric film
Grant 7,148,575 - Matsubara December 12, 2 | 2006-12-12 |
Method for manufacturing semiconductor device, and processing system and semiconductor device
Grant 7,052,994 - Matsubara , et al. May 30, 2 | 2006-05-30 |
Semiconductor device, wafer and method of designing and manufacturing the same
App 20060071339 - Matsubara; Yoshihisa ; et al. | 2006-04-06 |
Wiring structure in a semiconductor device
Grant 6,936,926 - Matsubara , et al. August 30, 2 | 2005-08-30 |
Semiconductor device having multilayer structure and method for manufacturing thereof
App 20050179134 - Matsubara, Yoshihisa | 2005-08-18 |
Semiconductor device having bonding pad above low-k dielectric film and manufacturing method therefor
App 20050173806 - Matsubara, Yoshihisa | 2005-08-11 |
Method of transporting semiconductor device and method of manufacturing semiconductor device
App 20050147488 - Matsubara, Yoshihisa ; et al. | 2005-07-07 |
Semiconductor device and manufacturing method of the same
Grant 6,890,852 - Matsubara May 10, 2 | 2005-05-10 |
Semiconductor apparatus of which reliability of interconnections is improved and manufacturing method of the same
Grant 6,861,759 - Matsubara , et al. March 1, 2 | 2005-03-01 |
Wiring structure in a semiconductor device
App 20040099956 - Matsubara, Yoshihisa ; et al. | 2004-05-27 |
Semiconductor device and manufacturing method of the same
App 20040053446 - Matsubara, Yoshihisa | 2004-03-18 |
Semiconductor apparatus of which reliability of interconnections is improved and manufacturing method of the same
App 20040000719 - Matsubara, Yoshihisa ; et al. | 2004-01-01 |
Wiring structure in a semiconductor device
App 20030160328 - Matsubara, Yoshihisa ; et al. | 2003-08-28 |
Method of making a semiconductor device with alloy film between barrier metal and interconnect
Grant 6,607,978 - Matsubara August 19, 2 | 2003-08-19 |
Semiconductor device
App 20030104690 - Matsubara, Yoshihisa | 2003-06-05 |
Semiconductor device and method of manufacturing interconnections thereof using copper and tungsten in predetermined ratios
Grant 6,555,911 - Matsubara , et al. April 29, 2 | 2003-04-29 |
Semiconductor device formed with metal wiring on a wafer by chemical mechanical polishing, and method of manufacturing the same
App 20030039845 - Iguchi, Manabu ; et al. | 2003-02-27 |
Semiconductor device and a manufacturing process therefor
Grant 6,514,853 - Matsubara February 4, 2 | 2003-02-04 |
Method of making a semiconductor device with alloy film between barrier metal and interconnect
App 20030003727 - Matsubara, Yoshihisa | 2003-01-02 |
Semiconductor device with alloy film between barrier metal and interconnect
Grant 6,492,735 - Matsubara December 10, 2 | 2002-12-10 |
Insulating film comprising amorphous carbon fluoride, a semiconductor device comprising such an insulating film, and a method for manufacturing the semiconductor device
Grant 6,372,628 - Matsubara , et al. April 16, 2 | 2002-04-16 |
Method for manufacturing a multilayer interconnection structure
App 20020009878 - Takewaki, Toshiyuki ; et al. | 2002-01-24 |
Semiconductor device and manufacturing method thereof
App 20020005587 - Ito, Nobukazu ; et al. | 2002-01-17 |
Semiconductor Device And Manufacturing Method Thereof
App 20010045655 - MATSUBARA, YOSHIHISA | 2001-11-29 |
Method for manufacturing semiconductor device, and processing system and semiconductor device
App 20010036736 - Matsubara, Yoshihisa ; et al. | 2001-11-01 |
Semiconductor device formed with metal wiring on a wafer by chemical mechanical polishing, and method of manufacturing the same
App 20010036737 - Iguchi, Manabu ; et al. | 2001-11-01 |
Method of forming multi-level copper interconnect with formation of copper oxide on exposed copper surface
Grant 6,309,970 - Ito , et al. October 30, 2 | 2001-10-30 |
Process for manufacturing semiconductor device and exposure mask
App 20010026906 - Matsubara, Yoshihisa ; et al. | 2001-10-04 |
Method for forming a refractory metal silicide layer
Grant 6,277,735 - Matsubara August 21, 2 | 2001-08-21 |
Apparatus for forming films of a semiconductor device, a method of manufacturing a semiconductor device, and a method of forming thin films of a semiconductor
Grant 6,149,730 - Matsubara , et al. November 21, 2 | 2000-11-21 |
Semiconductor device having amorphous carbon fluoride film of low dielectric constant as interlayer insulation material
Grant 6,104,092 - Matsubara , et al. August 15, 2 | 2000-08-15 |
Insulating film comprising amorphous carbon fluoride, a semiconductor device comprising such an insulating film
Grant 6,091,081 - Matsubara , et al. July 18, 2 | 2000-07-18 |
Method for forming interconnection structure
Grant 6,040,240 - Matsubara March 21, 2 | 2000-03-21 |
Method for producing a semiconductor device comprising a refractory metal silicide layer
Grant 5,883,003 - Matsubara March 16, 1 | 1999-03-16 |
Process for forming a planarized interlayer insulating film in a semiconductor device using a periodic resist pattern
Grant 5,580,826 - Matsubara , et al. December 3, 1 | 1996-12-03 |
Method for planarizing insulating film
Grant 5,569,618 - Matsubara October 29, 1 | 1996-10-29 |
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